A Highly Efficient Integrated Silicon-Microchannel Cooler for Multi-Module Electronic Microsystems-Model Design, Optimization and Performance Validation

2020 ◽  
pp. 1-38
Author(s):  
Jiejun Wang ◽  
Tao Wang ◽  
Qiuyan Li ◽  
Yiming Li ◽  
Chuangui Wu ◽  
...  
Keyword(s):  
Heat Flux ◽  
Flow Distribution ◽  
Development Trend ◽  
High Heat ◽  
Coolant Flow ◽  
Maximum Temperature ◽  
High Heat Flux ◽  
Highly Efficient ◽  
And Performance ◽  
Performance Validation

Abstract Recently, the development trend of multi-module and multi-function in electronic microsystems makes the ever-increasing heat flux problem more serious. In this study, a highly efficient integrated single-phase microchannel cooler with four heat sources is presented for handling the challenges from both working independently of all electronic modules and the high heat flux. Numerical and experimental study are both conducted. By optimizing the structural design and the fabricated process, the presented microchannel cooler has outstanding cooling performance, which contains desired fluid flow distribution, pressure drop, heat transfer and combination thereof. Results reveals uniform coolant flow dissipates four individual heaters independently, and their maximal temperature difference below 4 °C. Beyond this, high heat flux removal (707.6 W/cm2) is realized with extremely low coolant flow rate (45 ml/min), and the maximum temperature rise is less than 60 °C. This study provides a referable solution for the thermal management of multi-module heat source and high heat flux in compact electronic microsystems.

On the Nature of Critical Heat Flux in Microchannels

2005 ◽  
Vol 127 (1) ◽  
pp. 101-107 ◽  
Author(s):  
A. E. Bergles ◽  
S. G. Kandlikar
Keyword(s):  
Heat Flux ◽  
Critical Heat Flux ◽  
Flow Boiling ◽  
Flow Distribution ◽  
High Heat ◽  
Operating Conditions ◽  
High Heat Flux ◽  
Clear Understanding ◽  
Wide Range ◽  
Parallel Microchannels

The critical heat flux (CHF) limit is an important consideration in the design of most flow boiling systems. Before the use of microchannels under saturated flow boiling conditions becomes widely accepted in cooling of high-heat-flux devices, such as electronics and laser diodes, it is essential to have a clear understanding of the CHF mechanism. This must be coupled with an extensive database covering a wide range of fluids, channel configurations, and operating conditions. The experiments required to obtain this information pose unique challenges. Among other issues, flow distribution among parallel channels, conjugate effects, and instrumentation need to be considered. An examination of the limited CHF data indicates that CHF in parallel microchannels seems to be the result of either an upstream compressible volume instability or an excursive instability rather than the conventional dryout mechanism. It is expected that the CHF in parallel microchannels would be higher if the flow is stabilized by an orifice at the entrance of each channel. The nature of CHF in microchannels is thus different than anticipated, but recent advances in microelectronic fabrication may make it possible to realize the higher power levels.

Thermal Modeling and Performance of High Heat Flux SOP Packages

2004 ◽  
Vol 27 (2) ◽  
pp. 398-412 ◽  
Author(s):  
M. Arik ◽  
J. Garg ◽  
A. Bar-Cohen
Keyword(s):  
Heat Flux ◽  
Thermal Modeling ◽  
High Heat ◽  
High Heat Flux ◽  
And Performance

Design and Testing of a Carbon Foam Based Supercooler for High Heat Flux Cooling in Optoelectronic Packages

2009 ◽  
Author(s):  
Walter W. Yuen ◽  
Jianping Tu ◽  
Wai-Cheong Tam ◽  
Dan Blumenthal
Keyword(s):  
Heat Flux ◽  
Heated Surface ◽  
Local Maximum ◽  
Carbon Foam ◽  
High Heat ◽  
Maximum Temperature ◽  
Transient Temperature ◽  
High Heat Flux ◽  
Periodic Heating ◽  
Heating Region

The feasibility of using carbon foam as a heat sink and heat spreader in optoelectronic packages is assessed. A “supercooler” is designed, fabricated and tested to verify its cooling capability under high heat flux conditions in a typical optoelectronic package. The supercooler uses carbon foam as a primary heat transfer material. Water is soaked into the carbon foam and under evacuated pressure, boiling is initiated under the heating region to provide enhanced cooling. Experiments were conducted for a heat flux of up to 400 W/cm2 deposited over a heating area of 0.5 mm × 5 mm. Two dimensional transient temperature distributions were recorded using a high speed infrared camera. Data were obtained for steady heating, as well as periodic heating with frequency up to 8 hz. Results show that the supercooler is very efficient in dissipating heat away from the heating region. Data obtained under 8 hz periodic heating with a peak power input of 10W, for example, showed that the temperature of the heated surface rises quickly to a local maximum of 15 to 20 °K above the ambient. The heated surface is then cooled uniformly back to a near ambient condition (with a maximum temperature of less than 5 °K above ambient) during the cooling half of the cycle (less than 0.0625 sec after the heating is turned off). The average cooling rate during the cooling period exceeds 170 °K/s. A numerical model, based on COMSOL, is developed to interpret the experimental data and to provide insights on the relevant physics responsible for the rapid cooling. Numerical data are presented to demonstrate how the supercooler can be further improved and adopted for other applications.

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics

2015 ◽  
Author(s):  
Sohail R. Reddy ◽  
George S. Dulikravich
Keyword(s):  
Heat Flux ◽  
Cross Section ◽  
High Heat ◽  
Heat Transfer Analysis ◽  
Maximum Temperature ◽  
High Heat Flux ◽  
Multi Objective Optimization ◽  
Multi Objective ◽  
Pin Fin ◽  
Pin Fin Arrays

The thermal management capability of various candidates of micro-pin fin arrays is investigated. An integrated circuit having a footprint of 4 × 3 mm with micro-pin fin array having circular, airfoil and convex cross-section is considered. The three pin fin cross-sections along with the cooling schemes are optimized to handle a uniform heat flux of 500 W/cm2 applied to the top surface of the electronic chip. A fully three-dimensional, steady-state conjugate heat transfer analysis was performed on each cooling configuration and a constrained multi-objective optimization was carried out for each of the three micro-pin fin shapes to find pin fin designs configurations capable of cooling such high heat fluxes. The design variables were the geometric parameters defining each pin fin cross section, height of the chip and inlet speed of the coolant. The two simultaneous objectives were to minimize maximum temperature and pressure drop (pumping power), while keeping the maximum temperature below 85°C. A response surface was constructed for each objective function and was coupled with a genetic algorithm to arrive at a Pareto frontier of the best trade-off solutions. Stress-deformation analysis incorporating the hydrodynamic and thermal loads was performed on each of the three optimized configurations. The maximum displacement was found to be on the nano-level, and the Von-Mises stress for each configuration was found to be significantly below the yield strength of Silicon.

The Simulation of Heat Pipe Evaporator in Concentration Solar Cell

2010 ◽  
Vol 44-47 ◽  
pp. 1207-1212 ◽  
Author(s):  
Zi Long Wang ◽  
Hua Zhang ◽  
Hai Tao Zhang
Keyword(s):  
Heat Flux ◽  
Solar Cell ◽  
Heat Pipe ◽  
Saturation Temperature ◽  
High Heat ◽  
Maximum Temperature ◽  
Working Fluid ◽  
High Heat Flux ◽  
Two Phase ◽  
Solar Cell Performance

Considering the problem of the concentrating solar cell efficiency restricted by the temperature. The closed two-phase thermosyphon was used to dissipation heat in concentrating solar cell at high heat flux, which adopted water as the working fluid. The temperature distribution of evaporator had significant effect on solar cell performance and heat pipe efficiency. A numerical simulation model of evaporator was established by FLUENT. During the computing process, the heat flux, filling ratio of liquid and saturation temperature were taken into account. It was found that the maximum temperature of evaporator was less than 85°C, when the solar cell operated in 140 to 180 suns, in the conditions of evaporator size (Length×Width×Height, 100×100×30 mm), the optimum charging ratio of liquid is between 27%～30%. The smaller saturation temperature would bring the better heat transfer characters.

scholarly journals Design and performance of vacuum system for high heat flux test facility

2017 ◽  
Vol 823 ◽  
pp. 012024
Author(s):  
Rajamannar Swamy Kidambi ◽  
Prakash Mokaria ◽  
Samir Khirwadkar ◽  
Sunil Belsare ◽  
M S Khan ◽  
...  
Keyword(s):  
Heat Flux ◽  
High Heat ◽  
Test Facility ◽  
Vacuum System ◽  
High Heat Flux ◽  
And Performance
Sign in / Sign up

Export Citation Format

Share Document