Geometric Analysis of Adaptive Origami Channels for Heat Transfer Applications

2017 ◽  
Author(s):  
Nathan Price ◽  
Andrew Gillman ◽  
Kazuko Fuchi ◽  
Edward J. Alyanak ◽  
Philip R. Buskohl
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Large Range ◽  
Geometric Analysis ◽  
Mechanical Analysis ◽  
Combustion Engines ◽  
Analysis Techniques ◽  
Art Form ◽  
Nonlinear Mechanical

Thermal management is a ubiquitous and critical engineering challenge for a broad range of applications, including combustion engines, high power electronics and chemical processing. However, conventional heat exchanger solutions are often static with limited ability to adaptively modulate heat transfer. Folding concepts from the ancient art form of origami could potentially address these challenges by providing large conducting surfaces that can also spatially reconfigure to regulate the flow and temperature field interactions with the heat transferring medium. In this study, trigonometric and nonlinear mechanical analysis techniques are applied to origami channel designs based on the “waterbomb” and Miura-ori unit cell to characterize the geometric properties of the structures as a function of folding. Both channels demonstrate a large range of flow control, with potentially enhanced mixing in the “waterbomb” channel, due to an axially varying cross-section. The results show promise for the use of origami-based heat exchanger designs for both improved passive and active control of heat transfer.

Passive Thermal Management of Excess Heat from Electronic Devices

1989 ◽  
Vol 154 ◽  
Author(s):  
John J. Glatz ◽  
Juan F. Leon
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Enabling Technology ◽  
Electronic Components ◽  
Potential Applications ◽  
General Scope

AbstractThermal management in the packaging of electronic components is fast becoming an enabling technology in the development of reliable electronics for a range of applications. The objective of the paper is to assess the feasibility of using advance high thermal conductivity pitch fiber (HTCPF) as a solution to some of the packaging problems. The general scope will include the following: identification of the candidate material and its potential applications; thermal management of the chip to board interface; thermal management of the heat within the multi-layer interconnect board (MIB); thermal management of the standard electronic module-format E (SEME); and heat transfer thru the enclosure to a remote heatsink/heat exchanger.

Design Optimization of Micro-channel Heat Exchanger embedded in LTCC

2012 ◽  
Vol 2012 (1) ◽  
pp. 000857-000865
Author(s):  
Aparna Aravelli ◽  
Singiresu S. Rao ◽  
Hari K. Adluru
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Optimization Technique ◽  
Thermal Design ◽  
Transfer Rates ◽  
Design Variables ◽  
Micro Heat Exchanger ◽  
Micro Systems ◽  
Silver Metal

Increase in the density of electronic packaging leads to the investigation of highly efficient thermal management systems. The challenge in these micro-systems is to maximize heat transfer per unit volume. In the author's previous work, experimental and computational analysis has been performed on LTCC substrates using embedded silver vias. This novel technique of embedding silver vias along with forced convection resulted in higher heat transfer rates. The present work further investigates into the optimization of this model. A Multi-objective optimization problem has been formulated for the heat transfer in the LTCC model. The Log Mean Temperature Difference (LMTD) method of heat exchangers has been used in the formulation. Optimization is done based on maximization of the total heat transferred and minimization of the coolant pumping power. Structural and thermal design variables are considered to meet the manufacturability and energy requirements. Demanded pressure loss and volume of the silver metal are used as constraints. The classical optimization technique Sequential Quadratic Programming (SQP) is used to solve the micro-heat exchanger problem. The optimal design is presented and sensitivity analysis results are discussed.

Empirical Analysis Using Advanced Similarity Methods

2002 ◽  
Author(s):  
John J. Wood ◽  
Kristin L. Wood ◽  
Wade O. Troxell
Keyword(s):  
Heat Transfer ◽  
Solid Mechanics ◽  
Large Range ◽  
System Parameters ◽  
Analysis Techniques ◽  
Domain Of Applicability ◽  
Development Cycle ◽  
Material Tests ◽  
Insight Into ◽  
Parameters Of Interest

Traditional dimensional analysis techniques for predicting the performance characteristics of a product can be greatly improved in both accuracy and domain of applicability by the infusion of empirical data, derived from material tests, into the equations that characterize the system parameters of interest. Advanced similarity methods are investigated which overcome the constraints associated with the traditional methods and provide increased analysis capability and improved insight into the phenomenon governing the problem. Such capability greatly increases the design toolbox available to product developers, across a large range of scale and application. It also significantly enhances a developer’s choices for prototype portioning during a development cycle. Solid mechanics and heat transfer applications are used to illustrate the basic utility of the methods.

Air Cooled Compact Heat Exchanger Design for Avionics Thermal Management Using Published Test Data

2003 ◽  
Author(s):  
George Hall ◽  
James Marthinuss
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Pressure Drop ◽  
Thermal Management ◽  
Test Data ◽  
Heat Exchangers ◽  
Optimized Design ◽  
Compact Heat Exchanger ◽  
Compact Heat Exchangers ◽  
Heat Exchanger Design

This paper will discuss air-cooled compact heat exchanger design using published data. Kays & London’s “Compact Heat Exchangers” [1] contains measured heat transfer and pressure drop data on a variety of circular and rectangular passages including circular tubes, tube banks, straight fins, louvered fins, strip or lanced offset fins, wavy fins and pin fins. While “Compact Heat Exchangers” is the benchmark for air cooled heat exchanger test data it makes no attempt to summarize the results or steer the thermal designer to an optimized design based on the different factors or combination of heat transfer, pressure drop, size, weight, or even cost. Using this reduced data and the analytical solutions provided highly efficient compact heat exchangers could be designed. This paper will guide a thermal engineer toward this optimized design without having to run trade studies on every possible heat exchanger design configuration. Typical applications of published fin data in the aerospace and military electronics include electronics cold plates, card rack walls and air-to-air heat exchangers using fan driven and ECS driven air. Airborne electronics often require extremely dense packaging techniques to fit all the required functions into the available volume. While leaving little room for cooling hardware this also drives power densities up to levels (20 W/sq-cm) that require highly efficient heat transfer techniques. Several design issues are discussed including pressure drop, heat transfer, compactness, axial conduction, flow distribution and passage irregularities (bosses). Comparisons between fin performance are made and conclusions are drawn about the applicability of each type of fin to avionics thermal management.

scholarly journals Numerical Analysis of Thermal Management for High Power LED Array

2021 ◽  
Vol 257 ◽  
pp. 01033
Author(s):  
Yingdong Shen ◽  
Junfeng Dai ◽  
Yanlong Wang
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Heat Sink ◽  
Junction Temperature ◽  
Manufacturing Cost ◽  
Specific Work ◽  
Safe Operation ◽  
Led Array

Adequate thermal management to remove and dissipate the heat produced by the LED is one of the main challenges in designing LED applications. In view of the above problems, this paper analyzed a heat sink as a heat exchanger for the LED array via the experiment combined with the numerical simulation. The results show that the heat sink is necessary for the LED array to guarantee reliable and safe operation. Moreover, the influence of the height of heat sink on the heat transfer of the LED array is also analyzed, and the optimized height of the heat sink for the 20W LED array is 20 mm. Considering the heat transfer and the manufacturing cost, increasing the heat sink area blindly is not the best way to reduce the LED junction temperature, and more specific work should be considered.

Mathematical Modeling of Novel Two-Phase Heat Transfer Device for Thermal Management of Light Emitting Diodes

2017 ◽  
Vol 139 (6) ◽  
Author(s):  
Karthik S. Remella ◽  
Frank M. Gerner ◽  
Ahmed Shuja
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Light Emitting Diodes ◽  
Working Fluid ◽  
Two Phase ◽  
Light Emitting ◽  
Phase Mixture ◽  
Two Phase Heat Transfer ◽  
Transfer Device

The paper introduces a novel two-phase heat transfer device (TPHTD) which is employed in the thermal management of light emitting diodes (LEDs). The heat transfer device structurally resembles a conventional loop heat pipe (LHP) without a compensation chamber, but operates very differently from it. The device is comprised of a central evaporator package and a circular coil that acts as a heat exchanger loop. The working fluid leaving the evaporator has a two-phase mixture quality of approximately 0.2. Having introduced the device, the paper delineates a mathematical model for predicting its thermal performance. The primary objective of the model is to provide a fundamental understanding of the operation of the device. A one-dimensional thermal resistance model (TRM) is utilized in modeling the evaporator. The paper presents a detailed discussion on obtaining these resistances from experiments conducted on the device. A correlation for the external heat transfer coefficient of the heat exchanger loop is proposed based on experiments and is found to be in good agreement with literature. The model predicts performance parameters such as board temperature, two-phase mixture quality, and saturation and subcooled temperatures (Tsat and Tsc) of the working fluid for different input thermal powers (Qtot). Based on experimental evidence, it is concluded that the majority of Qtot (∼75%) is utilized in phase change of the working fluid, and the rest reheats the working fluid from a lower subcooled temperature (Tsc) to the saturation temperature (Tsat) of the evaporator.

Thermal Management of Airbourne Early Warning and Electronic Warfare Systems Using Foam Metal Fins

2003 ◽  
Author(s):  
John Klein ◽  
George Gilchrist ◽  
Jim Karanik ◽  
Noe Arcas ◽  
Richard Yurman ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Heat Exchanger ◽  
Transfer Coefficient ◽  
Thermal Management ◽  
Heated Surface ◽  
Test Method ◽  
Heat Transfer Characteristics ◽  
Transfer Characteristics ◽  
Foam Metal

This program, addresses the need for thermal management of increasingly powerful and densely packaged electronic devices. Open-celled foams and lattice structures offer the promise of much improved heat transfer between the coolant and the solid structure of the lattice compared to traditional finned heat exchangers. The focus of this program is to evaluate integration of foam and lattice materials as heat exchanger cores and as electronic racks. The potential benefits of this approach include reduction in the volume and weight of the heat exchanger core and/or device junction temperature as well as direct attach cooling of high power electronics. To begin we have selected two major applications, a liquid cooling system heat exchanger, and avionics rack cooling. There is little data on foam metal heat transfer in the regime we anticipate for aircraft applications. Our approach begins with the measurement of heat transfer characteristics of compressed foam metals under conditions suitable for aircraft applications. Basic heat transfer data is being obtained for heat removal from a heated surface by “foam metal fins” with air flowing through the foam. Effective heat transfer coefficient and airflow resistance have been measured. The test method and apparatus are briefly described. Results of heat transfer measurements to date are presented. A theoretical model of “foam metal fins” has been developed and is applied for scaling foam metal fins within our test matrix. Using the model we determine the heat transfer coefficient between the air and foam ligaments. These heat transfer coefficients are compared with cylinders in cross flow. We applied our measured heat transfer characteristics to the design, fabrication and verification test of a highly efficient heat exchanger core. A laboratory scale thermal performance demonstration core was sized based on our test results. Initial tests of a single air / liquid heat exchanger core leg validates our core sizing. Our results can also be applied to cooling of individual electronic components as well as cold plates for electronics.

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