Design of Nonperiodic Microarchitectured Materials That Achieve Graded Thermal Expansions

2016 ◽  
Vol 8 (5) ◽  
Author(s):  
Jonathan B. Hopkins ◽  
Lucas A. Shaw ◽  
Todd H. Weisgraber ◽  
George R. Farquar ◽  
Chris D. Harvey ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Compliant Mechanism ◽  
System Level ◽  
Element Analysis ◽  
Ambient Temperatures ◽  
Thermal Expansion Coefficients ◽  
Layered Coatings ◽  
Unit Cells ◽  
Expansion Coefficients

The aim of this paper is to introduce an approach for optimally organizing a variety of nonrepeating compliant-mechanism-like unit cells within a large deformable lattice such that the bulk behavior of the lattice exhibits a desired graded change in thermal expansion while achieving a desired uniform stiffness over its geometry. Such lattices with nonrepeating unit cells, called nonperiodic microarchitectured materials, could be sandwiched between two materials with different thermal expansion coefficients to accommodate their different expansions and/or contractions induced by changing ambient temperatures. This capability would reduce system-level failures within robots, mechanisms, electronic modules, or other layered coatings or structures made of different materials with mismatched thermal expansion coefficients. The closed-form analytical equations are provided, which are necessary to rapidly calculate the bulk thermal expansion coefficient and Young's modulus of general multimaterial lattices that consist first of repeating unit cells of the same design (i.e., periodic microarchitectured materials). Then, these equations are utilized in an iterative way to generate different rows of repeating unit cells of the same design that are layered together to achieve nonperiodic microarchitectured material lattices such that their top and bottom rows achieve the same desired thermal expansion coefficients as the two materials between which the lattice is sandwiched. A matlab tool is used to generate images of the undeformed and deformed lattices to verify their behavior and an example is provided as a case study. The theory provided is also verified and validated using finite-element analysis (FEA) and experimentation.

scholarly journals Organizing Cells Within Non-Periodic Microarchitectured Materials That Achieve Graded Thermal Expansions

2015 ◽  
Author(s):  
Jonathan B. Hopkins ◽  
Lucas A. Shaw ◽  
Todd H. Weisgraber ◽  
George R. Farquar ◽  
Christopher D. Harvey ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Element Analysis ◽  
Thermal Expansion Coefficients ◽  
Large Lattice ◽  
Unit Cells ◽  
Expansion Coefficients ◽  
Bulk Behavior

The aim of this paper is to introduce an approach for optimally organizing a variety of different unit cell designs within a large lattice such that the bulk behavior of the lattice exhibits a desired Young’s modulus with a graded change in thermal expansion over its geometry. This lattice, called a graded microarchitectured material, can be sandwiched between two other materials with different thermal expansion coefficients to accommodate their different expansions or contractions caused by changing temperature while achieving a desired uniform stiffness. First, this paper provides the theory necessary to calculate the thermal expansion and Young’s modulus of large multi-material lattices that consist of periodic (i.e., repeating) unit cells of the same design. Then it introduces the theory for calculating the graded thermal expansions of a large multimaterial lattice that consists of non-periodic unit cells of different designs. An approach is then provided for optimally designing and organizing different unit cells within a lattice such that both of its ends achieve the same thermal expansion as the two materials between which the lattice is sandwiched. A MATLAB tool is used to generate images of the undeformed and deformed lattices to verify their behavior and various examples are provided as case studies. The theory provided is also verified and validated using finite element analysis and experimentation.

Designing Microstructural Architectures With Thermally Actuated Properties Using Freedom, Actuation, and Constraint Topologies

2013 ◽  
Vol 135 (6) ◽  
Author(s):  
Jonathan B. Hopkins ◽  
Kyle J. Lange ◽  
Christopher M. Spadaccini
Keyword(s):  
Thermal Expansion ◽  
Bulk Material ◽  
Negative Thermal Expansion ◽  
Element Analysis ◽  
Thermal Expansion Coefficients ◽  
Design Requirements ◽  
Expansion Coefficients ◽  
Thermally Actuated ◽  
Constraint Topologies

In this paper, we demonstrate how the principles of the freedom, actuation, and constraint topologies (FACT) approach may be applied to the synthesis, analysis, and optimization of microstructural architectures that possess extreme or unusual thermal expansion properties (e.g., zero or large negative-thermal expansion coefficients). FACT provides designers with a comprehensive library of geometric shapes, which may be used to visualize the regions wherein various microstructural elements can be placed for achieving desired bulk material properties. In this way, designers can rapidly consider and compare a multiplicity of microstructural concepts that satisfy the desired design requirements before selecting the final concept. A complementary analytical tool is also provided to help designers rapidly calculate and optimize the desired thermal properties of the microstructural concepts that are generated using FACT. As a case study, this tool is used to calculate the negative-thermal expansion coefficient of a microstructural architecture synthesized using FACT. The result of this calculation is verified using a finite element analysis (FEA) package called ale3d.

Synthesizing the Compliant Microstructure of Thermally Actuated Materials Using Freedom, Actuation, and Constraint Topologies

2012 ◽  
Author(s):  
Jonathan B. Hopkins ◽  
Kyle J. Lange ◽  
Christopher M. Spadaccini
Keyword(s):  
Thermal Expansion ◽  
Screw Theory ◽  
Bulk Material ◽  
Negative Thermal Expansion ◽  
Thermal Expansion Coefficients ◽  
Final Design ◽  
Expansion Coefficients ◽  
Thermally Actuated ◽  
Constraint Topologies

The aim of this paper is to demonstrate how the principles of the Freedom, Actuation, and Constraint Topologies (FACT) synthesis approach may be applied to the design of compliant microstructural architectures that possess extreme or unusual thermal expansion properties (e.g., zero or large negative thermal expansion coefficients). FACT provides designers with a comprehensive library of geometric shapes, which may be used to visualize the regions wherein various microstructural elements can be placed for achieving desired bulk material properties. In this way, designers can rapidly consider and compare every microstructural concept that best satisfies the design requirements before selecting the final design. A screw-theory-based analytical tool is also provided in this paper to help designers calculate and optimize the thermal properties of microstructural concepts, which are generated using FACT. As a case study, this tool is used to calculate the negative thermal expansion coefficient of a microstructural architecture synthesized using FACT.

Influence of Cr deficiency on sintering, thermal expansion and electrical properties of La0.75Sr0.25Cr1−xO3−δ as a SOFC interconnect material

2016 ◽  
Vol 30 (11) ◽  
pp. 1650127 ◽  
Author(s):  
Yi Ren ◽  
Wen Ma ◽  
Xiaoying Li ◽  
Jun Wang ◽  
Yu Bai ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Electrical Properties ◽  
Perovskite Phase ◽  
Ignition Process ◽  
Thermal Expansion Coefficients ◽  
Auto Ignition ◽  
Pure Perovskite Phase ◽  
Maximum Conductivity ◽  
Expansion Coefficients ◽  
Interconnect Material

The SOFC interconnect materials La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] [Formula: see text]–[Formula: see text] were prepared using an auto-ignition process. The influences of Cr deficiency on their sintering, thermal expansion and electrical properties were investigated. All the samples were pure perovskite phase after sintering at 1400[Formula: see text]C for 4 h. The cell volume of La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] decreased with increasing Cr deficient content. The relative density of the sintered bulk samples increased from 93.2% [Formula: see text] to a maximum value of 94.7% [Formula: see text] and then decreased to 87.7% [Formula: see text]. The thermal expansion coefficients of the sintered bulk samples were in the range of [Formula: see text]–[Formula: see text] (30–1000[Formula: see text]C), which are compatible with that of YSZ. Among the investigated samples, the sample with 0.02 Cr deficiency had a maximum conductivity of 40.4 Scm[Formula: see text] and the lowest Seebeck coefficient of 154.8 [Formula: see text]VK[Formula: see text] at 850[Formula: see text]C in pure He. The experimental results indicate that La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] has the best properties and is much suitable for SOFC interconnect material application.

Novel Silicon-Elastomers for Advanced Soft Lithography

2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi
Keyword(s):  
Thermal Expansion ◽  
High Resolution ◽  
Soft Lithography ◽  
Materials Properties ◽  
Nano Scale ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.

Thermal expansion coefficients of NH4ReO4and NH4IO4down to 58 K

1985 ◽  
Vol 82 (3) ◽  
pp. 1611-1612 ◽  
Author(s):  
Stanley L. Segel ◽  
H. Karlsson ◽  
T. Gustavson ◽  
K. Edstrom
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients
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