Effect of Heater Size on Confined Subcooled Jet Impingement Boiling

Author(s):  
S. Abishek ◽  
R. Narayanaswamy ◽  
V. Narayanan

Jet impingement boiling heat transfer is a potential technique for the removal of very high heat fluxes concentrated at discrete locations, such as in power electronic components. In the present research, the effect of heater-nozzle size ratio (in the range 0.5 ≤ wH/wN ≤ 11) on jet impingement boiling is studied numerically. A steady-state submerged and confined subcooled jet impingement boiling of de-ionized and degassed water (at atmospheric pressure) on a polished isothermal heater surface is considered for a jet Reynolds number of Rew = 2500 and 20°C subcooling. The RPI wall boiling closure is used for the partition of heat flux on the surface into liquid phase, evaporation and quenching. Turbulence is modeled using the RNG-k-ε mixture model. The flow and heat transfer is simulated by considering the liquid and vapor phase to be an Euler-Euler interpenetrating continua; the interfacial momentum transfer is modelled using appropriate correlations for interphase momentum, heat and mass transfers. Validation of the numerical approach was performed by comparison of the present results with experimental data from literature for axisymmetric as well as slot jets. It was found that for any prescribed wall superheat, the heat flux was consistently larger for relatively smaller heaters (or smaller wH/wN). However, for any given wall superheat, the heat flux stagnated at an apparent asymptotic limit with increase in heater size, and this asymptotic limit was larger for larger wall superheats. It was also found that the quenching heat flux was the largest contributor to the total heat flux at relatively large degrees of superheat irrespective of heater-nozzle size ratio. A correlation is also developed for the heat flux as a function of the heater size and degree of superheat, for a given set of other controlling parameters.

2011 ◽  
Vol 134 (2) ◽  
Author(s):  
Ruander Cardenas ◽  
Vinod Narayanan

An experimental study of jet impingement boiling is presented for water under saturated and subcooled conditions. Unique to this study is the documentation of boiling curves of a submerged water jet under subatmospheric conditions. Data are reported at a fixed nondimensional nozzle-to-surface distance of H/dj = 6 and for a fixed surface-to-nozzle diameter ratio, dsurf/dj, of 23.8. Saturated jet impingement experiments are performed at three subatmospheric pool pressures of 0.176 bar, 0.276 bar, and 0.478 bar with corresponding saturation temperatures of 57.3 °C, 67.2 °C, and 80.2 °C. At each pressure, jet impingement boiling at varying Reynolds numbers are characterized and compared with pool boiling heat transfer. The effect of surface roughness and fluid subcooling is studied at the lowest pressure of 0.176 bar. Boiling curves indicate a strong dependence of heat flux on jet Reynolds number in the partially developed nucleate boiling region but only a weak dependence in the fully developed nucleate boiling region. At a fixed wall superheat, fluid subcooling is found to shift the boiling curve to the left thereby enhancing heat transfer performance. Critical heat flux is found to increase with increases in pressure, surface roughness, and Reynolds number.


Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.


Author(s):  
A. E. Bergles

During the past 20 years, there has been intense worldwide interest in microchannel heat exchangers, particularly for cooling of microelectronic components. Saturated boiling of the coolant is usually indicated in order to accommodate high heat fluxes and to have uniformity of temperature. However, boiling is accompanied by several instabilities, the most severe of which can sharply limit the maximum, or critical, heat flux. These stability phenomena are reviewed, and recent studies will be discussed. Elevation of the critical heat flux will be discussed within the context of heat transfer enhancement. Means to improve the stability of boiling and the enhancement of boiling heat transfer, in general, are discussed.


Author(s):  
Preeti Mani ◽  
Ruander Cardenas ◽  
Vinod Narayanan

Submerged jet impingement boiling has the potential to enhance pool boiling heat transfer rates. In most practical situations, the surface could consist of multiple heat sources that dissipate heat at different rates resulting in a surface heat flux that is non-uniform. This paper discusses the effect of submerged jet impingement on the wall temperature characteristics and heat transfer for a non-uniform heat flux. A mini-jet is caused to impinge on a polished silicon surface from a nozzle having an inner diameter of 1.16 mm. A 25.4 mm diameter thin-film circular serpentine heater, deposited on the bottom of the silicon wafer, is used to heat the surface. Deionized degassed water is used as the working fluid and the jet and pool are subcooled by 20°C. Voltage drop between sensors leads drawn from the serpentine heater are used to identify boiling events. Heater surface temperatures are determined using infrared thermography. High-speed movies of the boiling front are recorded and used to interpret the surface temperature contours. Local heat transfer coefficients indicate significant enhancement upto radial locations of 2.6 jet diameters for a Reynolds number of 2580 and upto 6 jet diameters for a Reynolds number of 5161.


1969 ◽  
Vol 91 (1) ◽  
pp. 27-36 ◽  
Author(s):  
B. S. Shiralkar ◽  
Peter Griffith

At slightly supercritical pressure and in the neighborhood of the pseudocritical temperature (which corresponds to the peak in the specific heat at the operating pressure), the heat transfer coefficient between fluid and tube wall is strongly dependent on the heat flux. For large heat fluxes, a marked deterioration takes place in the heat transfer coefficient in the region where the bulk temperature is below the pseudocritical temperature and the wall temperature above the pseudocritical temperature. Equations have been developed to predict the deterioration in heat transfer at high heat fluxes and the results compared with previously available results for steam. Experiments have been performed with carbon dioxide for additional comparison. Limits of safe operation for a supercritical pressure heat exchanger in terms of the allowable heat flux for a particular flow rate have been determined theoretically and experimentally.


Author(s):  
Ankit Kalani ◽  
Satish G. Kandlikar

Flow boiling with microchannel can dissipate high heat fluxes at low surface temperature difference. A number of issues, such as instabilities, low critical heat flux (CHF) and low heat transfer coefficients, have prevented it from reaching its full potential. A new design incorporating open microchannels with uniform and tapered manifold (OMM) was shown to mitigate these issues successfully. Distilled, degassed water at 80 mL/min is used as the working fluid. Plain and open microchannel surfaces are used as the test sections. Heat transfer and pressure drop performance for uniform and tapered manifold with both the surfaces are discussed. A low pressure drop of 7.5 kPa is obtained with tapered manifold and microchannel chip at a heat flux of 263 W/cm2 without reaching CHF. The pressure drop data is further compared with the homogenous model and the initial results are presented.


1980 ◽  
Vol 102 (1) ◽  
pp. 26-31 ◽  
Author(s):  
Salim Yilmaz ◽  
J. W. Westwater

Measurements were made of the heat transfer to Freon-113 at near atmospheric pressure, boiling outside a 6.5 mm dia horizontal steam-heated copper tube. Tests included pool boiling and also forced flow vertically upward at uelocities of 2.4, 4.0 and 6.8 m/s. The metal-to-liquid ΔT ranged from 13 to 125° C, resulting in nucleate, transition, and film boiling. The boiling curves for different velocities did not intersect or overlap, contrary to some prior investigators. The peak heat flux was proportional to the square root of velocity, agreeing with the Vliet-Leppert correlation, but disagreeing with the Lienhard-Eichhorn prediction of an exponent of 0.33. The forced-flow nucleate boiling data were well correlated by Rohsenow’s equation, except at high heat fluxes. Heat fluxes in film boiling were proportional to velocity to the exponent 0.56, close to the 0.50 value given by Bromley, LeRoy, and Robbers. Transition boiling was very sensitive to velocity; at a ΔT of 55° C the heat flux was 900 percent higher for a velocity of 2.4 m/s than for zero velocity.


Author(s):  
Aleksander Vadnjal ◽  
Ivan Catton

The evaporator of a heat exchanger is made with a porous, capillary, structure. In the past researchers [7] noticed that the heat flux limits of a bi-porous capillary structure is much greater than that of a mono-porous capillary structure and will be the focus of this work. There are three distinct stages in the heat transfer process in a bi-porous wick. Each of the stages is explored in turn. In the first stage, heat is transferred from the wall across the saturated wick by pure conduction to the evaporating front located on the top of the bi-porous wick. When the boiling limit is reached, bubbles begin to nucleate and the second stage begins. The boiling becomes more and more intensive as the heat flux is increased until all of the liquid from big pores is evaporated, and only small pores remain wetted with liquid. The point reached here is called the capillary limit, which is basically the limit at which the capillary forces are still sufficient to provide the liquid for evaporation into the big pores. The modelling of the different thermal physical processes determining heat transfer within each of the three stages for a bi-porous heat wick are modelled and significant improvement in achievable heat flux is observed. Comparison with experiment is found to be reasonable. Optimal selection of the bi-porous wick characteristics is shown to yield very high heat fluxes.


2001 ◽  
Vol 124 (2) ◽  
pp. 383-390 ◽  
Author(s):  
H. Honda ◽  
H. Takamastu ◽  
J. J. Wei

Experiments were conducted to study the effects of micro-pin-fins and submicron-scale roughness on the boiling heat transfer from a silicon chip immersed in a pool of degassed and gas-dissolved FC-72. Square pin-fins with fin dimensions of 50×50×60μm3 (width×thickness×height) and submicron-scale roughness (RMS roughness of 25 to 32 nm) were fabricated on the surface of square silicon chip 10×10×0.5mm3 by use of microelectronic fabrication techniques. Experiments were conducted at the liquid subcoolings of 0, 3, 25, and 45 K. Both the micro-pin-finned chip and the chip with submicron-scale roughness showed a considerable heat transfer enhancement as compared to a smooth chip in the nucleate boiling region. The chip with submicron-scale roughness showed a higher heat transfer performance than the micro-pin-finned chip in the low-heat-flux region. The micro-pin-finned chip showed a steep increase in the heat flux with increasing wall superheat. This chip showed a higher heat transfer performance than the chip with submicron-scale roughness in the high-heat-flux region. The micro-pin-finned chip with submicron-scale roughness on it showed the highest heat transfer performance in the high-heat-flux region. While the wall superheat at boiling incipience was strongly dependent on the dissolved gas content, it was little affected by the liquid subcooling.


1994 ◽  
Vol 116 (3) ◽  
pp. 670-678 ◽  
Author(s):  
S. B. Memory ◽  
S. V. Chilman ◽  
P. J. Marto

Heat transfer measurements were made during nucleate boiling of R-113 from a bundle of 15 electrically heated, copper TURBO-B tubes arranged in an equilateral triangular pitch, designed to simulate a portion of a flooded evaporator. Five of the tubes that were oriented in a vertical array on the centerline of the bundle were each instrumented with six wall thermocouples. For increasing heat flux, the incipient boiling wall superheat of upper tubes decreased as lower tubes were activated. In the boiling region at low heat fluxes (≈ 1 kW/m2), the average bundle heat transfer coefficient was 4.6 times that obtained for a smooth tube bundle (under identical conditions) and 1.6 times greater than that obtained for a single TURBO-B tube; a similar bundle factor has been reported for a smooth tube bundle. At high heat fluxes (100 kW/m2), the average bundle heat transfer coefficient was 3.6 times that of a smooth tube bundle. Furthermore, there was still a significant bundle factor (1.22), contrary to a smooth tube bundle, where all effect of lower tubes was eliminated at high heat fluxes.


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