Forced Response and Random Vibration Analysis of Printed Circuit Boards

2000 ◽  
Author(s):  
James F. Tarter
Keyword(s):  
Random Vibration ◽  
Printed Circuit Boards ◽  
Random Excitation ◽  
Forced Response ◽  
Circuit Boards ◽  
Element Analysis ◽  
Design Data ◽  
Improve Design ◽  
Printed Circuit ◽  
Contour Plots

Abstract Finite element analysis has been used in conjunction with developed algorithms to analyze forced response and random vibration response of printed circuit boards. Analytical predictions have been compared to random vibration test data for model correlation and validation of the analysis methods. The described methods provide design data for predicting deflections and G levels as a function of frequency or predicting RMS levels for random excitation. These data are utilized for initiating design changes and guiding component placement. Deflection versus frequency contributions for random excitation are analyzed to identify critical design frequencies. Forced response contour plots include effects of modal coupling, modal participation factors, and system damping. These data provide a better description of the expected operating deflection shapes man a simple mode shape. All of these methods are used to improve design integrity and ensure specification compliance prior to hardware fabrication. The analyses utilize aggregate board properties, and do not currently provide data for individual components which are installed on the board.

Improving the efficiency of cyclic devices for collecting and processing information in monitoring and vibration diagnostics systems

2017 ◽  
Vol 11 (1) ◽  
pp. 81-94 ◽  
Author(s):  
A. P. Moroz ◽  
T. S. Abbasova ◽  
M. E. Stavrovsky
Keyword(s):  
Random Vibration ◽  
Printed Circuit Boards ◽  
Monitoring Systems ◽  
Circuit Boards ◽  
Vibration Diagnostics ◽  
Printed Circuit ◽  
Impact Processes ◽  
Collection Device ◽  
Processing Information ◽  
Operation Characteristics

Identified the problem of increasing the efficiency of the collection device and the processing of information in telemetry monitoring systems and vibration diagnostics. The possibilities of CAD-programs for the calculation of vibro-impact processes and random vibration devices and printed circuit boards. A study of the frequency and random vibration study on the example of the PCB in SolidWorks environment. Abstract purpose, principle of operation, characteristics of the onboard telemetry information «Pyrite» system for measuring the parameters of aircraft, which are characterized by different phases and the duration of the flight telemetered site; It shows that the «Pyrite» equipment can be effectively used for the integrated telemetry information slowly evolving processes and rapidly changing processes of aircraft.

Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

1996 ◽  
Vol 118 (2) ◽  
pp. 87-93
Author(s):  
K. X. Hu ◽  
Y. Huang ◽  
C. P. Yeh ◽  
K. W. Wyatt
Keyword(s):  
Stress Analysis ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Effective Properties ◽  
Mechanical Analysis ◽  
Computational Effort ◽  
Circuit Boards ◽  
Element Analysis ◽  
Printed Circuit ◽  
Board Level

The single most difficult aspect for thermo-mechanical analysis at the board level lies in to an accurate accounting for interactions among boards and small features such as solder joints and secondary components. It is the large number of small features populated in a close neighborhood that proliferates the computational intensity. This paper presents an approach to stress analysis for boards with highly populated small features (solder joints, for example). To this end, a generalized self-consistent method, utilizing an energy balance framework and a three-phase composite model, is developed to obtain the effective properties at board level. The stress distribution inside joints and components are obtained through a back substitution. The solutions presented are mostly in the closed-form and require a minimum computational effort. The results obtained by present approach are compared with those by finite element analysis. The numerical calculations show that the proposed micromechanics approach can provide reasonably accurate solutions for highly populated printed circuit boards.

Dynamic Response Characteristics and Fatigue Life Prediction of Printed Circuit Boards for Random Vibration Environments

2020 ◽  
Vol 20 (3) ◽  
pp. 920-929
Author(s):  
S. G. S. Karthiheyan ◽  
Virendra Kumar Verma ◽  
S. Saravanan ◽  
Venkateshwaran Pappiah Ayyappan ◽  
Karthik Sathiyaseelan ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Dynamic Response ◽  
Life Prediction ◽  
Random Vibration ◽  
Printed Circuit Boards ◽  
Fatigue Life Prediction ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Response Characteristics ◽  
Dynamic Response Characteristics

Analysis of Solderless Press-Fit Interconnections During the Assembly Process

2008 ◽  
Vol 130 (3) ◽  
Author(s):  
Hironori Tohmyoh ◽  
Kiichiro Yamanobe ◽  
Masumi Saka ◽  
Jiro Utsunomiya ◽  
Takeshi Nakamura ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Small Scale ◽  
Assembly Process ◽  
Circuit Boards ◽  
Element Analysis ◽  
Plastic Properties ◽  
Printed Circuit ◽  
Elastic Plastic ◽  
Press Fit ◽  
The Press

This paper deals with typical mechanical problems that are encountered in a solderless press-fit assembly process. First, the elastic-plastic properties of two types of press-fit pins and the friction coefficients of the pins in thin plated through holes are determined both experimentally and by three-dimensional finite element analysis. The elastic-plastic properties of the press-fit pins are determined by small-scale testing under three-point bending. The coefficients of friction of the pins in the through holes are successfully determined from the load-displacement relationships of the pins during press-fit assembly processes. The validity of the parameters that are determined is clarified by inserting the press-fit pins into holes of different diameters. By comparing the damaged areas of the printed circuit boards after assembly and the numerically obtained stress distributions, the failure stress of the boards is determined. Finally, both the retention force of the pins and the degree of damage to the printed circuit boards after assembly are predicted by numerical analysis.

Finite Element Analysis of Printed Circuit Boards Using Isotropic Elastoplastic Model and Application to Drop Simulation for Mobile Phone

2012 ◽  
Author(s):  
Hojin Jeon ◽  
Myunghyun Park ◽  
Hyongwon Seo ◽  
Myunghan Kim ◽  
Yonghee Lee
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Mobile Phone ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Flexural Test ◽  
Elastoplastic Model ◽  
Element Analysis ◽  
Element Modeling ◽  
Printed Circuit

Flexural behavior of printed circuit boards (PCB) is well known for the major failure mechanism under board level or product level mobile phone drop tests. This behavior induces high peeling stress between PCB and IC package. This stress causes failure including both solder joint crack and pad cratering, which leads to malfunction such as phone dead or power off. Therefore, for a more reliable mobile phone design, it is important to accurately predict behavior of the PCB. In the past, isotropic or orthogonal linear elastic model have been used for simulating PCB in finite element analysis. Also, since PCB consists of multiple layers with woven glass fiber epoxy resin composite (FR-4) and copper foils, a multilayered PCB model was developed in order to consider material properties that change along the different plies. In this paper, the isotropic elastoplastic model was employed in order to efficiently predict behavior of PCB. Tensile and flexural test of PCB were conducted initially to evaluate mechanical characteristics and obtain representative material properties. Then, simulation of flexural test was performed to develop the finite element modeling. Finally, a drop test of mobile phone adopted with PCB bare board, which did not include IC packages, was examined. Also, the strain gage was used for measuring strain of PCB. This result was compared with drop simulation results of mobile phone, which used finite element modeling suggested. In conclusion, from an industry standpoint, finite element modeling of PCB using isotropic elasoplastic model was useful and efficient.

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