Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

2004 ◽  
Author(s):  
Pradeep Lall ◽  
Nokibul Islam ◽  
Jeff Suhling
Keyword(s):  
Damage Mechanics ◽  
Printed Circuit Boards ◽  
Circuit Board ◽  
Thermal Dissipation ◽  
Automotive Application ◽  
Constitutive Behavior ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Plastic Ball ◽  
Metal Backing

In this study, the effect of metal-backed boards on the interconnect reliability has been evaluated. Previous studies on electronic reliability for automotive environments have addressed the damage mechanics of solder joints in plastic ball-grid arrays on non-metal backed substrates [Lall et. al 2003, Syed et. al 1996, Evans et. al 1997, Mawer et. al 1999] and ceramic BGAs on non-metal backed substrates [Darveaux et. al 1992, 1995, 2000]. Delamination of PCBs from metal backing has also been investigated. Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. Increased shock, vibration, and higher temperatures necessitate the fundamental understanding of damage mechanisms which will be active in these environments. Electronics typical of office benign environments uses FR-4 printed circuit boards. Automotive application typically use high glass-transition temperature laminates such as FR4-06 glass/epoxy laminate material (Tg = 164.9°C). In application environments, metal-backing of printed circuits boards is being targeted for thermal dissipation, mechanical stability and interconnections reliability. The test vehicle is a metal backed FR4-06 laminate. The printed circuit board has an aluminum metal backing, attached with pressure sensitive adhesive (PSA). Component architectures tested include – plastic ball grid array devices, C2BGA devices, QFN, and discrete resistors. Reliability of the component architectures has been evaluated for HASL. Crack propagation and intermetallic thickness data has been acquired as a function of cycle count. Reliability data has been acquired on all these architectures. Material constitutive behavior of PSA has been measured using uni-axial test samples. The measured constitutive behavior has been incorporated into non-linear finite element simulations. Predictive models have been developed for the dominant failure mechanisms for all the component architectures tested.

Reliability of BGA and CSP on Metal-Backed Printed Circuit Boards in Harsh Environments

2007 ◽  
Vol 129 (4) ◽  
pp. 382-390 ◽  
Author(s):  
Pradeep Lall ◽  
Nokibul Islam ◽  
John Evans ◽  
Jeff Suhling
Keyword(s):  
Printed Circuit Boards ◽  
Ball Grid Array ◽  
Circuit Boards ◽  
Automotive Applications ◽  
Electronic Components ◽  
Ball Grid Arrays ◽  
Printed Circuit ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Metal Backing

Increased use of sensors and controls in automotive applications has resulted in significant emphasis on the deployment of electronics directly mounted on the engine and transmission. Increased shock, vibration, and higher temperatures necessitate the fundamental understanding of damage mechanisms, which will be active in these environments. Electronics typical of office benign environments uses FR-4 printed circuit boards (PCBs). Automotive applications typically use high glass-transition temperature laminates such as FR4-06 glass∕epoxy laminate material (Tg=164.9°C). In application environments, metal backing of printed circuit boards is being targeted for thermal dissipation, mechanical stability, and interconnections reliability. In this study, the effect of metal-backed boards on the interconnect reliability has been evaluated. Previous studies on electronic reliability for automotive environments have addressed the damage mechanics of solder joints in plastic ball-grid arrays on non-metal-backed substrates (Lall et al., 2003, “Model for BGA and CSP in Automotive Underhood Environments,” Electronic Components and Technology Conference, New Orleans, LA, May 27–30, pp. 189–196;Syed, A. R., 1996, “Thermal Fatigue Reliability Enhancement of Plastic Ball Grid Array (PBGA) Packages,” Proceedings of the 1996 Electronic Components and Technology Conference, Orlando, FL, May 28–31, pp. 1211–1216;Evans et al., 1997, “PBGA Reliability for Under-the-Hood Automotive Applications,” Proceedings of InterPACK ’97, Kohala, HI, Jun. 15–19, pp. 215–219;Mawer et al., 1999, “Board-Level Characterization of 1.0 and 1.27mm Pitch PBGA for Automotive Under-Hood Applications,” Proceedings of the 1999 Electronic Components and Technology Conference, San Diego, CA, Jun. 1–4, pp. 118–124) and ceramic ball-grid arrays (BGAs) on non-metal-backed substrates (Darveaux, R., and Banerji, K., 1992, “Constitutive Relations for Tin-Based Solder Joints,” IEEE Trans-CPMT-A, Vol. 15, No. 6, pp. 1013–1024;Darveaux et al., 1995, “Reliability of Plastic Ball Grid Array Assembly,” Ball Grid Array Technology, Lau, J., ed., McGraw-Hill, New York, pp. 379–442;Darveaux, R., 2000, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation,” Proceedings of 50th ECTC, May, pp. 1048–1058). Delamination of PCBs from metal backing has also been investigated. The test vehicle is a metal-backed FR4-06 laminate. The printed circuit board has an aluminum metal backing, attached with pressure sensitive adhesive (PSA). Component architectures tested include plastic ball-grid array devices, C2BGA devices, QFN, and discrete resistors. Reliability of the component architectures has been evaluated for HASL. Crack propagation and intermetallic thickness data have been acquired as a function of cycle count. Reliability data have been acquired on all these architectures. Material constitutive behavior of PSA has been measured using uniaxial test samples. The measured constitutive behavior has been incorporated into nonlinear finite element simulations. Predictive models have been developed for the dominant failure mechanisms for all the component architectures tested.

Dielectric Breakdown in Printed Circuit Boards at Elevated Temperatures

1996 ◽  
Author(s):  
P. Singh ◽  
G.T. Galyon ◽  
J. Obrzut ◽  
W.A. Alpaugh
Keyword(s):  
Experimental Data ◽  
Thermal Degradation ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Elevated Temperatures ◽  
Dielectric Breakdown ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Data Matching

Abstract A time delayed dielectric breakdown in printed circuit boards, operating at temperatures below the epoxy resin insulation thermo-electrical limits, is reported. The safe temperature-voltage operating regime was estimated and related to the glass-rubber transition (To) of printed circuit board dielectric. The TG was measured using DSC and compared with that determined from electrical conductivity of the laminate in the glassy and rubbery state. A failure model was developed and fitted to the experimental data matching a localized thermal degradation of the dielectric and time dependency. The model is based on localized heating of an insulation resistance defect that under certain voltage bias can exceed the TG, thus, initiating thermal degradation of the resin. The model agrees well with the experimental data and indicates that the failure rate and truncation time beyond which the probability of failure becomes insignificant, decreases with increasing glass-rubber transition temperature.

scholarly journals A model for the reflection of terahertz signals from printed circuit board surfaces

2018 ◽  
Vol 10 (2) ◽  
pp. 179-186 ◽  
Author(s):  
Alexander Fricke ◽  
Mounir Achir ◽  
Philippe Le Bars ◽  
Thomas Kürner
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Simulated Annealing Algorithm ◽  
Specular Reflection ◽  
Circuit Board ◽  
Network Analyzer ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Propagation Modeling ◽  
Annealing Algorithm

AbstractBased on vector network analyzer Measurements, a model for the specular reflection behavior of printed circuit boards in the Terahertz range has been derived. It has been calibrated to suit the behavior of the measurements using a simulated annealing algorithm. The model has been tailored for integration to ray-tracing-based propagation modeling.

scholarly journals NotchPUF: Printed Circuit Board PUF Based on Microstrip Notch Filter

Cryptography ◽  
2020 ◽  
Vol 4 (2) ◽  
pp. 11
Author(s):  
Mitchell Martin ◽  
Jim Plusquellic
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Statistical Tests ◽  
Notch Filter ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
In Series ◽  
Commercial Off The Shelf ◽  
Using Data

Physical Unclonable Functions (PUFs) are primitives that are designed to leverage naturally occurring variations to produce a random bitstring. Current PUF designs are typically implemented in silicon or utilize variations found in commercial off-the-shelf (COTS) parts. Because of this, existing designs are insufficient for the authentication of Printed Circuit Boards (PCBs). In this paper, we propose a novel PUF design that leverages board variations in a manufactured PCB to generate unique and stable IDs for each PCB. In particular, a single copper trace is used as a source of randomness for bitstring generation. The trace connects three notch filter structures in series, each of which is designed to reject specific but separate frequencies. The bitstrings generated using data measured from a set of PCBs are analyzed using statistical tests to illustrate that high levels of uniqueness and randomness are achievable.

Downsizing an automotive junction box based on large current-carrying printed-circuit board optimization

2016 ◽  
Vol 231 (2) ◽  
pp. 267-278 ◽  
Author(s):  
Hansang Lim ◽  
Do-Hwan Jung ◽  
Geono Kwon ◽  
Young Jong Lee ◽  
Jun Seo Park
Keyword(s):  
Power Distribution ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Installation Space ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Overcurrent Protection ◽  
Large Current ◽  
Analytical Estimation

An automotive junction box distributes electric power to electric systems installed in a vehicle with overcurrent protection. As a larger number of electric systems are installed, the junction box is equipped with more components, functionalities and connections. However, owing to the fuse accessibility, its installation space is so restricted that a downsized design is required for the junction box. The junction box is composed of small signal circuitry for control and monitoring, and large current-carrying circuitry for power distribution which includes many parallel traces. Because of these unique features, widely used techniques for downsizing printed-circuit boards are not applicable. Also, there is no rule for designing large current-carrying parallel traces, and it is difficult to optimize the size of the printed-circuit board for the automotive junction box. This paper presents the design rules for a printed-circuit board when downsizing a junction box. First, the layout strategy for the power distribution components is presented, which is determined by the sum of the squares of the currents flowing through connector pairs. Then, the thermal effects of parallel traces are simulated for different conditions by using thermal analysis software. Based on the results, an analytical estimation of the additional temperature rises due to parallel traces and rules for a thermally effective arrangement of the parallel traces are presented.

scholarly journals Separation and Recovery of Fine Particles from Waste Circuit Boards Using an Inflatable Tapered Diameter Separation Bed

2014 ◽  
Vol 2014 ◽  
pp. 1-7 ◽  
Author(s):  
Chenlong Duan ◽  
Cheng Sheng ◽  
Lingling Wu ◽  
Yuemin Zhao ◽  
Jinfeng He ◽  
...  
Keyword(s):  
Environmental Pollution ◽  
Printed Circuit Boards ◽  
Fine Particles ◽  
Metal Recovery ◽  
Circuit Board ◽  
Circuit Boards ◽  
Recovery Rates ◽  
Operational Conditions ◽  
Printed Circuit ◽  
Wide Range

Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (−0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed’s fluid flow field. For 0.5–0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25–0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (−0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution.

Future paper based printed circuit boards for green electronics: fabrication and life cycle assessment

2014 ◽  
Vol 7 (11) ◽  
pp. 3674-3682 ◽  
Author(s):  
Jingping Liu ◽  
Cheng Yang ◽  
Haoyi Wu ◽  
Ziyin Lin ◽  
Zhexu Zhang ◽  
...  
Keyword(s):  
Life Cycle Assessment ◽  
Life Cycle ◽  
Environmental Impact ◽  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Future Paper ◽  
Printing Paper

A multilayer printed circuit board (PCB) can be fabricated using commercially available printing paper, which shows comparable functionalities with the conventional organic PCBs but 100 times lower environmental impact.

New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules

Circuit World ◽  
2015 ◽  
Vol 41 (3) ◽  
pp. 121-124
Author(s):  
Wojciech Stęplewski ◽  
Mateusz Mroczkowski ◽  
Radoslav Darakchiev ◽  
Konrad Futera ◽  
Grażyna Kozioł
Keyword(s):  
Printed Circuit Boards ◽  
New Technologies ◽  
Circuit Board ◽  
Circuit Boards ◽  
Content Type ◽  
Signal Distribution ◽  
Printed Circuit ◽  
Rapid Design ◽  
Small Pitch ◽  
Signal Path

Purpose – The purpose of this study was the use of embedded components technology and innovative concepts of the printed circuit board (PCB) for electronic modules containing field-programmable gate array (FPGA) devices with a large number of pins (e.g. Virtex 6, FF1156/RF1156 package, 1,156 pins). Design/methodology/approach – In the multi-layered boards, embedded passive components that support FPGA device input/output (I/O), such as blocking capacitors and pull-up resistors, were used. These modules can be used in rapid design of electronic devices. In the study, the MC16T FaradFlex material was used for the inner capacitive layer. The Ohmega-Ply RCM 25 Ω/sq material was used to manufacture pull-up resistors for high-frequency pins. The embedded components have been connected to pins of the FPGA component by using plated-through holes for capacitors and blind vias for resistors. Also, a technique for a board-to-board joining, by using castellated terminations, is described. Findings – The fully functional modules for assembly of the FPGA were manufactured. Achieved resistance of embedded micro resistors, as small as the smallest currently used surface-mount device components (01005), was below required tolerance of 10 per cent. Obtained tolerance of capacitors was less than 3 per cent. Use of embedded components allowed to replace the pull-up resistors and blocking capacitors and shortens the signal path from the I/O of the FPGA. Correct connection to the castellated terminations with a very small pitch was also obtained. This allows in further planned studies to create a full signal distribution system from the FPGA without the use of unreliable plug connectors in aviation and space technology. Originality/value – This study developed and manufactured several innovative concepts of signal distribution from printed circuit boards. The signal distribution solutions were integrated with embedded components, which allowed for significant reduction in the signal path. This study allows us to build the target object that is the module for rapid design of the FPGA device. Usage of a pre-designed module would lessen the time needed to develop a FPGA-based device, as a significant part of the necessary work (mainly designing the signal and power fan-out) will already be done during the module development.

Advanced Materials for Printed Circuit Boards

1987 ◽  
Vol 108 ◽  
Author(s):  
David Wei Wang
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
High Reliability ◽  
Circuit Board ◽  
Advanced Materials ◽  
Impregnation Method ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Worldwide Production ◽  
Board Industry

The printed circuit board is an integral part of the electronic packaging hierarchy. Its use began more than 40 years ago, and the demand for printed circuit boards has increased in parallel with the growth of the electronics industry.[1] According to a recent forecast, the worldwide production of printed circuit boards will reach to over 19 billion U.S. dollars' worth by 1990.[2] With continuing demands for more interconnections, the multilayer circuit board industry is experiencing its fastest growth rate. Boards with more than 20 inner planes of circuitry are being manufactured with high reliability.Based on dollar values, more than 90% of the circuit boards produced are in the rigid board category, where starting materials are based on thermosetting prepregs produced by a solution impregnation method. This article is a review of materials currently used in rigid composites.

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