Finite Element Modeling, Analysis, and Life Prediction of Photovoltaic Modules

2013 ◽  
Vol 136 (2) ◽  
Author(s):  
Osama Hasan ◽  
A. F. M. Arif ◽  
M. U. Siddiqui
Keyword(s):  
Finite Element ◽  
Structural Model ◽  
Coefficient Of Thermal Expansion ◽  
High Reliability ◽  
Meteorological Data ◽  
Copper Interconnects ◽  
Pv Module ◽  
Modeling Analysis ◽  
Cte Mismatch ◽  
Lamination Process

A Photovoltaic (PV) module consists of layers of different materials constrained together through an encapsulant polymer. During its lamination and operation, it experiences mechanical and thermal loads due to seasonal and daily temperature variations, which cause breakage of interconnects owing to fatigue. This is due to the fact that there is a coefficient of thermal expansion (CTE) mismatch because of the presence of unlike materials within the laminate. Therefore, thermomechanical stresses are induced in the module. The lifetime of today's PV module is expected to be 25 yr and this period corresponds to the guarantee of the manufacturer. Its high reliability will help it to reach grid parity. But, the problem is that it is not convenient to wait and assess its durability. In this work, material of each component of PV module is characterized and finite-element (FE) structural analysis is performed to find the initial condition of the components of the module after manufacture. It was found that the copper interconnects undergo plastic deformation just after the lamination process. A thermal model was numerically developed and sequentially coupled to the structural model. By using the meteorological data of Jeddah, Saudi Arabia, average life of PV module was estimated to be 26.5 yr.

Finite Element Modeling and Analysis of Photovoltaic Modules

2012 ◽  
Author(s):  
Osama Hasan ◽  
A. F. M. Arif ◽  
M. U. Siddiqui
Keyword(s):  
Finite Element ◽  
Coefficient Of Thermal Expansion ◽  
High Reliability ◽  
Temperature Cycle ◽  
Fe Model ◽  
Modeling And Analysis ◽  
Shell Elements ◽  
Pv Module ◽  
Single Temperature ◽  
Lamination Thickness

A Photovoltaic (PV) module consists of layers of different materials constrained together through an encapsulant polymer. During operation, it experiences mechanical and thermal loads due to seasonal and temperature variations, which cause breakage of interconnects owing to fatigue and laminate warpage. This is due to the fact that there is a coefficient of thermal expansion (CTE) mismatch because of the presence of unlike materials within the laminate. Therefore, thermo-mechanical stresses are induced in the module. Glass, being the thickest of all in the module, plays a significant role in the stressing of components. The lifetime of today’s PV module is expected to be 25 years and this period corresponds to the guarantee of the manufacturer. Its high reliability will help it to reach grid parity. But the problem is that it is not convenient to wait and assess its durability. Qualification standards such as ASTM E1171-09 are useful in predicting a module’s failure. In this work, material of each component of the PV module is characterized and then the implementation of material models is discussed. A Finite-Element (FE) model of 36 cell PV module is developed using 2D layered shell elements in ANSYS. A single temperature cycle of ASTM E1171-09 is simulated after lamination procedure and 24 hour storage at constant temperature. The FE model is validated by simulating an experimental procedure in the literature by determining change of cell gap during the temperature cycle. Finally, parametric studies are performed with respect to lamination thickness.

scholarly journals Investigation on Die Crack in a Stacked Die Package Using Finite Element Analysis

2021 ◽  
pp. 83-91
Author(s):  
Jefferson Talledo
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Coefficient Of Thermal Expansion ◽  
Crack Problem ◽  
Element Analysis ◽  
Robust Solution ◽  
Die Attach ◽  
Die Stress ◽  
Cte Mismatch ◽  
Semiconductor Packages

Die crack is one of the problems in stacked die semiconductor packages. As silicon dies become thinner in such packages due to miniaturization requirement, the tendency to have die crack increases. This study presents the investigation done on a die crack issue in a stacked die package using finite element analysis (FEA). The die stress induced during the package assembly processes from die attach to package strip reflow was analyzed and compared with the actual die crack failure in terms of the location of maximum die stress at unit level as well as strip level. Stresses in the die due to coefficient of thermal expansion (CTE) mismatch of the package component materials and mechanical bending of the package in strip format were taken into consideration. Comparison of the die stress with actual die crack pointed to strip bending as the cause of the problem and not CTE mismatch. It was found that the die crack was not due to the thermal processes involved during package assembly. This study showed that analyzing die stress using FEA could help identify the root cause of a die crack problem during the stacked die package assembly and manufacturing as crack occurs at locations of maximum stress. The die crack mechanism can also be understood through FEA simulation and such understanding is very important in coming up with robust solution.

scholarly journals Simulation of Process-Stress Induced Warpage of Silicon Wafers Using ANSYS® Finite Element Analysis

2010 ◽  
Vol 2010 (1) ◽  
pp. 000364-000371 ◽  
Author(s):  
Aditi Mallik ◽  
Roger Stout
Keyword(s):  
Finite Element ◽  
Thermal Stresses ◽  
Coefficient Of Thermal Expansion ◽  
Thin Film Deposition ◽  
Silicon Wafers ◽  
Film Deposition ◽  
Intrinsic Stress ◽  
Back Side ◽  
Cte Mismatch ◽  
Saddle Shape

Wafers warp. It is important to minimize warpage in order to achieve optimal die yield and potentially prevent future device failure. Although the word warpage is widely used in the literature to represent wafer bow (convex or concave shape), in the real world wafers are often seen into warp into saddle shapes. This complicates the characterization of both the sources of and solutions to warpage, because (as will be discussed) Stoney's formula (relating intrinsic stress and curvature) does not apply for structures warped with compound curvature, and standard wafer warpage measurements are not designed to measure compound curvature. During thin film deposition, wafer warpage occurs due to the intrinsic stresses and the coefficient of thermal expansion (CTE) mismatch of the different thin films and the substrate. Unfortunately, whereas the introduction of the thermal stresses due to CTE mismatch into a finite element model is easily understood, the introduction of intrinsic stress is not. Further, although a saddle shape is clearly a physically realizable (indeed, often preferred) equilibrium configuration for a circular disk (consistent with an appropriate state of stress), obtaining a saddle shape in a finite element solution turns out to be extremely difficult, as convex or concave shapes may also be stable and numerically preferred. In this paper, a finite element technique (using ANSYS software) to model wafer warpage is presented. Simulations have been done for silicon wafers with aluminum or standard UBM films on top. Saddle-shaped warpage has been successfully modeled, and the aggravating effects of thinning (back side grinding) have been reproduced.

Modeling, Analysis and Fatigue Life Prediction of Lower Suspension Arm

2011 ◽  
Vol 264-265 ◽  
pp. 1557-1562 ◽  
Author(s):  
M.M. Rahman ◽  
M.M. Noor ◽  
K. Kadirgama ◽  
M.A. Maleque ◽  
Rosli A. Bakar
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Life Prediction ◽  
Structural Model ◽  
Element Model ◽  
Maximum Principal Stress ◽  
Fatigue Life Prediction ◽  
Element Analysis ◽  
Suitable Material ◽  
Modeling Analysis

This paper was presented the finite element modeling, analysis and fatigue life prediction of lower suspension arm using the strain-life approach. Aluminum alloys are selected as a suspension arm materials. The structural model of the suspension arm was utilizing the Solid works. The finite element model and analysis were performed utilizing the finite element analysis code. TET10 mesh and maximum principal stress were considered in the linear static stress analysis and the critical location was considered at node (6017). From the fatigue analysis, Smith-Watson- Topper mean stress correction was conservative method when subjected to SAETRN loading, while Coffin-Manson model is applicable when subjected to SAESUS and SAEBRKT loading. From the material optimization, 7075-T6 aluminum alloy is suitable material of the suspension arm.

Use of the Finite Element Analysis Method in Pedodontics

2018 ◽  
Vol 55 (4) ◽  
pp. 666-675
Author(s):  
Mihaela Tanase ◽  
Dan Florin Nitoi ◽  
Marina Melescanu Imre ◽  
Dorin Ionescu ◽  
Laura Raducu ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Structural Model ◽  
Analysis Method ◽  
Ansys Software ◽  
Concentrated Force ◽  
Element Analysis ◽  
Finite Element Analysis Method ◽  
The Finite Element Analysis ◽  
Solid Type

The purpose of this study was to determinate , using the Finite Element Analysis Method, the mechanical stress in a solid body , temporary molar restored with the self-curing GC material. The originality of our study consisted in using an accurate structural model and applying a concentrated force and a uniformly distributed pressure. Molar structure was meshed in a Solid Type 45 and the output data were obtained using the ANSYS software. The practical predictions can be made about the behavior of different restorations materials.

scholarly journals Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging

Micromachines ◽  
2021 ◽  
Vol 12 (3) ◽  
pp. 295
Author(s):  
Pao-Hsiung Wang ◽  
Yu-Wei Huang ◽  
Kuo-Ning Chiang
Keyword(s):  
Finite Element ◽  
Thermal Cycling ◽  
Glass Substrate ◽  
High Speed ◽  
Coefficient Of Thermal Expansion ◽  
Three Dimensional ◽  
Design Parameters ◽  
Time To Failure ◽  
Wafer Level ◽  
Fine Pitch

The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent characteristics, glass is a good material for high-speed transmission applications. Therefore, this study proposes a fan-out wafer-level packaging (FO-WLP) with glass substrate-type PoP. The reliability life of the proposed FO-WLP was evaluated under thermal cycling conditions through finite element simulations and empirical calculations. Considering the simulation processing time and consistency with the experimentally obtained mean time to failure (MTTF) of the packaging, both two- and three-dimensional finite element models were developed with appropriate mechanical theories, and were verified to have similar MTTFs. Next, the FO-WLP structure was optimized by simulating various design parameters. The coefficient of thermal expansion of the glass substrate exerted the strongest effect on the reliability life under thermal cycling loading. In addition, the upper and lower pad thicknesses and the buffer layer thickness significantly affected the reliability life of both the FO-WLP and the FO-WLP-type PoP.

Modal Analysis of the Axial Compressor Blade: Advanced Time-Dependent Electronic Interferometry and Finite Element Method

2020 ◽  
Vol 0 (0) ◽  
Author(s):  
Mykhaylo Tkach ◽  
Serhii Morhun ◽  
Yuri Zolotoy ◽  
Irina Zhuk
Keyword(s):  
Experimental Data ◽  
Mathematical Model ◽  
Finite Element ◽  
High Reliability ◽  
Axial Compressor ◽  
Time Dependent ◽  
Experimental Setup ◽  
Vibration Modes ◽  
Compressor Blades ◽  
Isoparametric Finite Element

AbstractNatural frequencies and vibration modes of axial compressor blades are investigated. A refined mathematical model based on the usage of an eight-nodal curvilinear isoparametric finite element was applied. The verification of the model is carried out by finding the frequencies and vibration modes of a smooth cylindrical shell and comparing them with experimental data. A high-precision experimental setup based on an advanced method of time-dependent electronic interferometry was developed for this aim. Thus, the objective of the study is to verify the adequacy of the refined mathematical model by means of the advanced time-dependent electronic interferometry experimental method. The divergence of the results of frequency measurements between numerical calculations and experimental data does not exceed 5 % that indicates the adequacy and high reliability of the developed mathematical model. The developed mathematical model and experimental setup can be used later in the study of blades with more complex geometric and strength characteristics or in cases when the real boundary conditions or mechanical characteristics of material are uncertain.

Extraction of the Coefficient of Thermal Expansion of Thin Films from Buckled Membranes

1998 ◽  
Vol 546 ◽  
Author(s):  
V. Ziebartl ◽  
O. Paul ◽  
H. Baltes
Keyword(s):  
Thin Films ◽  
Finite Element ◽  
Thermal Expansion ◽  
Silicon Nitride ◽  
Excellent Agreement ◽  
Energy Minimization ◽  
Coefficient Of Thermal Expansion ◽  
Temperature Dependent ◽  
Minimization Method ◽  
Energy Minimization Method

AbstractWe report a new method to measure the temperature-dependent coefficient of thermal expansion α(T) of thin films. The method exploits the temperature dependent buckling of clamped square plates. This buckling was investigated numerically using an energy minimization method and finite element simulations. Both approaches show excellent agreement even far away from simple critical buckling. The numerical results were used to extract Cα(T) = α0+α1(T−T0 ) of PECVD silicon nitride between 20° and 140°C with α0 = (1.803±0.006)×10−6°C−1, α1 = (7.5±0.5)×10−9 °C−2, and T0 = 25°C.

Fitness for Service Assessments of Bulging and Out-of-Round Structures

2004 ◽  
Author(s):  
Peter Carter ◽  
D. L. Marriott ◽  
M. J. Swindeman
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Internal Pressure ◽  
Structural Model ◽  
External Pressure ◽  
Element Analysis ◽  
Structural Imperfection ◽  
Level 2

This paper examines techniques for the evaluation of two kinds of structural imperfection, namely bulging subject to internal pressure, and out-of-round imperfections subject to external pressure, with and without creep. Comparisons between comprehensive finite element analysis and API 579 Level 2 techniques are made. It is recommended that structural, as opposed to material, failures such as these should be assessed with a structural model that explicitly represents the defect.

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