scholarly journals A Deep Reinforcement Learning Approach for Global Routing

2019 ◽  
Vol 142 (6) ◽  
Author(s):  
Haiguang Liao ◽  
Wentai Zhang ◽  
Xuliang Dong ◽  
Barnabas Poczos ◽  
Kenji Shimada ◽  
...  

Abstract Global routing has been a historically challenging problem in the electronic circuit design, where the challenge is to connect a large and arbitrary number of circuit components with wires without violating the design rules for the printed circuit boards or integrated circuits. Similar routing problems also exist in the design of complex hydraulic systems, pipe systems, and logistic networks. Existing solutions typically consist of greedy algorithms and hard-coded heuristics. As such, existing approaches suffer from a lack of model flexibility and usually fail to solve sub-problems conjointly. As an alternative approach, this work presents a deep reinforcement learning method for solving the global routing problem in a simulated environment. At the heart of the proposed method is deep reinforcement learning that enables an agent to produce a policy for routing based on the variety of problems, and it is presented with leveraging the conjoint optimization mechanism of deep reinforcement learning. Conjoint optimization mechanism is explained and demonstrated in detail; the best network structure and the parameters of the learned model are explored. Based on the fine-tuned model, routing solutions and rewards are presented and analyzed. The results indicate that the approach can outperform the benchmark method of a sequential A* method, suggesting a promising potential for deep reinforcement learning for global routing and other routing or path planning problems in general. Another major contribution of this work is the development of a global routing problem sets generator with the ability to generate parameterized global routing problem sets with different size and constraints, enabling evaluation of different routing algorithms and the generation of training datasets for future data-driven routing approaches.

Author(s):  
Haiguang Liao ◽  
Qingyi Dong ◽  
Xuliang Dong ◽  
Wentai Zhang ◽  
Wangyang Zhang ◽  
...  

Abstract In the physical design of integrated circuits, global and detailed routing are critical stages involving the determination of the interconnected paths of each net on a circuit while satisfying the design constraints. Existing actual routers as well as routability predictors either have to resort to expensive approaches that lead to high computational times, or use heuristics that do not generalize well. Even though new, learning-based routing methods have been proposed to address this need, requirements on labelled data and difficulties in addressing complex design rule constraints have limited their adoption in advanced technology node physical design problems. In this work, we propose a new router — attention router, which is the first attempt to solve the track-assignment detailed routing problem by applying reinforcement learning. Complex design rule constraints are encoded into the routing algorithm and an attention-model-based REINFORCE algorithm is applied to solve the most critical step in routing: sequencing device pairs to be routed. The attention router and its baseline genetic router are applied to solve different commercial advanced technologies analog circuits problem sets. The attention router demonstrates generalization ability to unseen problems and is also able to achieve more than 100× acceleration over the genetic router without severely compromising the routing solution quality. Increasing the number of training problems greatly improves the performance of attention router. We also discover a similarity between the attention router and the baseline genetic router in terms of positive correlations in cost and routing patterns, which demonstrate the attention router’s ability to be utilized not only as a detailed router but also as a predictor for routability and congestion.


Author(s):  
S. Khadpe ◽  
R. Faryniak

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.


Author(s):  
Nicholas Randall ◽  
Rahul Premachandran Nair

Abstract With the growing complexity of integrated circuits (IC) comes the issue of quality control during the manufacturing process. In order to avoid late realization of design flaws which could be very expensive, the characterization of the mechanical properties of the IC components needs to be carried out in a more efficient and standardized manner. The effects of changes in the manufacturing process and materials used on the functioning and reliability of the final device also need to be addressed. Initial work on accurately determining several key mechanical properties of bonding pads, solder bumps and coatings using a combination of different methods and equipment has been summarized.


2021 ◽  
Vol 11 (6) ◽  
pp. 2808
Author(s):  
Leandro H. de S. Silva ◽  
Agostinho A. F. Júnior ◽  
George O. A. Azevedo ◽  
Sergio C. Oliveira ◽  
Bruno J. T. Fernandes

The technological growth of the last decades has brought many improvements in daily life, but also concerns on how to deal with electronic waste. Electrical and electronic equipment waste is the fastest-growing rate in the industrialized world. One of the elements of electronic equipment is the printed circuit board (PCB) and almost every electronic equipment has a PCB inside it. While waste PCB (WPCB) recycling may result in the recovery of potentially precious materials and the reuse of some components, it is a challenging task because its composition diversity requires a cautious pre-processing stage to achieve optimal recycling outcomes. Our research focused on proposing a method to evaluate the economic feasibility of recycling integrated circuits (ICs) from WPCB. The proposed method can help decide whether to dismantle a separate WPCB before the physical or mechanical recycling process and consists of estimating the IC area from a WPCB, calculating the IC’s weight using surface density, and estimating how much metal can be recovered by recycling those ICs. To estimate the IC area in a WPCB, we used a state-of-the-art object detection deep learning model (YOLO) and the PCB DSLR image dataset to detect the WPCB’s ICs. Regarding IC detection, the best result was obtained with the partitioned analysis of each image through a sliding window, thus creating new images of smaller dimensions, reaching 86.77% mAP. As a final result, we estimate that the Deep PCB Dataset has a total of 1079.18 g of ICs, from which it would be possible to recover at least 909.94 g of metals and silicon elements from all WPCBs’ ICs. Since there is a high variability in the compositions of WPCBs, it is possible to calculate the gross income for each WPCB and use it as a decision criterion for the type of pre-processing.


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