Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Reece Whitt ◽  
Skyler Hudson ◽  
David Huitink ◽  
Zhao Yuan ◽  
Asif Emon ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Additive Manufacturing ◽  
Thermal Management ◽  
Convective Heat ◽  
High Voltage ◽  
Electromagnetic Interference ◽  
Electronic Device ◽  
Heat Removal ◽  
Heat Sinks ◽  
Transfer Coefficients

Abstract With the increase of electronic device power density, thermal management and reliability are increasingly critical in the design of power electronic systems. First, increased density challenges the capability of conventional heat sinks to adequately dissipate heat. Second, higher frequency switching in high voltage, high current, wide bandgap power modules is creating intensified electromagnetic interference (EMI) challenges, in which metallic heat removal systems will couple and create damaging current ringing. Furthermore, mobile power systems require lightweight heat removal methods that satisfy the heat loads dissipated during operation. In this effort, we introduce an additive manufacturing (AM) pathway to produce custom heat removal systems using nonmetallic materials, which take advantage of impinging fluid heat transfer to enable efficient thermal management. Herein, we leverage the precision of additive manufacturing techniques in the development of three-dimensional optimized flow channels for achieving enhanced effective convective heat transfer coefficients. The experimental performance of convective heat removal due to liquid impingement is compared with conventional heat sinks, with the requirement of simulating the heat transfer needed by a high voltage inverter. The implementation of nonmetallic materials manufacturing is aimed to reduce electromagnetic interference in a low weight and reduced cost package, making it useful for mobile power electronics.

Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization

2019 ◽  
Author(s):  
Reece Whitt ◽  
David Huitink ◽  
Skyler Hudson ◽  
Bakhtiyar Nafis ◽  
Zhao Yuan ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Convective Heat Transfer ◽  
Thermal Management ◽  
Convective Heat ◽  
Electromagnetic Interference ◽  
Electronic Device ◽  
Heat Removal ◽  
Heat Sinks ◽  
Metallic Materials ◽  
Transfer Coefficients

Abstract With the increase of electronic device power density, thermal management and reliability are becoming increasingly important. First, increased density challenges the capability of conventional heat sinks to adequately dissipate heat. Secondly, higher frequency switching in wide bandgap power modules is introducing new issues in electromagnetic interference (EMI) in which metallic heat removal systems will couple and create damaging current ringing. Lastly, lightweight heat removal is required to meet the increasing needs of mobile power systems. In this effort we introduce an additive manufacturing pathway to produce custom-tailored heat removal systems using non-metallic materials, which take advantage of convective heat transfer to enable efficient thermal management. Herein, we leverage the precision of AM techniques in the development of 3D optimized flow channels for achieving enhanced effective convective heat transfer coefficients. The experimental performance of convective heat removal due to liquid impingement is compared with conventional heat sinks, with the requirement of simulating the heat transfer needed by a high voltage inverter. The implementation of non-metallic materials manufacturing is aimed to reduce EMI in a low weight and reduced cost package, making it useful for mobile power electronics.

Pressure Drop and Convective Heat Transfer in Different SiSiC Structures Fabricated by Indirect Additive Manufacturing

2020 ◽  
Vol 142 (3) ◽  
Author(s):  
Ehsan Rezaei ◽  
Maurizio Barbato ◽  
Sandro Gianella ◽  
Alberto Ortona ◽  
Sophia Haussener
Keyword(s):  
Heat Transfer ◽  
Additive Manufacturing ◽  
Convective Heat Transfer ◽  
Convective Heat ◽  
Three Dimensional ◽  
Ceramic Foam ◽  
Transfer Coefficients ◽  
Pressure Drops ◽  
Surface Areas ◽  
Averaged Model

Abstract The microstructure of porous materials has a significant effect on their transport properties. Engineered cellular ceramics can be designed to exhibit properties at will, thanks to the advances in additive manufacturing. We investigated the heat and mass transport characteristics of SiSiC lattices produced by three-dimensional (3D) printing and replication, with three different morphologies: rotated cube (RC), Weaire–Phelan (WPh), and tetrakaidecahedron (TK) lattices, and a commercially available ceramic foam. The pressure gradients were measured experimentally for various velocities. The convective heat transfer coefficients were determined through a steady-state experimental technique in combination with numerical analysis. The numerical model was a volume-averaged model based on a local thermal nonequilibrium (LTNE) assumption of the two homogeneous phases. The results showed that for TK and WPh structures, undesirable manufacturing anomalies (specifically window clogging) led to unexpectedly higher pressure drops across the samples and increased thermal dispersion. Compared to the TK and WPh structures the manufactured RC lattice and the random foam had lower heat transfer rates but also lower pressure drops. These lower values for the RC lattice and foam are also a result of their lower specific surface areas.

Numerical Simulations for Digitized Heat Transfer

2009 ◽  
Author(s):  
Eric Baird ◽  
Kamran Mohseni
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Liquid Metals ◽  
Heat Removal ◽  
Heat Sinks ◽  
Management Technique ◽  
High Power Density ◽  
Transfer Rates ◽  
Integrated Microsystems ◽  
High Degree

This paper presents estimates of heat removal capabilities of a Digitized Heat Transfer (DHT) cooled device, a novel active thermal management technique for high power density electronics and integrated microsystems. In DHT, thermal energy is transported by a discrete array of electrostatically activated microdroplets of liquid metals, alloys or aqueous solutions with the potential of supporting significantly higher heat transfer rates than classical air-cooled heat sinks. Actuation methods for dispensing and transporting individual fluid slugs with a high degree of precision and programmability are described, and numerical results for the amount of heat flux removal a DHT device can obtain are presented.

Introduction of a novel electric field-based plate heat sink for heat transfer enhancement of thermal systems

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Nader Nourdanesh ◽  
Faramarz Ranjbar
Keyword(s):  
Heat Transfer ◽  
Electric Field ◽  
Thermal Management ◽  
High Voltage ◽  
Heat Sink ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Parallel Plates ◽  
Thermal Systems ◽  
Content Type

Purpose The purpose of this study is to use an electric field technique to design novel heat sinks capable of rejecting as much heat as possible in a limited space. Configuration of electrodes in this study can be used for increasing the efficiency of heat sinks. Design/methodology/approach This study investigates a novel electrohydrodynamic (EHD)-based heat sink for thermal management of electronic devices and thermal systems. The significant part of designing an EHD heat sink is the arrangement of the electrodes. A numerical simulation is performed for a heat sink with two parallel plates to determine the optimum dimensional configuration of electrodes. The upper plate of this heat sink is the ground electrode with a constant atmosphere temperature, and the lower plate of it with flush-mounted high-voltage electrodes has uniform heat flux. Findings The results show that heat transfer changes by the size of the vortices and the number of them. These vortices are emerged by the electric field, and the number of them increases with increasing the number of electrodes. The interaction of vortices size and number leads to having the lowest average temperature in the optimum case by two high voltage electrodes with widths of 7.5 mm and a 17.5 mm gap between them. In comparison with the case without the electric field, with increasing the applied voltage to 30 kV, the efficiency of this EHD heat sink increases up to 37%. Originality/value Improvements in electrical equipment make them more compact with higher heat fluxes. Hence, the amount of heat to be dissipated per area increases and needs thermal management to operate at their design temperatures. Therefore, to improve the performance and life span of electronic components and increase their efficiency, it is necessary to design heat sinks to decrease their maximum (peak) temperature.

scholarly journals Influence of Ambient Temperature on Radiative and Convective Heat Dissipation Ratio in Polymer Heat Sinks

Polymers ◽  
2021 ◽  
Vol 13 (14) ◽  
pp. 2286
Author(s):  
Jan Kominek ◽  
Martin Zachar ◽  
Michal Guzej ◽  
Erik Bartuli ◽  
Petr Kotrbacek
Keyword(s):  
Heat Transfer ◽  
Ambient Temperature ◽  
Convective Heat ◽  
Heat Dissipation ◽  
High Surface ◽  
Heat Sinks ◽  
Fourth Power ◽  
Molding Process ◽  
Ambient Temperatures ◽  
University Of Technology

Miniaturization of electronic devices leads to new heat dissipation challenges and traditional cooling methods need to be replaced by new better ones. Polymer heat sinks may, thanks to their unique properties, replace standardly used heat sink materials in certain applications, especially in applications with high ambient temperature. Polymers natively dispose of high surface emissivity in comparison with glossy metals. This high emissivity allows a larger amount of heat to be dissipated to the ambient with the fourth power of its absolute surface temperature. This paper shows the change in radiative and convective heat transfer from polymer heat sinks used in different ambient temperatures. Furthermore, the observed polymer heat sinks have differently oriented graphite filler caused by their molding process differences, therefore their thermal conductivity anisotropies and overall cooling efficiencies also differ. Furthermore, it is also shown that a high radiative heat transfer leads to minimizing these cooling efficiency differences between these polymer heat sinks of the same geometry. The measurements were conducted at HEATLAB, Brno University of Technology.

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