Characterization of Hybrid-Wicked Copper Heat Pipe

2011 ◽  
Author(s):  
Xianming Dai ◽  
Levey Tran ◽  
Fanghao Yang ◽  
Bo Shi ◽  
Ronggui Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Pure Copper ◽  
Critical Issue ◽  
Micro Scale ◽  
Sintered Copper ◽  
Electronics Packages ◽  
Flat Heat Pipe

Thermal management of high power electronics is becoming a critical issue as the power density of semiconductors increasing. The flat heat pipe (FHP) is widely used in the electronic cooling because it is possible to interface with flat electronics packages without additional conductive and interface resistances. The heat flux of the next generation electronics may exceed 100 W/cm2, which is significantly beyond the cooling capabilities of commercially available FHP today. A novel micro scale hybrid wick was developed in this study to improve the effective thermal conductivity and working heat flux of FHP. The hybrid wick consists of multilayer of sintered copper woven meshes to promote the capillary pressure and microchannels underneath to reduce the flow resistance. The analysis indicates that the effective thermal conductivity and the capillary limit of flat heat pipe (FHPs) with this novel micro scale hybrid wicking structure can be significantly enhanced as compared to the reported FHPs. In this paper, the design of this innovative micro scale hybrid wick is illustrated. The fabrication and charging processes are also outlined. The preliminary experimental results show that the effective thermal conductivity can approach 12,270 W/(m·K), which is more than 30 times better than pure copper at approximate 91.3 W input heat.

Boundary-value problems in the kinetic theory of gases. Part 2. Thermal creep

1971 ◽  
Vol 45 (4) ◽  
pp. 759-768 ◽  
Author(s):  
M. M. R. Williams
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Temperature Gradient ◽  
Kinetic Theory ◽  
Effective Thermal Conductivity ◽  
Half Space ◽  
Thermal Creep ◽  
Kinetic Theory Of Gases ◽  
Boundary Wall ◽  
Creep Velocity

The effect of a temperature gradient in a gas inclined at an angle to a boundary wall has been investigated. For an infinite half-space of gas it is found that, in addition to the conventional temperature slip problem, the component of the temperature gradient parallel to the wall induces a net mass flow known as thermal creep. We show that the temperature slip and thermal creep effects can be decoupled and treated quite separately.Expressions are obtained for the creep velocity and heat flux, both far from and at the boundary; it is noted that thermal creep tends to reduce the effective thermal conductivity of the medium.

A Transient Formulation of Newton's Cooling Law for Spherical Bodies

2000 ◽  
Vol 123 (1) ◽  
pp. 63-64 ◽  
Author(s):  
S. S. Sazhin ◽  
V. A. Gol'dshtein ◽  
M. R. Heikal
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Diesel Engine ◽  
Effective Thermal Conductivity ◽  
Spherical Body ◽  
Fuel Droplet ◽  
Transient Effects ◽  
Newton's Law ◽  
Initial Stage ◽  
Newton’S Law

Newton's law of cooling is shown to underestimate the heat flux between a spherical body (droplet) and a homogeneous gas after this body is suddenly immersed into the gas. This problem is rectified by replacing the gas thermal conductivity by the effective thermal conductivity. The latter reduces to the gas thermal conductivity in the limit of t→∞, but can be substantially higher in the limit of t→0. In the case of fuel droplet heating in a medium duty truck Diesel engine the gas thermal conductivity may need to be increased by more than 100 percent at the initial stage of calculations to account for transient effects during the process of droplet heating.

Experimental Investigation of Effective Thermal Conductivity for LHP Wicks

2010 ◽  
Author(s):  
Gongming Xin ◽  
Kehang Cui ◽  
Yan Chen ◽  
Wenjing Du ◽  
Yong Zou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Experimental Investigation ◽  
Effective Thermal Conductivity ◽  
Pure Copper ◽  
Pure Nickel ◽  
Loop Heat Pipe ◽  
Porosity Level ◽  
Nickel Powders ◽  
Copper Powders ◽  
Reasonable Prediction

In this study, the effective thermal conductivity (ETC) of sintered loop heat pipe wicks, with pure nickel powders, pure copper powders, Ni-10wt%Cu powders and Ni-20wt%Cu powders were experimentally investigated. The ETC of sintered Ni-Cu wicks is found less than those of sintered pure nickel wick and sintered pure copper wicks. In the same porosity level, addition of copper into nickel will reduce ETC of the sintered Ni-Cu wicks. The sintered Ni-20wt%Cu wick presents the lowest ETC among the tested wick samples. Compared to experimental results, Alexander model can provide a reasonable prediction in some wick samples.

Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays

1995 ◽  
Vol 117 (1) ◽  
pp. 75-81 ◽  
Author(s):  
A. K. Mallik ◽  
G. P. Peterson
Keyword(s):  
Thermal Conductivity ◽  
Steady State ◽  
Surface Temperature ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Heat Pipes ◽  
Temperature Gradients ◽  
Bottom Surface ◽  
Micro Heat Pipe ◽  
Micro Heat Pipes

An experimental investigation of vapor deposited micro heat pipe arrays was conducted using arrays of 34 and 66 micro heat pipes occupying 0.75 and 1.45 percent of the cross-sectional area, respectively. The performance of wafers containing the arrays was compared with that of a plain silicon wafer. All of the wafers had 8 × 8 mm thermofoil heaters located on the bottom surface to simulate the active devices in an actual application. The temperature distributions across the wafers were obtained using a Hughes Probeye TVS Infrared Thermal Imaging System and a standard VHS video recorder. For wafers containing arrays of 34 vapor deposited micro heat pipes, the steady-state experimental data indicated a reduction in the maximum surface temperature and temperature gradients of 24.4 and 27.4 percent, respectively, coupled with an improvement in the effective thermal conductivity of 41.7 percent. For wafers containing arrays of 66 vapor deposited micro heat pipes, the corresponding reductions in the surface temperature and temperature gradients were 29.0 and 41.7 percent, respectively, and the effective thermal conductivity increased 47.1 percent, for input heat fluxes of 4.70 W/cm2. The experimental results were compared with the results of a previously developed numerical model, which was shown to predict the temperature distribution with a high degree of accuracy, for wafers both with and without the heat pipe arrays.

Experimental Investigation of Thermal Conduction Performance on Silicon-Based Micro Flat Heat Pipe

2015 ◽  
Vol 645-646 ◽  
pp. 1032-1037
Author(s):  
Cong Ming Li ◽  
Yi Luo ◽  
Chuan Peng Zhou ◽  
Liang Liang Zou ◽  
Xiao Dong Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Thermal Performance ◽  
Axial Direction ◽  
Filling Ratio ◽  
Parallel Structure ◽  
Working Fluid ◽  
Vacuum Degree ◽  
Structure Dimension

There are several factors that affect heat transfer of heat pipe, for example, structure dimension, filling ratio and vacuum degree of charging. This paper studied the thermal conductivity of micro flat heat pipes (MFHPs) with different structure dimension and with different filling ratio, when the charging vacuum degree of MFHP was decided. When electric power was 2W or 4W, MFHPs with parallel grooves and nonparallel grooves, charged by working fluid with different filling ratio, were carried out. And the filling ratio is 30%, 40% and 50%, respectively. The better thermal performance of MFHP can be evaluated by lower thermal resistance and higher effective thermal conductivity. The experiment results show that MFHP has the highest effective thermal conductivity when the filling ratio is 40%; and the thermal performance of MFHP with nonparallel structure in axial direction is better than that of MFHP with parallel structure.

Evaporation, Condensation, and Flow in an Idealized Micro Heat Pipe

2002 ◽  
Author(s):  
Jin Zhang ◽  
Harris Wong
Keyword(s):  
Thermal Conductivity ◽  
Heat Pipe ◽  
Effective Thermal Conductivity ◽  
Three Dimensional ◽  
Heat Pipes ◽  
Rigorous Analysis ◽  
Evaporation And Condensation ◽  
Micro Heat Pipe ◽  
Complicated Geometry ◽  
Micro Heat Pipes

Micro heat pipes have been used in cooling micro electronic components. However their effective thermal conductivity is low compared with that of conventional heat pipes. Due to the complexity of the coupled heat and mass transport, and to the complicated three-dimensional bubble geometry inside micro heat pipes, there is a lack of rigorous analysis. As a result, the relatively low effective thermal conductivity remains unexplained. We have conceptualized an idealized micro heat pipe that eliminates the complicated geometry, but retains the essential physics. Given the simplified geometry, many effects can be studied, such as thermocapillary flow, and evaporation and condensation physics. In this talk, we will present the flow field induced by evaporation.

scholarly journals Thermal Conductivity Structure and Anisotropy of the Colossal Carbon Mesotubes

2021 ◽  
Vol 2096 (1) ◽  
pp. 012165
Author(s):  
Yu P Zarichnyak ◽  
A Yu Gorbunova ◽  
V A Korablev ◽  
V A Ivanov ◽  
N V Pilipenko ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Effective Thermal Conductivity ◽  
Cross Section ◽  
Total Conductivity ◽  
Electrical Circuits ◽  
Conductivity Structure ◽  
Transverse Thermal Conductivity ◽  
Separate Estimate ◽  
Selection Of

Abstract A model of a tube with a square cross-section was compiled for the mathematical analysis of the mesotube in Cartesian coordinates, with the selection of an element of a representative volume. To estimate the effective thermal conductivity of the structure, the generalized theory of conductivity with linearization of heat flux streamlines was used. The presence of anisotropy leads to the division of the problem into a separate estimate of the longitudinal and transverse thermal conductivity. The cross-section of the model was divided into elementary sections by a system of auxiliary adiabatic and isothermal planes, then the sections of the model were presented in the form of thermal resistances connected in chains - electrical circuits. Using the analogy of the identity of thermal and electrical resistances, the total conductivity of the sections and the effective thermal conductivity of the structure were determined. This methodology satisfies the test for limit transitions.

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