Structural Optimization and Heat Transfer Performance Analysis of a Cone-Column Combined Heat Sink

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Zheng Wei ◽  
Sun Jianjun ◽  
Niu Tao ◽  
Ma Chenbo ◽  
Yu Qiuping ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Pore Size ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Orthogonal Test ◽  
Test Method ◽  
Normal Operation ◽  
Microchannel Heat Sink ◽  
Transfer Performance ◽  
The Impact

Abstract To address the impact of temperature on the normal operation and service life of high-power electronic components, a circular microchannel heat sink with cones has been designed. The cones are evenly arranged inside circular microchannels, which can change the flow state of the cooling medium in the microchannels and enhance the heat transfer performance. The experimental scheme of the heat transfer performance of microchannel heat sink was designed by an orthogonal test method, and the numerical simulation was carried out by ansys thermal-fluid–solid coupling. Within the test parameters, the inlet pore size, the split outer diameter, and the number of cone columns have effect the temperature of the heat sink base. Further, the inlet pore size and the number of cone columns have a heightened effect on the test results: the base temperature of the heat sink decreases rapidly with the increase in the inlet pore size and the number of cone columns. According to the orthogonal test analysis, the structural parameters of the heat sink were optimized. Under the condition that the other boundary conditions are the same, the temperature of the heat sink substrate obtained by the new factor levels combination is 27.87 °C.

Optimization of Flow and Heat Transfer for a New Double-Layered Microchannel Heat Sink

2019 ◽  
Author(s):  
Huanling Liu ◽  
Bin Zhang
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Microchannel Heat Sink ◽  
Transfer Performance ◽  
Temperature Uniformity ◽  
Flow And Heat Transfer ◽  
Fluent Simulation ◽  
New Type ◽  
Improved Design

Abstract In this paper, we propose a new type of DL-MCHS to improve the substrate temperature uniformity of the microchannel heat sink, and conduct the optimization of the New DL-MCHS. The heat transfer and friction characteristics of the novel DL-MCHS are studied by numerical simulation. We compare the heat transfer performance the new DL-MCHS with the traditional TDL-MCHS (the DL-MCHS with truncated top channels λ = 0.38). The results prove the effectiveness of the improved design by FLUENT simulation. When the inlet velocity is kept constant and coolant is water, the heat transfer performance of the New DL-MCHS is higher than that of TDL-MCHS leading to an increase of the temperature uniformity. In order to achieving the best overall heat transfer performance, an optimization of New DL-MCHS is performed by GA (genetic algorithm).

Parametric study of heat transfer performance including entropy generation of microchannel heat sink with fan cavity and different rib structure

2021 ◽  
pp. 095440892110434
Author(s):  
K. Bala Subrahmanyam ◽  
Aparesh Datta ◽  
Pritam Das
Keyword(s):  
Heat Transfer ◽  
Entropy Generation ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Microchannel Heat Sink ◽  
Transfer Performance ◽  
Bulk Fluid ◽  
Simultaneous Application ◽  
Entropy Generation Number ◽  
Generation Number

This numerical study investigates the simultaneous application of axial wall conduction effect and entropy generation minimization as two principles to identify heat transfer performance in a microchannel heat sink with fan cavity and ribs. In this conjugate analysis, three different materials for a microchannel heat sink considered are silicon, aluminium, and copper. In addition to the fan cavity (F), effects of different rib configurations arranged symmetrically inside the fan cavity, that is, backward triangle rib (FB), rectangular rib (FR), forward triangle rib (FF), and diamond rib (FD) with Reynolds numbers ranging from 136 to 588 are studied. The comparative study between silicon and copper in terms of local wall and bulk fluid temperatures, increment in solid wall to fluid thermal conductivity ratio within the range (247.07 <  ksf < 669.44), local Nusselt number (Nu x), axial conduction number (M), and entropy generation number ( Ns, a) were furnished and examined. Structural optimization is performed on diamond rib configuration geometrical parameters to observe entropy generation number and wall conduction effects trend as thermal performance is greatly improved to 2.49, at the lowest Ns, a to 0.31 at Re 391.47, with copper in the back to back cavities case. However based on the numerical results, comparative importance of axial wall conduction effect consideration in the present design of microsink, silicon is showing best results in overcoming at Re 588.4, consistently in all optimization cases.

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