Packaging and performance of high power semiconductor lasers of high heat flux up to 2000 W/cm/sup 2/

2005 ◽  
Author(s):  
Xingsheng Liu ◽  
L.C. Hughes ◽  
M.H. Rasmussen ◽  
M.H. Hu ◽  
V.A. Bhagavatula ◽  
...  
Keyword(s):  
Heat Flux ◽  
Semiconductor Lasers ◽  
High Power ◽  
High Heat ◽  
High Heat Flux ◽  
Power Semiconductor ◽  
And Performance

A Highly Efficient Integrated Silicon-Microchannel Cooler for Multi-Module Electronic Microsystems-Model Design, Optimization and Performance Validation

2020 ◽  
pp. 1-38
Author(s):  
Jiejun Wang ◽  
Tao Wang ◽  
Qiuyan Li ◽  
Yiming Li ◽  
Chuangui Wu ◽  
...  
Keyword(s):  
Heat Flux ◽  
Flow Distribution ◽  
Development Trend ◽  
High Heat ◽  
Coolant Flow ◽  
Maximum Temperature ◽  
High Heat Flux ◽  
Highly Efficient ◽  
And Performance ◽  
Performance Validation

Abstract Recently, the development trend of multi-module and multi-function in electronic microsystems makes the ever-increasing heat flux problem more serious. In this study, a highly efficient integrated single-phase microchannel cooler with four heat sources is presented for handling the challenges from both working independently of all electronic modules and the high heat flux. Numerical and experimental study are both conducted. By optimizing the structural design and the fabricated process, the presented microchannel cooler has outstanding cooling performance, which contains desired fluid flow distribution, pressure drop, heat transfer and combination thereof. Results reveals uniform coolant flow dissipates four individual heaters independently, and their maximal temperature difference below 4 °C. Beyond this, high heat flux removal (707.6 W/cm2) is realized with extremely low coolant flow rate (45 ml/min), and the maximum temperature rise is less than 60 °C. This study provides a referable solution for the thermal management of multi-module heat source and high heat flux in compact electronic microsystems.

Thermal Modeling and Performance of High Heat Flux SOP Packages

2004 ◽  
Vol 27 (2) ◽  
pp. 398-412 ◽  
Author(s):  
M. Arik ◽  
J. Garg ◽  
A. Bar-Cohen
Keyword(s):  
Heat Flux ◽  
Thermal Modeling ◽  
High Heat ◽  
High Heat Flux ◽  
And Performance

Generation of high heat flux plasmas by high power rf heating in the divertor plasma simulator NAGDIS-II

Vacuum ◽  
2000 ◽  
Vol 59 (1) ◽  
pp. 24-34 ◽  
Author(s):  
Yoshihiko Uesugi ◽  
Takahiro Imai ◽  
Hiroyuki Sawada ◽  
Norihumi Hattori ◽  
Shuichi Takamura
Keyword(s):  
Heat Flux ◽  
High Power ◽  
High Heat ◽  
High Heat Flux ◽  
Rf Heating

ADVANCED COOLING TECHNOLOGIES FOR MICROPROCESSORS

2006 ◽  
Vol 16 (01) ◽  
pp. 301-313 ◽  
Author(s):  
THOMAS W. KENNY ◽  
KENNETH E. GOODSON ◽  
JUAN G. SANTIAGO ◽  
EVELYN WANG ◽  
JAE-MO KOO ◽  
...  
Keyword(s):  
Heat Flux ◽  
High Power ◽  
High Heat ◽  
Computer Applications ◽  
System Level ◽  
Alternative Methods ◽  
High Heat Flux ◽  
Air Cooling ◽  
Desktop Computer ◽  
Power Sources

Recent trends in processor power for the next generation devices point clearly to significant increase in processor heat dissipation over the coming years. In the desktop system design space, the tendency has been to minimize system enclosure size while maximizing performance, which in turn leads to high power densities in future generation systems. The current thermal solutions used today consist of advanced heat sink designs and heat pipe designs with forced air cooling to cool high power processors. However, these techniques are already reaching their limits to handle high heat flux, and there is a strong need for development of more efficient cooling systems which are scalable to handle the high heat flux generated by the future products. To meet this challenge, there has been research in academia and in industry to explore alternative methods for extracting heat from high-density power sources in electronic systems. This talk will discuss the issues surrounding device cooling, from the transistor level to the system level, and describe system-level solutions being developed for desktop computer applications developed in our group at Stanford University.

High Heat Flux Liquid-Cooled Porous Metal Heat Sink

2003 ◽  
Author(s):  
Mark T. North ◽  
Wei-Lin Cho
Keyword(s):  
Heat Flux ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Laser Diode ◽  
High Power ◽  
Heat Sink ◽  
Porous Metal ◽  
High Heat ◽  
High Heat Flux ◽  
Laser Diode Arrays

An advanced heat sinking technology is described in which heat is dissipated by flowing the liquid coolant through a matrix of well-bonded metallic particles. This porous metal heat sink has the capability to dissipate heat flux of 500W/cm2 or more with a unit area thermal resistance of 0.1°C·cm2/W. The construction of one incarnation of this class of heat sink developed for cooling of a high-power stack of laser diode arrays is described. Tradeoffs between pressure drop and thermal resistance are identified with regard to particle size and other geometric parameters. The patented manifolding geometry allows the cooling area to be scaled up without significantly increasing the overall pressure drop. Experimental data showing thermal resistance and pressure drop at a variety of different water flow rates is also presented. Applications for this technology can include cooling of laser diode arrays and high power electronic components such as CPUs.

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