Comparative Analysis Between Water-Cooled and Air-Cooled Heat Dissipation in a High-Power Light-Emitting Diode Chipset

2019 ◽  
Vol 11 (6) ◽  
Author(s):  
Yuanlong Chen ◽  
Tingbo Hou ◽  
Minqiang Pan
Keyword(s):  
Thermal Conductivity ◽  
Flow Rate ◽  
High Power ◽  
Heat Dissipation ◽  
Volumetric Flow Rate ◽  
Critical Value ◽  
Input Power ◽  
Substrate Thickness ◽  
Light Emitting ◽  
High Power Led

With a substantial increase in thermal power density, the operating temperature of high-power light-emitting diodes (LEDs) rises rapidly, exerting a notable effect on chipsets’ performance. A water-cooled microchannel radiator and an air-cooled radiator are proposed to solve this problem. The effects of key factors of both radiators on heat dissipation in a high-power LED chipsets, and general comparisons between each method, are analyzed via Fluent. The simulation results indicate that heat dissipation from the water-cooled microchannel radiator is readily affected by the microchannel’s flow rate and aspect ratio. A larger flow rate and larger aspect ratio favor improved heat dissipation in the water-cooled microchannel radiator. Heat dissipation in the air-cooled radiator is related to volumetric flow rate, rib number, rib height, rib thickness, and substrate thickness. A larger volumetric flow rate, rib number, and rib height favor heat dissipation in the air-cooled radiator. However, there is a critical thickness value: if the thickness is less than the critical value, heat dissipation is greatly affected by rib thickness and substrate thickness, if the thickness is larger than the critical value, the influence is insignificant. The high-power LED chipsets’ temperature is also related to the insulating substrate’ input power and thermal conductivity. A large input power leads to a substantial increase in temperature, and larger thermal conductivity of the insulating substrate minimizes temperature increase in the high-power LED chipsets. When comparing the two radiators, results show an air-cooled radiator should be used in low-power LED chipsets. When an air-cooled radiator cannot satisfy the chipset’s needs, a water-cooled microchannel radiator should be utilized.

Thermal Analysis of High Power Light Emitting Diodes Package

2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Thermal Field ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Convective Heat Exchange ◽  
Input Power ◽  
Junction Temperature ◽  
Original Structure ◽  
Light Emitting

With increasing of the input power of the chips in light emitting diode (LED)， the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.

Thermal Management for High Power Light-Emitting Diode Street Lamp

2010 ◽  
Author(s):  
M. Ying ◽  
S. M. L. Nai ◽  
P. Shi ◽  
J. Wei ◽  
C. K. Cheng ◽  
...  
Keyword(s):  
Thermal Management ◽  
Thermal Performance ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
System Level ◽  
Light Emitting ◽  
High Power Led ◽  
Street Lamp ◽  
Lamp System

Light-emitting diode (LED) street lamp has gained its acceptance rapidly in the lighting system as one of choices for low power consumption, high reliability, dimmability, high operation hours, and good color rendering applications. However, as the LED chip temperature strongly affects the optical extraction and the reliability of the LED lamps, LED street lamp performance is heavily relied on a successful thermal management, especially when applications require LED street lamp to operate at high power and hash environment to obtain the desired brightness. As such, a well-designed thermal management, which can lower the LED chip operation temperature, becomes one of the necessities when developing LED street lamp system. The current study developed an effective heat dissipation method for the high power LED street lamp with the consideration of design for manufacturability. Different manufacturable structure designs were proposed for the high power street lamp. The thermal contact conductance between aluminum interfaces was measured in order to provide the system assembly guidelines. The module level thermal performance was also investigated with thermocouples. In addition, finite element (FE) models were established for the temperature simulation of both the module and lamp system. The coefficient of natural convection of the heat sink surface was determined by the correlation of the measurement and simulation results. The system level FE model was employed to optimize and verify the heat dissipation concepts numerically. An optimized structure design and prototype has shown that the high power LED street lamp system can meet the thermal performance requirements.

High Power LED Heat Dissipation Comparison Analysis via Aluminum and Copper Slug

2014 ◽  
Vol 893 ◽  
pp. 811-814
Author(s):  
Rajendaran Vairavan ◽  
Zaliman Sauli ◽  
Vithyacharan Retnasamy
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Comparison Analysis ◽  
Single Chip ◽  
High Power Led ◽  
Von Mises

The vast development of the LED industry has created contemporary set of thermal issues with limits the reliability of the high power LEDs. Thus, this paper reports a simulation analysis done on single chip high power LED package to evalute the effects of heat slug material on the heat dissipation of the LED package. The heat dissipation of two types of heat slug material, aluminum (Al) and copper (Cu) were compared in terms of junction temperature, von Mises stress and thermal resistance of the LED chip at varied input power of 0.1 W and 1W. Results of the analysis showed that the copper heat slug exhibits a better heat dissipation due to its superior thermal conductivity.

Design of the Heat Dissipation for 4W High Power LED Lamp

2012 ◽  
Vol 241-244 ◽  
pp. 734-737
Author(s):  
Chang Yin Gao ◽  
Wan Quan Li
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Input Power ◽  
Maximum Temperature ◽  
Led Lighting ◽  
High Power Led ◽  
Key Factor ◽  
Conduction Mode ◽  
Heat Experiment ◽  
Design Guidance

At present, about 80 ~ 90% of high-power LED input power is converted into heat, so heat dissipation is a key factor affecting the use of LED. By the theory of thermal resistance, the heat conduction mode of the 4W high power LED light is obtained, and the effective cooling area of the LED radiator is computed. According to the EFD method the natural convection thermal analysis is conducted. Finally the heat experiment is conducted to verify the simulation results. The results show that the LED radiator meet the application requirement, namely the maximum temperature is less than 65°C. Undoubtedly the research will provide design guidance on the heat dissipation of LED lighting

Simulation Research on the Heat Dissipation Performance of a High Power LED Radiator

2012 ◽  
Vol 224 ◽  
pp. 389-394
Author(s):  
Shu Zhen Jiang ◽  
Zhong Ning Guo ◽  
Yu Deng
Keyword(s):  
Thermal Analysis ◽  
Life Span ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Environment Friendly ◽  
Simulation Research ◽  
Light Emitting ◽  
High Power Led ◽  
Long Life

Applied in illumination area, high power LED (Light Emitting Diode) has a series of advantages with energy saving, environment-friendly, long life span, etc. However, the heat dissipation of the LED is a bottleneck in its development, and has become a key point which must be studied and solved urgently. In this paper, a typical LED lamp is modeled and thermal analysis has been performed using the software of Ansys.

The Design of High Power LED Headlamp

2013 ◽  
Vol 423-426 ◽  
pp. 2098-2103
Author(s):  
Wen Lin Chen ◽  
Zhen An ◽  
Chao Qun Xiang ◽  
Chen Yang Liu ◽  
Li Na Hao
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Current Drive ◽  
Constant Current ◽  
Light Emitting ◽  
High Power Led ◽  
Drive Circuit ◽  
Led Headlamp ◽  
The Stability

With the continuous development of LED(Light-Emitting Diode) manufacturing technology, the high power white LED is gradually applied in the field of all kinds of lighting .But with working time increasing of LED chips, their junctions temperature continue increasing, which lead to decrease light-emitting efficiency and reliability of LED chip, and even be failure. According to the serious heating of LED chip, this paper has been designed a fin-type aluminum radiator panels using Pro/E software. A LED constant current drive circuit is designed by using LTC3783 chip. With the ANSYS software, thermal analysis was carried out on the fin-type aluminum radiator panels, and eventually the mode of high power LED headlamps is determined. The stability of the LED constant current drive circuit is verified through experiments. The LED headlamps of 90W worked for ten hours, and the results of the experiments showed that the LED chip junctions temperature measured are less than 75°Cso we can solve heat dissipation of high power LED headlamps effectively.

scholarly journals Application of Multiwalled Carbon Nanotube Nanofluid for 450 W LED Floodlight

2014 ◽  
Vol 2014 ◽  
pp. 1-6 ◽  
Author(s):  
Bui Hung Thang ◽  
Le Dinh Quang ◽  
Nguyen Manh Hong ◽  
Phan Hong Khoi ◽  
Phan Ngoc Minh
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Ethylene Glycol ◽  
High Power ◽  
Heat Dissipation ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Multiwalled Carbon ◽  
Cooling Method ◽  
High Power Led

Overheating of the high-power light emitting diode (LED) has a dramatic effect on the chip’s lifetime. Heat dissipation for high-power LED is becoming a major challenge for researchers and technicians. Compared with the air cooling method, the liquid cooling method has many advantages and high efficiency because of higher specific heat capacity, density, and thermal conductivity. Carbon nanotubes with remarkable thermal properties have been used as additives in liquids to increase the thermal conductivity. In this work, multiwalled carbon nanotubes nanofluid (MWCNTs nanofluid) was used to enhance heat dissipation for 450 W LED floodlight. MWCNTs nanofluid was made by dispersing the OH functionalized MWCNTs in ethylene glycol/water solution. The concentration of MWCNTs in fluid was in the range between 0.1 and 1.3 gram/liter. The experimental results showed that the saturated temperature of 450 W LED chip was 55°C when using water/ethylene glycol solution in liquid cooling system. In the case of using MWCNTs nanofluid with 1.2 gram/liter of MWCNTs’ concentration, the saturated temperature of LED chip was 50.6°C. The results have confirmed the advantages of the MWCNTs for heat dissipation systems for high-power LED floodlight and other high power electronic devices.

scholarly journals Thermal conductivity performance of nanoporous plate for high-power LED lighting and power electronics

2019 ◽  
Vol 1309 ◽  
pp. 012016
Author(s):  
A D Kurilov ◽  
V V Belyaev ◽  
K D Nessemon ◽  
E D Besprozvannyi ◽  
A O Osin ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Power Electronics ◽  
High Power ◽  
Led Lighting ◽  
High Power Led

scholarly journals Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang
Keyword(s):  
Light Source ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Distribution ◽  
Light Sources ◽  
Led Light ◽  
High Power Led ◽  
Distribution Requirement ◽  
Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

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