Study on the Performance of a Y-Shaped Liquid Cooling Heat Sink Based on Constructal Law for Electronic Chip Cooling

2020 ◽  
Vol 13 (3) ◽  
Author(s):  
Zhihao Lu ◽  
Kai Zhang
Keyword(s):  
Surface Temperature ◽  
Heat Sink ◽  
Data Center ◽  
Cooling Water ◽  
Heat Sinks ◽  
Liquid Cooling ◽  
Air Conditioning System ◽  
Chip Cooling ◽  
Constructal Law ◽  
Heat Released

Abstract The power of one rack in a data center can be greater than 3 kW, which is released within a relatively small area. However, most of the heat in a data center is released from the electronic chips. Thus, the energy consumption of the air-conditioning system in a data center will be significantly decreased if the heat released by the electronic chips can be reduced directly. Although liquid cooling heat sinks (LCHS) have been demonstrated as an effective way to resolve this problem, the application of LCHS is limited by the uneven cooling distribution on the surface of the electronic chips and the liquid leakage of the LCHS. The constructal law optimizes the design of the pipeline by introducing the freedom of deformation in the fluid geometry to obtain the optimal global performance. In this study, a novel Y-shaped liquid cooling heat sink (YLCHS) was proposed based on the constructal law, in which the cooling water enters the center of the heat sink through the inlet pipe and diffuses into the periphery through the internal Y-shaped microchannels. A numerical simulation was carried out to determine the cooling effect of the YLCHS. Compared to those of the conventional S-shaped liquid cooling heat sink (CSLCHS), the peak surface temperature and the average surface temperature of the electronic chip with YLCHS were decreased by 15.2 °C and 6.3 °C, respectively. Furthermore, the pressure loss of the electronic chip with YLCHS was also reduced by 63.0%.

A CMOS Compatible Metal-Polymer Microchannel Heat Sink for Monolithic Chip Cooling Applications

2010 ◽  
Author(s):  
Aziz Koyuncuog˘lu ◽  
Tuba Okutucu ◽  
Haluk Ku¨lah
Keyword(s):  
Heat Sink ◽  
Complementary Metal Oxide Semiconductor ◽  
Heat Sinks ◽  
Oxide Semiconductor ◽  
Microchannel Heat Sink ◽  
Liquid Cooling ◽  
Chip Cooling ◽  
Electronic Circuitry ◽  
Cmos Compatible ◽  
Adjacent Channels

A novel complementary metal oxide semiconductor (CMOS) compatible microchannel heat sink is designed and fabricated for monolithic liquid cooling of electronic circuits. The microchannels are fabricated with full metal walls between adjacent channels with a polymer top layer for easy sealing and optical visibility of the channels. The use of polymer also provides flexibility in adjusting the width of the channels allowing better management of the pressure drop. The proposed microchannel heat sink requires no design change of the electronic circuitry underneath, hence, can be produced by adding a few more steps to the standard CMOS fabrication flow. The microchannel heat sinks were tested successfully under various heat flux and coolant flow rate conditions. The preliminary cooling tests indicate that the proposed design is promising as a monolithic liquid cooling solution for CMOS circuits.

Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components

2000 ◽  
Author(s):  
X. Wei ◽  
Y. Joshi
Keyword(s):  
Flow Rate ◽  
Heat Sink ◽  
Water Flow Rate ◽  
Heat Removal ◽  
Single Layer ◽  
Heat Sinks ◽  
Computationally Efficient ◽  
Liquid Cooling ◽  
Number Of Layers ◽  
Microelectronic Components

Abstract A novel heat sink based on a multi-layer stack of liquid cooled microchannels is investigated. For a given pumping power and heat removal capability for the heat sink, the flow rate across a stack of microchannels is lower compared to a single layer of microchannels. Numerical simulations using a computationally efficient multigrid method [1] were carried out to investigate the detailed conjugate transport within the heat sink. The effects of the microchannel aspect ratio and total number of layers on thermal performance were studied for water as coolant. A heat sink of base area 10 mm by 10 mm with a height in the range 1.8 to 4.5 mm (2–5 layers) was considered with water flow rate in the range 0.83×10−6 m3/s (50 ml/min) to 6.67×10−6 m3/s (400 ml/min). The results of the computational simulations were also compared with a simplified thermal resistance network analysis.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

Experimental and Numerical Study of Transient Electronic Chip Cooling by Liquid Flow in Microchannel Heat Sink

2010 ◽  
Author(s):  
Jingru Zhang ◽  
Tiantian Zhang ◽  
Yogesh Jaluria
Keyword(s):  
Liquid Flow ◽  
Heat Sink ◽  
Single Channel ◽  
Numerical Study ◽  
Numerical Models ◽  
Heat Removal ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Chip Cooling ◽  
Microchannel Heat Sinks

Cooling of electronic chips has become a critical aspect in the development of electronic devices. Overheating may cause the malfunction or damage of electronics and the time needed for heat removal is important. In this paper, an experimental setup and numerical model was developed to test the effects of different parameters and their influence on the transient electronic chip cooling by liquid flow in microchannel heat sinks. The temperature change with time of the system for different heat fluxes at different flow was determined, from which the response time can be obtained. Three different configurations of multi-microchannel heat sinks were tested during the experiment. Numerical models were then developed to simulate the transient cooling for two of the configurations. A good agreement between the experimental data and numerical results showed that single-channel models are capable of simulating the thermal behavior of the entire heat sink by applying appropriate assumptions and boundary conditions.

Effective Parameters on Increasing Efficiency of Microscale Heat Sinks and Application of Liquid Cooling in Real Life

2021 ◽  
Author(s):  
Yousef Alihosseini ◽  
Amir Rezazad Bari ◽  
Mehdi Mohammadi
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Academic Research ◽  
Real Life ◽  
Critical Issue ◽  
Heat Sinks ◽  
Effective Parameters ◽  
Liquid Cooling ◽  
Flow Parameters

Over the past two decades, electronic technology and miniaturization of electronic devices continue to grow exponentially, and heat dissipation becomes a critical issue for electronic devices due to larger heat generation. So, the need to cool down electronic components has led to the development of multiple cooling methods and microscale heat sinks. This chapter reviewed recent advances in developing an efficient heat sink, including (1) geometry parameters, (2) flow parameters that affect the hydraulic–thermal performance of the heat sink. Also, the main goal of this chapter is to address the current gap between academic research and industry. Furthermore, commercialized electronic cooling devices for various applications are highlighted, and their operating functions are discussed, which has not been presented before.

Design of a Mini Heat Sink Based on Constructal Theory for Electronic Chip Cooling

2014 ◽  
Author(s):  
Srikanth Srinivasan ◽  
Shaikha Al-Suwaidi ◽  
Reza Sadr
Keyword(s):  
Temperature Distribution ◽  
Heat Sink ◽  
Heat Removal ◽  
Constructal Theory ◽  
Computer Engineering ◽  
Liquid Cooling ◽  
Channel Network ◽  
Channel System ◽  
Chip Cooling ◽  
Flow Study

New technological advancements in electronic circuits and computer engineering have increased the need for better cooling systems; liquid cooling of electronic components seems to offer a solution for this problem. An important part of such solution is to design a compact cooling channel system that offers a uniform temperature distribution over the part to be cooled. This work investigates the application of constructal theory for the design of a compact double sided cooling pad for such applications. Fluid enters the two networks, on the top and bottom of the pad, via a single inlet inside a separating layer between them. The heated fluid then collected at the periphery of the channel network. An exit port is then attached to a collection well for the exit flow. Numerical method is used to redesign flow passage dimensions inside the heat sink and optimize fluid outlet layout to ensure uniform heat removal and temperature distribution in the pad. A sample model of the actual device is built; using advanced 3D printing technology, for flow study. Flow pattern, temperature distribution, and the resulted pressure drop for the designed heat sink are presented for different flow rates.

Experimental Investigation of Liquid Cooling Through Shallow Copperclad Cavities With Etched Pin-Fin Arrays

2018 ◽  
Author(s):  
Yin Lam ◽  
Nicole Okamoto ◽  
Younes Shabany ◽  
Sang-Joon John Lee
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Surface Area ◽  
Flow Rate ◽  
Heat Sink ◽  
Heat Removal ◽  
Heat Sinks ◽  
Liquid Cooling ◽  
Pin Fin ◽  
Pin Fin Arrays

Heat removal is an increasing engineering challenge for higher-density packaging of circuit components. Microchannel heat sinks with liquid cooling have been investigated to take advantage of high surface-to-volume ratio and higher heat capacity of liquids relative to gases. This study experimentally investigated heat removal by liquid cooling through shallow copperclad cavities with staggered pin-fin arrays. Cavities with pin-fins were fabricated by chemical etching of a copperclad layer (nominally 105 μm thick) on a printed-circuit substrate (FR-4). The overall etched cavity was 30 mm wide, 40 mm long, and 0.1 mm deep. The pins were 1.1 mm in diameter and were distributed in a staggered arrangement. The cavity was sealed with a second copperclad substrate using an elastomer gasket. This assembly was then connected to a syringe pump delivery system. Deionized water was used as the working fluid, with volumetric flow rate up to 1.5 mL/min. The heat sink was subjected to a uniform heat flux of 5 W on the underside. Performance of the heat sink was evaluated in terms of pressure drop and the convection thermal resistance. Pressure drop across the heat sinks was less than 10 kPa, dominated by wall surface area rather than the small surface area contributed by cylindrical pins. At low flow rate, caloric thermal resistance dominated the overall thermal resistance of the heat sink. When compared to a microchannel without pins, the pin-fin microchannel reduced convective thermal resistance of the heat sink by approximately a factor of 4.

Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronic Components

2004 ◽  
Vol 126 (1) ◽  
pp. 60-66 ◽  
Author(s):  
Xiaojin Wei ◽  
Yogendra Joshi
Keyword(s):  
Flow Rate ◽  
Heat Sink ◽  
Water Flow Rate ◽  
Heat Removal ◽  
Single Layer ◽  
Heat Sinks ◽  
Computationally Efficient ◽  
Liquid Cooling ◽  
Number Of Layers ◽  
Microelectronic Components

A novel heat sink based on a multilayer stack of liquid cooled microchannels is investigated. For a given pumping power and heat removal capability for the heat sink, the flow rate across a stack of microchannels is lower compared to a single layer of microchannels. Numerical simulations using a computationally efficient multigrid method [1] were carried out to investigate the detailed conjugate transport within the heat sink. The effects of the microchannel aspect ratio and total number of layers on thermal performance were studied for water as coolant. A heat sink of base area 10 mm by 10 mm with a height in the range 1.8 to 4.5 mm (2–5 layers) was considered with water flow rate in the range 0.83×10−6m3/s (50 ml/min) to 6.67×10−6m3/s (400 ml/min). The results of the computational simulations were also compared with a simplified thermal resistance network analysis.

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