A Discussion on Removal Mechanisms in Grinding Polycrystalline Diamond

2015 ◽  
Vol 138 (1) ◽  
Author(s):  
Florestan Schindler ◽  
Richard Brocker ◽  
Fritz Klocke ◽  
Patrick Mattfeld
Keyword(s):  
Material Removal ◽  
Polycrystalline Diamond ◽  
Material Removal Mechanism ◽  
Mesoscopic Scale ◽  
Tool Manufacture ◽  
Brittle Behavior ◽  
Process Characteristics ◽  
Chemical Effects ◽  
Removal Mechanisms ◽  
First Time

Polycrystalline diamond (PCD) grinding takes an important role in the field of tool manufacture. Regardless, there is still lack of process knowledge about the occurring material removal mechanisms in PCD grinding. In order to get a better understanding of the process characteristics, the surface integrity zone of PCD inserts has been analyzed in detail after grinding for the first time. The drawn conclusion questions solely ductile or brittle behavior as removal mechanisms. Both thermal and mechanical process loads during the grinding process lead to thermophysical and chemical effects on a micro- and mesoscopic-scale and might thus have a significant impact on the material removal mechanism.

Studies on the Lapping of Polycrystalline Diamond Compact (PDC)

2011 ◽  
Vol 325 ◽  
pp. 495-501 ◽  
Author(s):  
Jason Sowers ◽  
Alex Fang
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Polycrystalline Diamond ◽  
Size Distributions ◽  
Design Constraints ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms ◽  
Polycrystalline Diamond Compact ◽  
Abrasive Size

Researching the effect that certain parameters have on the lapping process is crucial to understanding the fundamental material removal mechanisms and implementing a procedure that most efficiently produces desired results. This study examines the lapping procedure for polycrystalline diamond compacts (PDCs). Tests were conducted using different sample carriers, PDC arrangements, and abrasive size distributions. Previous studies have focused on the material removal rate (MRR), which is of interest, but this study also examines the MRR uniformity within a group of PDCs lapped together. The goal of this research was to determine the optimal lapping conditions and PDC arrangement required to achieve the highest productivity. Results indicate that a hard specimen carrier is necessary to produce PDCs with uniform MRRs, and the number of PDC samples in a carrier can be increased with certain design constraints kept in mind.

Investigation of Material Removal Mechanism in EDM of Sintered NdFeB Permanent Magnet

2007 ◽  
Vol 334-335 ◽  
pp. 937-940
Author(s):  
Li Li ◽  
Zong Wei Niu ◽  
Jian Hua Zhang
Keyword(s):  
Permanent Magnet ◽  
Material Removal ◽  
Thermal Cracking ◽  
Removal Mechanism ◽  
Whole Grain ◽  
Material Removal Mechanism ◽  
Ndfeb Magnet ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms ◽  
Ndfeb Permanent Magnet

Sintered NdFeB permanent magnet is widely used in many applications because of its excellent magnet property. However the report of EDM research on NdFeB magnet is not available. This paper presents a detailed investigation of the material removal mechanisms of sintered NdFeB magnet through analysis of the machining debris and the surface SEM quality. It is included three types of machining mechanisms: melting and evaporating, thermal cracking, spalling or whole grain removal.

Machinability and Material Removal Mechanism of Face Centred Cubic (FCC) Conductive Ceramic TiBCN in EDM Processing

2016 ◽  
Vol 680 ◽  
pp. 147-151
Author(s):  
Jian Chuang Zhao ◽  
Jian Dong Hu ◽  
Fan You Meng ◽  
Yao Min Wang
Keyword(s):  
Material Removal ◽  
Machining Process ◽  
Pulse Interval ◽  
Material Removal Mechanism ◽  
Machined Surface ◽  
Material Removal Mechanisms ◽  
Interval Time ◽  
Removal Mechanisms ◽  
Discharge Duration

Fcc-TiBCN powder synthesized by boronizing of Ti was pressured into monolithic block by hot pressing (HP) method. Then the block material was machined by wire-cut EDM. The machinability and the material removal mechanisms were discussed of Fcc-TiBCN block in wire-cut EDM. Results show that the machinability of Fcc-TiBCN is satisfying. The discharge current has little relationship on surface roughness in the range of factory-adjusted optimum settings. The discharge duration and pulse interval time play an important role on the quality of machined surface and EDM machining efficiency. In order to obtain excellent quality of the machined surface, the number of power tube turned on can not exceed 6, and the pulse interval time must be as long as possible. The mini roughness of machined surface is 0.4μm～0.6μm as the number of power tube turned on is 5, the pulse interval time and discharge duration is set in the range of 20～22μs and 65～75μm, respectively. There are three material removal mechanisms of TiBCN conductive ceramic in the EDM machining process: spalling, melting and evaporation. Spalling is the main mechanism resulted by thermal stress superposing.

A Discussion on Removal Mechanisms in Grinding Polycrystalline Diamond

2014 ◽  
Author(s):  
Florestan Schindler ◽  
Fritz Klocke ◽  
Richard Brocker ◽  
Patrick Mattfeld
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Polycrystalline Diamond ◽  
Short Review ◽  
Experimental Investigations ◽  
Brittle Behavior ◽  
Removal Mechanisms ◽  
Grinding Machine ◽  
Physical And Chemical ◽  
Tool Grinding

In this paper, the removal mechanisms in grinding polycrystalline diamond (PCD) with vitrified bonded diamond grinding wheels are discussed fundamentally. After a short review about the history of diamond machining, the author summarizes the state of the art in PCD grinding and thus deduces gaps and a deficit in research. In order to analyze occurring removal mechanisms in PCD grinding, tool grinding tests were carried out. For the experimental investigations a conventional tool grinding machine has been modified in order to withstand process loads. Subsequent to the tests, the surface integrity of ground PCD inserts has been analyzed in detail for the first time. Therefore, focused ion beam (FIB) preparation, which has minimum invasive influence on the sub surface, was applied in order to get an insight into the substrate. Gained lamellae have been analyzed with transmission electron microscopy (TEM). The drawn conclusion questions solely ductile or brittle behavior as removal mechanisms. With reference to simulation researches about polishing diamond with diamond, alternative removal mechanisms should be regarded as well. Both, thermal and mechanical process loads might lead to thermo-physical and chemical effects on a microscopic scale which influences the material removal even in grinding.

On the Polishing Techniques of Diamond and Diamond Composites

2009 ◽  
Vol 404 ◽  
pp. 85-96 ◽  
Author(s):  
Y. Chen ◽  
Liang Chi Zhang
Keyword(s):  
Material Removal ◽  
State Of The Art ◽  
Polycrystalline Diamond ◽  
The State ◽  
Dynamic Friction ◽  
Material Removal Mechanisms ◽  
Removal Mechanisms ◽  
Art Techniques

This article reviews the state-of-the-art techniques for polishing diamond and polycrystalline diamond composites. A focus is on their material removal mechanisms and features. It concludes that while each of them has its advantages and drawbacks, the technique by dynamic friction has a promising potential for polishing production.

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