Axially Modulated Clamped-Guided Arch Resonator for Memory and Logic Applications

2017 ◽  
Author(s):  
Md Abdullah Al Hafiz ◽  
Sherif Tella ◽  
Nouha Alcheikh ◽  
Hossein Fariborzi ◽  
Mohammad I. Younis
Keyword(s):  
Frequency Modulation ◽  
System Integration ◽  
Room Temperature ◽  
Electrostatic Force ◽  
Logic Gate ◽  
Nonlinear Frequency ◽  
Dynamic Memory ◽  
Electrostatically Actuated ◽  
Nonlinear Frequency Response ◽  
On Chip

We experimentally demonstrate memory and logic devices based on an axially modulated clamped-guided arch resonator. The device are electrostatically actuated and capacitively sensed, while the resonance frequency modulation is achieved through an axial electrostatic force from the guided side of the clamped-guided arch microbeam. We present two case studies: first, a dynamic memory based on the nonlinear frequency response of the resonator, and second, a reprogrammable two-input logic gate based on the linear frequency modulation of the resonator. These devices show energy cost per memory/logic operation in pJ, are fully compatible with CMOS fabrication processes, have the potential for on-chip system integration, and operate at room temperature.

The Effects of Nonlinearity on Parametric Amplifiers

2008 ◽  
Author(s):  
Jeffrey F. Rhoads ◽  
Steven W. Shaw
Keyword(s):  
Performance Metrics ◽  
Dynamic Range ◽  
Noise Signal ◽  
Low Noise ◽  
Nonlinear Frequency ◽  
Parametric Amplifiers ◽  
Lumped Mass ◽  
Mass Model ◽  
Nonlinear Frequency Response ◽  
On Chip

Mechanical and electromechanical parametric amplifiers have garnered significant interest, as of late, due to the increased need for low-noise signal amplification in resonant micro/nanosystems. While these devices, which are traditionally designed to operate in a linear range, potentially represent an elegant, on-chip amplification solution, it is not readily apparent that this technical approach will suffice in all micro/nanoresonator implementations, due to the scale-dependent nature of a mechanical or electromechanical amplifier’s dynamic range. The present work investigates whether the aforementioned linear dynamic range constraint is truly a practical limitation, by considering the behavior of a representative degenerate parametric amplifier driven within a nonlinear frequency response regime. The work adopts a comparatively simple lumped-mass model for analysis and proceeds with the characterization of pertinent performance metrics, including gain/pump and gain/phase behaviors. Ultimately, the work concludes that parametric amplification can be realized in a nonlinear context, but such implementations generally lead to inferior amplifier performance.

Study of plate vibrating in fluids having part-through crack at random angles and locations

2021 ◽  
pp. 095440622110127
Author(s):  
Ruqia Ikram ◽  
Asif Israr
Keyword(s):  
Frequency Response ◽  
Multiple Scales ◽  
Peak Amplitude ◽  
Nonlinear Frequency ◽  
Response Curves ◽  
Crack Location ◽  
Cracked Plate ◽  
Nonlinear Frequency Response ◽  
Angle Crack ◽  
Crack Angle

This study presents the vibration characteristics of plate with part-through crack at random angles and locations in fluid. An experimental setup was designed and a series of tests were performed for plates submerged in fluid having cracks at selected angles and locations. However, it was not possible to study these characteristics for all possible crack angles and crack locations throughout the plate dimensions at any fluid level. Therefore, an analytical study is also carried out for plate having horizontal cracks submerged in fluid by adding the influence of crack angle and crack location. The effect of crack angle is incorporated into plate equation by adding bending and twisting moments, and in-plane forces that are applied due to antisymmetric loading, while the influence of crack location is also added in terms of compliance coefficients. Galerkin’s method is applied to get time dependent modal coordinate system. The method of multiple scales is used to find the frequency response and peak amplitude of submerged cracked plate. The analytical model is validated from literature for the horizontally cracked plate submerged in fluid as according to the best of the authors’ knowledge, literature lacks in results for plate with crack at random angle and location in the presence of fluid following validation with experimental results. The combined effect of crack angle, crack location and fluid on the natural frequencies and peak amplitude are investigated in detail. Phenomenon of bending hardening or softening is also observed for different boundary conditions using nonlinear frequency response curves.

scholarly journals Roadmap of Terahertz Imaging 2021

Sensors ◽  
2021 ◽  
Vol 21 (12) ◽  
pp. 4092
Author(s):  
Gintaras Valušis ◽  
Alvydas Lisauskas ◽  
Hui Yuan ◽  
Wojciech Knap ◽  
Hartmut G. Roskos
Keyword(s):  
Room Temperature ◽  
Continuous Wave ◽  
Computational Imaging ◽  
Imaging Systems ◽  
Thz Imaging ◽  
Operational Conditions ◽  
Frequency Combs ◽  
Wave Imaging ◽  
On Chip ◽  
Nano Imaging

In this roadmap article, we have focused on the most recent advances in terahertz (THz) imaging with particular attention paid to the optimization and miniaturization of the THz imaging systems. Such systems entail enhanced functionality, reduced power consumption, and increased convenience, thus being geared toward the implementation of THz imaging systems in real operational conditions. The article will touch upon the advanced solid-state-based THz imaging systems, including room temperature THz sensors and arrays, as well as their on-chip integration with diffractive THz optical components. We will cover the current-state of compact room temperature THz emission sources, both optolectronic and electrically driven; particular emphasis is attributed to the beam-forming role in THz imaging, THz holography and spatial filtering, THz nano-imaging, and computational imaging. A number of advanced THz techniques, such as light-field THz imaging, homodyne spectroscopy, and phase sensitive spectrometry, THz modulated continuous wave imaging, room temperature THz frequency combs, and passive THz imaging, as well as the use of artificial intelligence in THz data processing and optics development, will be reviewed. This roadmap presents a structured snapshot of current advances in THz imaging as of 2021 and provides an opinion on contemporary scientific and technological challenges in this field, as well as extrapolations of possible further evolution in THz imaging.

Reduced Order Model of MEMS Sensors Near Natural Frequency

2011 ◽  
Author(s):  
Dumitru I. Caruntu ◽  
Jose C. Solis Silva
Keyword(s):  
Natural Frequency ◽  
Nonlinear Response ◽  
Casimir Effect ◽  
Electrostatic Force ◽  
Reduced Order Model ◽  
Mass Detection ◽  
Order Model ◽  
Reduced Order ◽  
First Order ◽  
Electrostatically Actuated

The nonlinear response of an electrostatically actuated cantilever beam microresonator sensor for mass detection is investigated. The excitation is near the natural frequency. A first order fringe correction of the electrostatic force, viscous damping, and Casimir effect are included in the model. The dynamics of the resonator is investigated using the Reduced Order Model (ROM) method, based on Galerkin procedure. Steady-state motions are found. Numerical results for uniform microresonators with mass deposition and without are reported.

High Temperature High Current Gain IC Compatible 4H-SiC Phototransistor

2019 ◽  
Vol 963 ◽  
pp. 832-836 ◽  
Author(s):  
Shuo Ben Hou ◽  
Per Erik Hellström ◽  
Carl Mikael Zetterling ◽  
Mikael Östling
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Room Temperature ◽  
Uv Light ◽  
Optical Power ◽  
Current Gain ◽  
High Current ◽  
Promising Candidate ◽  
Forward Current ◽  
On Chip

This paper presents our in-house fabricated 4H-SiC n-p-n phototransistors. The wafer mapping of the phototransistor on two wafers shows a mean maximum forward current gain (βFmax) of 100 at 25 °C. The phototransistor with the highest βFmax of 113 has been characterized from room temperature to 500 °C. βFmax drops to 51 at 400 °C and remains the same at 500 °C. The photocurrent gain of the phototransistor is 3.9 at 25 °C and increases to 14 at 500 °C under the 365 nm UV light with the optical power of 0.31 mW. The processing of the phototransistor is same to our 4H-SiC-based bipolar integrated circuits, so it is a promising candidate for 4H-SiC opto-electronics on-chip integration.

Design of Electrostatic Micro Mirrors for Improved Stability Though Surface Contact

1998 ◽  
Author(s):  
Timothy Moulton ◽  
G. K. Ananthasuresh
Keyword(s):  
Design Method ◽  
Electrostatic Force ◽  
Electrostatic Actuation ◽  
Mems Devices ◽  
Complex Dynamic ◽  
Micro Electro Mechanical Systems ◽  
Electrostatically Actuated ◽  
Surface Contact ◽  
Improved Stability ◽  
Mems Process

Abstract There exists a need to stabilize the electrostatic actuation commonly used in Micro-Electro-Mechanical Systems (MEMS). Most electrostatically actuated MEMS devices act as variable capacitors with varying gap between the charged conductors. Electrostatic force in these devices is a nonlinear attractive force between the conductors resulting in a complex dynamic system. These systems are stable for only a small portion of the initial gap. In this paper a design method is presented for electrostatic micro-mirrors with improved stability. Controllable, stable electrostatic actuation can be achieved through surface contact between the two conductors. Once in contact with the surface, the compliance of the structure is used to stabilize the electrostatic actuation over a long range of motion. Beam based variable angle mirrors were designed and fabricated using the Multi-User MEMS Process at MCNC technology center. The design methods for stable electrostatic actuation were tested on these mirrors. Some characteristics are noted and their implementation into future designs is discussed.

3D RCP Package Stacking: Side Connect, An Emerging Technology for System Integration and Volumetric Efficiency

2013 ◽  
Vol 2013 (1) ◽  
pp. 000447-000451 ◽  
Author(s):  
Michael Vincent ◽  
Doug Mitchell ◽  
Jason Wright ◽  
Yap Weng Foong ◽  
Alan Magnus ◽  
...  
Keyword(s):  
System Integration ◽  
System Performance ◽  
Electrical Characterization ◽  
Emerging Technology ◽  
Volumetric Efficiency ◽  
Wafer Level ◽  
Novel Technologies ◽  
3D Packaging ◽  
Packaging Space ◽  
On Chip

Fan-out wafer level packaging (FO-WLP) has shifted from standard single die, single sided package to more advanced packages for System-in-Package (SiP) and 3D applications. Freescale's FO-WLP, Redistributed Chip Package (RCP), has enabled Freescale to create novel SiP solutions not possible in more traditional packaging technologies or Systems-on-Chip (SoC). Simple SiP's using two dimensional (2D), multi-die RCP solutions have resulted in significant package size reduction and improved system performance through shortened traces when compared to discretely packaged die or substrate based multi-chip module (MCM). More complex 3D SiP solutions allow for even greater volumetric efficiency of the packaging space. 3D RCP is a flexible approach to 3D packaging with complexity ranging from Package-on-Package (PoP) type solutions to systems including ten or more multi-sourced die with associated peripheral components. Perhaps the most significant SiP capability of the RCP technology is the opportunity for heterogeneous integration. The combination of various system elements including, but not limited to SMD's, CMOS, GaAs, MEMS, imaging sensors or IPD's gives system designers the capability to generate novel systems and solutions which can then enable new products for customers. To enable this ever increasing system integration and volumetric efficiency, novel technologies have been developed to utilize the full package space. Technologies such as through package via (TPV) and double sided redistribution are currently proving successful. For this discussion, an emerging technology for 3D RCP package stacking that can further enhance design flexibility and system performance is presented. This technology, package side connect, utilizes the vertical sides of packages and stacked packages to capture a normally unused piece of package real-estate. Mechanical and electrical characterization of successful side connects will be presented as well as reliability results of test vehicle packages using RCP packaging technology.

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