Experimental Investigation of Thermal Management of Tablet Computers Using Phase Change Materials (PCMs)

Author(s):  
Tousif Ahmed ◽  
Maha Bhouri ◽  
Samer Kahwaji ◽  
Dominic Groulx ◽  
Mary Anne White

This paper presents a study of thermal management of tablet computers (tablet PCs) using phase change materials (PCMs) encapsulated in aluminized laminated film under continuous operation. The experimental setup consists of original tablet PC parts and a simplified dummy printed circuit board (PCB) with a thermal response similar to the original PCB. Two PCMs were used in the experiments, n-eicosane and PT-37 (a commercial PCM from PureTemp). These PCMs have similar melting temperatures (n-eicosane – 35.6 °C; PT-37 – 36.3 °C) but different latent heats of fusion (n-eicosane – 236 kJ/kg; PT-37 – 206 kJ/kg). Two encapsulations with different sizes (6″ × 2.6″, 7″ × 1.5″) but the same thickness (0.0792″ (2 mm)) were used in this study. The effects of inclination and power input level on the thermal behavior of the tablet were investigated. Experiments showed that PCM encapsulated in laminate film led to lower back cover temperature for constant heat flux applications. As much as a 20 °C temperature reduction of the back cover hotspot was achieved with encapsulated PCM. It was also observed that better thermal behavior was achieved both by the melting of PCMs and heat spreading through the laminate film. It was found that the rate of PCM melting is directly related to the power input. No significant effect on PCM melting and temperature history was observed in relation to the system inclination.

2013 ◽  
Vol 113 ◽  
pp. 195-200 ◽  
Author(s):  
Yajuan Zhong ◽  
Mi Zhou ◽  
Fuqiang Huang ◽  
Tianquan Lin ◽  
Dongyun Wan

2019 ◽  
Vol 9 (5) ◽  
pp. 902 ◽  
Author(s):  
Tousif Ahmed ◽  
Maha Bhouri ◽  
Dominic Groulx ◽  
Mary White

This paper presents an experimental study of thermal management in a tablet PC under intermittent operation, with phase change materials (PCMs) encapsulated in a very thin aluminized laminate film container. It complements a study of the same system under continuous operation that was published in 2018. Two different types of PCMs were used for the experimental work; PT-37 and n-eicosane. A commercially available tablet PC was used as a test subject to ensure representative dimensions and material properties of every intricate part of the real tablet PC. For intermittent operation, the cycle used corresponds to fifteen minutes of operation (heat generation) followed by fifteen minutes of rest, to imitate a regular usage pattern of a tablet PC. It was observed that thin PCM thermal energy storage (TES) units are capable of providing a reduction in the rate of temperature increase during transient operations for both the electronics and the tablet cover. Reduction in peak temperature of the heat source and external surfaces of the tablet PC was also observed. At the maximum of 8 W operating power, PCMs were able to reduce the back-cover temperature by 20 °C. At all power inputs, heat storage in PCMs resulted in back-cover temperatures lower than 40 °C. Moreover, it was found that the PCM thermal management system tested was not affected by the inclination of the tablet PC. Results obtained from this study confirm that thin PCM encapsulation is indeed a suitable solution to control the temperature in tablet PCs during intermittent operation.


Proceedings ◽  
2020 ◽  
Vol 63 (1) ◽  
pp. 41
Author(s):  
Hanae El Fakiri ◽  
Lahoucine Ouhsaine ◽  
Abdelmajid El Bouardi

The thermal dynamic behavior of buildings represents an important aspect of the energy efficiency and thermal comfort of the indoor environment. For this, phase change material (PCM) wallboards integrated into building envelopes play an important role in stabilizing the temperature of the human comfort condition. This article provides an assessment of the thermal behavior of a “bi-zone” building cell, which was built based on high-energy performance (HEP) standards and heated by a solar water heater system through a hydronic circuit. The current study is based on studying the dynamic thermal behavior, with and without implantation of PCMs on envelope structure, using a simplified modeling approach. The evolution of the average air temperature was first evaluated as a major indicator of thermal comfort. Then, an evaluation of the thermal behavior’s dynamic profile was carried out in this study, which allowed for the determination of the PCM rate anticipation in the thermal comfort of the building cell.


Author(s):  
Giulia Righetti ◽  
Claudio Zilio ◽  
Luca Doretti ◽  
Giovanni A. Longo ◽  
Simone Mancin

Heliyon ◽  
2021 ◽  
pp. e07773
Author(s):  
Danial Karimi ◽  
Md Sazzad Hosen ◽  
Hamidreza Behi ◽  
Sahar Khaleghi ◽  
Mohsen Akbarzadeh ◽  
...  

RSC Advances ◽  
2017 ◽  
Vol 7 (68) ◽  
pp. 42909-42918 ◽  
Author(s):  
Ziyuan Wang ◽  
Xinxi Li ◽  
Guoqing Zhang ◽  
Youfu Lv ◽  
Cong Wang ◽  
...  

In battery thermal cycle tests PCM 3 prolonged the service life of PCM because the epoxy can effectively prevent leakage of paraffin during phasing change.


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