Amplified Pressure Transducers Using SOI Sensors and SOI Electronics, Suitable for High Temperature Operation (250°C)

Author(s):  
Alex A. Ned ◽  
Wolf S. Landmann ◽  
Andrew Bemis ◽  
David S. Kerr

In an effort to improve efficiency, reliability and reduce costs, engineers are moving towards distributed control systems on trains, cars, planes and other systems in place of centralized control systems. In a distributed control system, sensors, processors and actuators are all located together at remote locations [1]. Distributed control systems require significantly less cabling which leads to weight reductions and therefore cost and energy savings. To implement distributed control, in many applications sensors and their electronics must be able to withstand higher temperatures. Kulite Semiconductor Products has therefore developed a high temperature amplifier to be coupled with high temperature pressure sensors. While the suitable sensing technologies have been under the development for some time, the development of an Application Specific Integrated circuit (ASIC) utilizing SOI technology is now introduced and optimized. This paper reports on the latest developments of the Silicon-On-Insulator (SOI) piezoresistive sensors, the SOI application specific integrated circuits (ASICs) and the high temperature packaging of the two together. The design of the latest miniature amplified-pressure transducers capable of operating reliably under extreme environmental conditions (in excess of 250°C and under accelerations of greater than 200g) is described in detail. The performance of such amplified pressure transducers is presented and indicates that ruggedized, piezoresistive transducers with excellent static and dynamic performance characteristics are capable of operation in extremely harsh, high temperature environments.

Author(s):  
Kurt Sobanski ◽  
Ken Martin ◽  
Fong Shi ◽  
Brad Greenway

Over the past several decades, gas turbine control systems have evolved from hydro-mechanical systems to full authority redundant electronic systems. One advanced technology with potential to revolutionize the way engine system designers build new products is high temperature distributed controls. Distributed control systems put electronics close to control functions and reduce the number of interconnects between central processors and sensors or effectors. In distributed systems, power and data buses take the place of multiple discrete analog wire bundles found in centralized control systems. Distributed modules interconnected with power and data buses control effectors such as hydraulic actuators or solenoid valves and read sensors to measure pressures, temperatures and speeds. With distributed controls, many gas turbine applications will require high temperature electronics ruggedized to survive the demanding environment. For these new systems, manufacturers must determine how to maximize the use of standard interfaces and electronic components and minimize the use of custom parts. Two particular areas would benefit the aerospace industry include distributed system power supplies and communication data buses since these designs play an important role in system cost, weight, size and reliability. Interface standardization will benefit engine manufacturers by lowering system cost and enabling inter-changeability of distributed engine control components from different suppliers. Careful attention to architectural design details for the power supplies and data buses can lead to systems that meet the needs of end users.


2020 ◽  
Vol 53 (2) ◽  
pp. 11081-11088
Author(s):  
Andreea B. Alexandru ◽  
George J. Pappas

Author(s):  
Alexandre Dos Santos Roque ◽  
Nasser Jazdi ◽  
Edison Pignaton De Freitas ◽  
Carlos Eduardo Pereira

1997 ◽  
Vol 30 (12) ◽  
pp. 293-298
Author(s):  
Lim Peng Hun ◽  
Philip Chin Sim Moo ◽  
Yang Zhizong ◽  
Pee Suat Hoon ◽  
Lim Jin Choon

Sign in / Sign up

Export Citation Format

Share Document