A Novel Micro Tensile Testing Instrument With Replaceable Testing Specimen of Gold and Aluminum by Parylene Passivation Technique

2008 ◽  
Author(s):  
Yung-Dong Lau ◽  
Hong Hocheng ◽  
Rongshun Chen ◽  
Weileun Fang
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Young’S Modulus ◽  
Tensile Testing ◽  
Test Specimen ◽  
Young's Modulus ◽  
Tensile Load ◽  
Thermal Actuator ◽  
Testing Instrument ◽  
Testing Specimen

This study has successfully demonstrated a novel tensile testing approach to mount a thin film test specimen onto a MEMS instrument using microfabrication processes. The MEMS instrument consists of a thermal actuator, differential capacitance sensor, and supporting spring. The thermal actuator applies a tensile load on the test specimen to characterize the Young’s modulus and the residual stress of the thin film. As compare with the existing approaches, the problems and difficulties resulting from the alignment and assembly of a thin film test specimen with the testing instrument can be prevented. Furthermore, the parylene passivation technique with the MEMS fabrication process allows the user to change the test materials easily. In application, the present approach has been employed to determine the Young’s modulus and the residual stress of Au and Al films.

A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen by Parylene Passivation Technique

2007 ◽  
Vol 1052 ◽  
Author(s):  
Yung-Dong Lau ◽  
Tso-Chi Chang ◽  
Hong Hocheng ◽  
Rongshun Chen ◽  
Weileun Fang
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Young’S Modulus ◽  
Tensile Testing ◽  
Test Specimen ◽  
Young's Modulus ◽  
Tensile Load ◽  
Thermal Actuator ◽  
Testing Instrument ◽  
Testing Specimen

AbstractThis study has successfully demonstrated a novel tensile testing approach to mount the thin film test specimen onto the MEMS instrument using microfabrication process. The MEMS instrument consists of thermal actuator, differential capacitance sensor, supporting spring. The thermal actuator applies tensile load on the test specimen to characterize the Young's modulus and the residual stress of thin films. As compare with the existing approaches, the problems and difficulties resulting from the alignment and assembly of thin film test specimens with the testing instrument can be prevented. Furthermore, the parylene passivation technique of MEMS fabrication process allows the changing of testing film materials easily. In application, the present approach has been employed to determine the Young's modulus and the residual stress of Al films.

Tuning the Mechanical Properties of SiO2 Thin Film for MEMS Application

2003 ◽  
Vol 795 ◽  
Author(s):  
Wang-Shen Su ◽  
Weileun Fang ◽  
Ming-Shih Tsai
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Plasma Treatment ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Plasma Surface ◽  
Sio2 Thin Film ◽  
Plasma Treatments ◽  
Novel Method

ABSTRACTThis study reported a novel method for tuning thin film mechanical properties by means of plasma surface modification. In order to demonstrate the feasibility of this approach, various plasma treatments, including O2, H2, NH3 atmospheres, were implemented to tune the Young's modulus and residual stress of SiO2 film. Without plasma treatment, the static tip deflection of 200μm long SiO2 cantilever was 9.01μm. After treatment with H2, O2, and NH3 plasma, the tip deformation of the treated cantilevers became 10.22μm, 8.28μm, and -6.84μm respectively. The Young's modulus of the SiO2 cantilever without plasma treatment was 76.3GPa. After treated with H2, O2, NH3 plasma, the Young's modului of those treated cantilevers became 70.8 GPa, 74.7 GPa, and 71.4 GPa, respectively. Hence, after H2 and NH3 plasma treatment, the equivalent elastic modulus of SiO2 cantilever could be reduced about 7%.

scholarly journals Strength and modulus of carbon nanotubes under a tensile load

2014 ◽  
Vol 23 (1-2) ◽  
pp. 15-19 ◽  
Author(s):  
Khaled A. Alnefaie
Keyword(s):  
Carbon Nanotubes ◽  
Young’S Modulus ◽  
Vapor Deposition ◽  
Tensile Testing ◽  
Epoxy Polymer ◽  
Young's Modulus ◽  
Tensile Load ◽  
Chemical Vapor ◽  
Weight Fraction ◽  
Pressure Chemical

AbstractCarbon nanotubes (CNTs) were fabricated using low-pressure chemical vapor deposition and then embedded in epoxy polymer at several weight ratios, 0, 0.75, 1.5, and 3 wt%, for tensile testing and Young’s modulus determination using an Instron machine. The tensile strength and Young’s modulus of the epoxy resin were increased with the addition of CNTs to a certain extent, and then decreased with the increase in the weight fraction of CNTs. The best properties occurred at 1.5 wt% of CNTs. Scanning electron microscopy was used to reveal the dispersion status of CNTs in the nanocomposites.

The evaluation of Young's modulus and residual stress of nickel films by microbridge testings

2004 ◽  
Vol 15 (12) ◽  
pp. 2389-2394 ◽  
Author(s):  
Z M Zhou ◽  
Y Zhou ◽  
C S Yang ◽  
J A Chen ◽  
G F Ding ◽  
...  
Keyword(s):  
Residual Stress ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Nickel Films

Microbridge Testing of Thin Films Under Small Deformation

1999 ◽  
Vol 594 ◽  
Author(s):  
T. Y. Zhang ◽  
Y. J. Su ◽  
C. F. Qian ◽  
M. H. Zhao ◽  
L. Q. Chen
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Silicon Nitride ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Chemical Vapor ◽  
Small Deformation ◽  
Nitride Film ◽  
Silicon Nitride Film ◽  
Pressure Chemical

AbstractThe present work proposes a novel microbridge testing method to simultaneously evaluate the Young's modulus, residual stress of thin films under small deformation. Theoretic analysis and finite element calculation are conducted on microbridge deformation to provide a closed formula of deflection versus load, considering both substrate deformation and residual stress in the film. Silicon nitride films fabricated by low pressure chemical vapor deposition on silicon substrates are tested to demonstrate the proposed method. The results show that the Young's modulus and residual stress for the annealed silicon nitride film are respectively 202 GPa and 334.9 MPa.

Measurement of Young's Modulus and Poisson's Ratio of Thin Film by Combination of Bulge Test and Nano-Indentation

2008 ◽  
Vol 33-37 ◽  
pp. 969-974 ◽  
Author(s):  
Bong Bu Jung ◽  
Seong Hyun Ko ◽  
Hun Kee Lee ◽  
Hyun Chul Park
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Poisson’S Ratio ◽  
Young's Modulus ◽  
Applied Pressure ◽  
Indentation Test ◽  
Poisson's Ratio ◽  
Bulge Test ◽  
Nano Indentation

This paper will discuss two different techniques to measure mechanical properties of thin film, bulge test and nano-indentation test. In the bulge test, uniform pressure applies to one side of thin film. Measurement of the membrane deflection as a function of the applied pressure allows one to determine the mechanical properties such as the elastic modulus and the residual stress. Nano-indentation measurements are accomplished by pushing the indenter tip into a sample and then withdrawing it, recording the force required as a function of position. . In this study, modified King’s model can be used to estimate the mechanical properties of the thin film in order to avoid the effect of substrates. Both techniques can be used to determine Young’s modulus or Poisson’s ratio, but in both cases knowledge of the other variables is needed. However, the mathematical relationship between the modulus and Poisson's ratio is different for the two experimental techniques. Hence, achieving agreement between the techniques means that the modulus and Poisson’s ratio and Young’s modulus of thin films can be determined with no a priori knowledge of either.

Measurement of Young’s modulus and residual stress of thin SiC layers for MEMS high temperature applications

2012 ◽  
Vol 18 (7-8) ◽  
pp. 945-953 ◽  
Author(s):  
Oliver Pabst ◽  
Michael Schiffer ◽  
Ernst Obermeier ◽  
Tolga Tekin ◽  
Klaus Dieter Lang ◽  
...  
Keyword(s):  
Residual Stress ◽  
High Temperature ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Temperature Applications
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