Reverse Monte Carlo Modeling of Signal Transport in Light-Pipe Radiation Thermometers

2008 ◽  
Author(s):  
Hakan Erturk ◽  
Ofodike A. Ezekoye ◽  
John R. Howell

Rapid thermal processing (RTP) has been widely used by the semiconductor manufacturing industry. Light-pipe radiation thermometers are the predominant method to monitor the wafer temperature during rapid thermal processing. The errors associated with light-pipe measurements are great concerns across the industry due the extreme temperature sensitivity of the processes used to fabricate semiconductor devices during rapid thermal processing. Modeling of the light-pipes has helped understand the signal transport process and errors associated with the light pipe measurements. However, due to the smaller size of the light-pipe sensor area with respect to the total system area full scale modeling of such a system including the light pipe thermometer have not been possible due to the computational demand. In this paper, a reverse Monte Carlo method is developed to model the signal transport through a light-pipe thermometer used in a RTP system. The Monte Carlo model considers the spectral and angle dependent optical properties of the chamber and quartz materials. The reverse Monte Carlo model is applied to a simpler system with a quartz light pipe probe for verification against a model developed using a forward Monte Carlo method.

Author(s):  
Hakan Erturk ◽  
John R. Howell

Light-pipe radiation thermometers are predominantly used to monitor wafer temperature during rapid thermal processing (RTP) of semiconductors. The processes used in fabrication of semiconductor devices during rapid thermal processing are extremely temperature sensitive and the errors associated with light-pipe measurements are great concerns across the industry. Modeling of the light-pipes has helped in understanding the signal transport process and errors associated with the light pipe measurements. However, due to the smaller size of the light-pipe sensor area with respect to the total system area, full scale modeling of such a system including the light pipe thermometer has not been possible due to the computational demand. In this paper, the reverse Monte Carlo method is used to model the signal transport through a light-pipe thermometer used in a RTP system. The Monte Carlo model considers the spectral and angular dependent optical properties of the chamber and quartz materials. The reverse Monte Carlo model is applied to the full scale instrumented system with characteristics of a RTP system with a quartz light pipe probe and the results are compared against previously published measurements from the same system.


1996 ◽  
Vol 429 ◽  
Author(s):  
J. C. Thomas ◽  
D. P. Dewitt

AbstractA Monte Carlo model is developed to simulate transient wafer heating as a function of system parameters in a kaleidoscope- or integrating light-pipe type cavity with square cross-section. Trends in wafer temperature uniformity are examined as a function of length-to-width ratio, cavity width, and the number of heating lamps. The effect on temperature determination by a radiometer placed in the bottom end wall of the cavity is simulated.


2000 ◽  
Author(s):  
Y. H. Zhou ◽  
Y. J. Shen ◽  
Z. M. Zhang ◽  
B. K. Tsai ◽  
D. P. DeWitt

Abstract This work employs a Monte Carlo method to study the radiative process in a rapid thermal processing (RTP) furnace. A “true” effective emissivity, accounting for the directional optical properties, is defined and predicted in order to determine the wafer temperature from the measured spectral radiance temperature using light-pipe radiation thermometry. The true effective emissivity is the same as the hemispherical effective emissivity for diffuse wafers, in which case the Monte Carlo model gives the same results as the net-radiation method. Deviations exist between the hemispherical effective emissivity and the true effective emissivity for specular wafers because the effective emissivity is directional dependent. This research will help reduce the uncertainty in the temperature measurement for RTP furnaces to meet the future requirements for integrated circuit manufacturing.


Langmuir ◽  
2006 ◽  
Vol 22 (24) ◽  
pp. 9942-9948 ◽  
Author(s):  
Surendra K. Jain ◽  
Roland J.-M. Pellenq ◽  
Jorge P. Pikunic ◽  
Keith E. Gubbins

Langmuir ◽  
2003 ◽  
Vol 19 (20) ◽  
pp. 8565-8582 ◽  
Author(s):  
Jorge Pikunic ◽  
Christian Clinard ◽  
Nathalie Cohaut ◽  
Keith E. Gubbins ◽  
Jean-Michel Guet ◽  
...  

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