Computational Modeling of Vapor Chambers With Nanostructured Wicks

Author(s):  
E. Bozorg-Grayeli ◽  
C. Fang ◽  
A. Rogacs ◽  
K. Goodson

As the power and heat output of modern CPUs climb ever higher and the interest in compact, passively cooled devices grows, there is an urgent need for thinner and more effective vapor chamber technologies. Nanostructured wick technologies based on oxide and organic nanowires have been proposed as a method of improving heat pipe performance in such applications. This work performs finite difference simulations of a 2D heat pipe accounting for variable porosity in the wick. For heat fluxes of 10 and 100 W/cm2, we find that temperature difference between the evaporator and condenser regions decreases by 10%, which is promising for spreading thermal energy. We find that spatially varying porosity yields improvements in spreading heat throughout the entire wick region. Finally, we observe that boiling is depressed in the evaporator region. These results verify the benefits of nanostructured wicks. This simulation tool provides the groundwork for future studies of 3D flat package heat pipes.

2018 ◽  
Vol 7 (4.3) ◽  
pp. 350
Author(s):  
A. Kagramanyan ◽  
A. Onishchenko ◽  
J. Babichenko ◽  
A. Podoprigora

The article is devoted to the calculation of the thermal power of the Bullerjan stove according to a preconstructed model, which is realized in the 3D modeling environment of SolidWorks 2016. The thermophysical characteristics of the processes passing through the heat pipes of the Bullerjan stove were studied in detail. In the course of the work, the values of airflow velocity and temperature distribution, the temperature distribution of a solid, the surface of the heat pipe, that in the end allowed us to obtain the values of the heat output of the oven. The obtained data made it possible to determine the value of the heat output of the oven on the mode of smoldering wood and on the mode of flaming burning. The thermal power of a Bullerjan stove and in particular, its flow simulation module for modeling the flow of liquids and gases were obtained. 


2016 ◽  
Vol 139 (1) ◽  
Author(s):  
Brian Reding ◽  
Yiding Cao

Heat pipe technology offers a possible cooling technique for structures exposed to high heat fluxes, as in turbomachinery such as compressors and turbines. However, in its current configuration as single heat pipes, implementation of the technology is limited due to the difficulties in manufacturability and costs. Hence, a study to develop a new radially rotating (RR) heat pipe system was undertaken, which integrates multiple RR heat pipes with a common reservoir and interconnected braches for a more effective and practical solution to turbomachinery cooling. Experimental study has shown that the integration of multiple heat pipe branches with a reservoir at the top is feasible.


Author(s):  
Garrett A. Glover ◽  
Yongguo Chen ◽  
Annie Luo ◽  
Herman Chu

The current work is a survey of applied applications of passive 2-phase technologies, such as heat pipe and vapor chamber, in heat sink designs with thin base for electronic cooling. The latest improvements of the technologies and manufacturing processes allow achievable heat sink base thickness of 3 mm as compared to around 5 mm previously. The key technical challenge has been on maintaining structural integrity for adequate hollow space for the working fluid vapor in order to retain high performance while reducing the thickness of the overall vapor chamber or flattened heat pipe. Several designs of thin vapor chamber base heat sink and embedded heat pipe heat sink from different vendors are presented for a moderate power density application of a 60 W, 13.2 mm square heat source. Numerous works have been published by both academia and commercial applications in studying the fundamental science of passive 2-phase flow technologies; their performance has been compared to solid materials, like aluminum and copper. These works have established the merits of using heat pipes and vapor chambers in electronic cooling. The intent of this paper is to provide a methodical approach to help to accelerate the process in evaluating the arrays of different commercial designs of these devices in our product design cycle. In this paper, the trade-offs between the different types of technologies are discussed for parameters such as performance advantages, physical attributes, and some cost considerations. This is a bake-off evaluation of the complete heat sink solutions from the various vendors and not a fundamental research of vapor chambers and heat pipes — for that, it is best left to the vendors and universities.


Author(s):  
Tien-Chien Jen ◽  
Rajendra Jadhav

Thermal management using heat pipes is gaining significant attention in past decades. This is because of the fact that it can be used as an effective heat sink in very intricate and space constrained applications such as in electronics cooling or turbine blade cooling where high heat fluxes are involved. Extensive research has been done in exploring various possible applications for the use of heat pipes as well as understanding and modeling the behavior of heat pipe under those applications. One of the possible applications of heat pipe technology is in machining operations, which involves a very high heat flux being generated during the chip generation process. Present study focuses on the thermal management of using a heat pipe in a drill for a drilling process. To check the feasibility and effectiveness of the heat pipe drill, structural and thermal analyses are performed using Finite Element Analysis. Finite Element Software ANSYS was used for this purpose. It is important for any conceptual design to be made practical and hence a parametric study was carried out to determine the optimum geometry size for the heat pipe for a specific standard drill.


2003 ◽  
Vol 125 (3) ◽  
pp. 378-385 ◽  
Author(s):  
Ravi S. Prasher

This paper introduces a simplified modeling scheme for the prediction of heat transport capability of heat pipes and vapor chambers. The modeling scheme introduced in this paper enables thermal designers to model heat pipes and vapor chambers in commercially available conduction modeling tools such as Ansys™ and IcePak™. This modeling scheme allows thermal designers to perform design sensitivity studies in terms of power dissipation of heat pipes and vapor chambers for different scenarios such as configurations, heat sink resistance for a given temperature drop between the heating source and the ambient. This paper also discusses how thermal designers can specify requirements to heat pipe/vapor chamber suppliers for their thermal design, without delving into the complete thermo-fluidic modeling of this technology.


1990 ◽  
Vol 112 (3) ◽  
pp. 602-607 ◽  
Author(s):  
B. R. Babin ◽  
G. P. Peterson

A computer model was developed to aid in the design of a flexible bellows heat pipe for cooling small discrete heat sources or arrays of small heat sources. This model was used to evaluate the operational characteristics and performance limitations of these heat pipes and to formulate and optimize a series of conceptual designs. Three flexible bellows heat pipes approximately 40 mm in length and 6 mm in diameter were constructed and tested using three different wick configurations. The test pipes were found to be boiling limited over most of the operating temperature range tested. Heat fluxes in excess of 200 W/cm2 were obtained and thermal resistance values of less than 0.7 °C/W were measured. Although the computer model slightly underestimated the experimentally determined transport limit for one of the wicking configurations, the remaining transport predictions were consistently within 8 percent of the experimental values.


Heat pipes are deliberated to be effective heat dissipation devices compared to other types of heat sinks due to their high effective thermal conductivity. Because of the flexibility in the design and layout of heat pipe turns along the heat source, pulsating heat pipes have gained popularity. One of the parameters that have the mainimpact on the presentation of CLPHP is the thermo physical properties of the working fluid. The properties of the working fluid affect the temperature difference between the evaporator and the condenser which in turn affect the thermal resistance of the CLPHP. In this connection, the influence of different working fluids is experimentally investigated on a two loop CLPHP, varying the evaporator heat flux. Pure fluids, viz., water, acetone, benzene and binary mixture, viz., Acetone-water and Benzene-water are utilized on working fluids. The heat input considered at the evaporator is 32W, 48W and 60W. The filling ratio is kept as 50 %. The results show that among the working fluids considered for the study, acetone exhibits least thermal resistance among the pure fluids at all heat fluxes considered in the analysis, while Acetone-water mixture has exhibited least thermal resistance among the water based mixtures.


1991 ◽  
Vol 113 (4) ◽  
pp. 995-1002 ◽  
Author(s):  
Y. Cao ◽  
A. Faghri

A numerical analysis of transient heat pipe performance including nonconventional heat pipes with nonuniform heat distributions is presented. A body-fitted grid system was applied to a three-dimensional wall and wick model, which was coupled with a transient compressible quasi-one-dimensional vapor flow model. The numerical results were first compared with experimental data from cylindrical heat pipes with good agreement. Numerical calculations were then made for a leading edge heat pipe with localized high heat fluxes. Performance characteristics different from conventional heat pipes are illustrated and some operating limits concerning heat pipe design are discussed.


Author(s):  
Kathryn Nikkanen ◽  
Christian G. Lu ◽  
Masahiro Kawaji

Improved miniaturization and a trend towards increasingly dense and compact architectures have led to unmanageably high heat fluxes in electronic components. In order to keep temperatures at operational levels more advanced cooling solutions are being required that go beyond the solid heat sink and forced convection. Pulsating heat pipes made out of multi port extrusion tubing are a proposed solution. Typically, gas-liquid slug flow occurs in the serpentine channel imbedded in the pulsating heat pipe. Vapour is produced in the heated section and condensed in the cooled section located at opposite ends of the heat pipe. In this work, experiments were conducted on four Multi-Port Extruded (MPE) aluminum tubing heat pipes with different internal structures: rectangular channel looped, rectangular channel unlooped, triangular channel looped, and triangular channel unlooped. The effect of changing the working fluid (ethanol or de-ionized water), fill ratio, and orientation were measured and compared for the different heat pipes. It was found that most of the heat pipes performed better with ethanol than de-ionized water. Only the looped rectangular channel heat pipe performed satisfactorily with de-ionized water, which is attributed both to the larger channel size and the looped architecture. The unlooped heat pipes performed best at the lowest fill ratios (10%) while the looped heat pipes showed their best performances between 30 and 50% with marked decrease at the lower and higher fill ratios. Both looped heat pipes performed poorly in horizontal orientation as compared to vertical, however, the unlooped heat pipes performed quite well in both orientations. This may be more the effect of the fill ratio on horizontal performance as literature suggests that horizontal orientation requires a lower fill ratio to perform satisfactorily.


2001 ◽  
Author(s):  
Ravi S. Prasher ◽  
James Shipley ◽  
Amit Devpura

Abstract This paper introduces a simplified modeling scheme for the prediction of heat transport capability of heat pipes and vapor chambers. The modeling scheme introduced in this paper enables thermal designers to model heat pipes and vapor chambers in commercially available conduction modeling tools such as Ansys™ and IcePak™. This modeling scheme allows thermal designers to perform design sensitivity studies in terms of power dissipation of heat pipes and vapor chambers for different scenarios such as configurations, heat sink resistance for a given temperature drop between the heating source and the ambient. This paper also discusses how thermal designers can specify requirements to heat pipe/vapor chamber suppliers for their thermal design, without delving into the complete thermofluidic modeling of this technology.


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