Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

2013 ◽  
Vol 135 (3) ◽  
Author(s):  
Nicolas Lamaison ◽  
Jackson Braz Marcinichen ◽  
John Richard Thome
Keyword(s):  
Heat Flux ◽  
Steady State ◽  
Flow Control ◽  
Parallel Flow ◽  
Heat Fluxes ◽  
Vapor Quality ◽  
Two Phase ◽  
Cooling Cycle ◽  
Chip Temperature ◽  
Test Loop

On-chip two-phase cooling of parallel pseudo-CPUs integrated into a liquid pumped cooling cycle is modeled and experimentally verified versus a prototype test loop. The system's dynamic operation is studied since the heat dissipated by microprocessors is continuously changing during their operation and critical heat flux (CHF) conditions in the microevaporator must be avoided by flow control of the pump speed during heat load disturbances. The purpose here is to cool down multiple microprocessors in parallel and their auxiliary electronics (memories, dc/dc converters, etc.) to emulate datacenter servers with multiple CPUs. The dynamic simulation code was benchmarked using the test results obtained in an experimental facility consisting of a liquid pumped cooling cycle assembled in a test loop with two parallel microevaporators, which were evaluated under steady-state and transient conditions of balanced and unbalanced heat fluxes on the two pseudochips. The errors in the model's predictions of mean chip temperature and mixed exit vapor quality at steady state remained within ±10%. Transient comparisons showed that the trends and the time constants were satisfactorily respected. A case study considering four microprocessors cooled in parallel flow was then simulated for different levels of heat flux in the microprocessors (40, 30, 20, and 10 W cm−2), which showed the robustness of the predictive-corrective solver used. For a desired mixed vapor exit quality of 30%, at an inlet pressure and subcooling of 1600 kPa and 3 K, the resulting distribution of mass flow rate in the microevaporators was, respectively, 2.6, 2.9, 4.2, and 6.4 kg h−1 (mass fluxes of 47, 53, 76 and 116 kg m−2 s−1) and yielded approximately uniform chip temperatures (maximum variation of 2.6, 2, 1.7, and 0.7 K). The vapor quality and maximum chip temperature remained below the critical limits during both transient and steady-state regimes.

Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors

2013 ◽  
Author(s):  
Nicolas Lamaison ◽  
Jackson B. Marcinichen ◽  
John R. Thome
Keyword(s):  
Heat Flux ◽  
Heat Load ◽  
Cooling System ◽  
Saturation Temperature ◽  
Vapor Quality ◽  
Two Phase ◽  
Chip Temperature ◽  
High Heat Transfer ◽  
On Chip ◽  
Liquid Pump

Transient modeling and control of two-phase on-chip microevaporator cold plates of a liquid pump cooling cycle is studied. The purpose is to cool down multiple micro-processors in parallel and their auxiliary electronics (memories, DC/DC converters, etc.) in series. The cooling system is composed of multiple on-chip microevaporators in parallel, a condenser, a liquid accumulator, a liquid pump and all piping joining these components. In order to achieve high heat transfer and chip temperature uniformity, two-phase flow of HFC134a is considered for the coolant. The dynamics of the system are relevant aspects to be studied since the heat dissipated by the microprocessors is changing continuously. Thus, a new simulation code has been developed here to emulate the operation during transients. Such transient simulations allow us to verify whether critical heat flux (CHF) conditions are reached during heat load disturbances and to track the available heat at the condenser for energy recovery purposes. Presently, a case study with four microprocessors cooled in parallel flow is simulated considering different levels of uniform heat flux (36, 30, 25 and 10 Wcm−2), which showed the robustness of the predictive-corrective solver used. For a desired exit mixing vapor quality of 30%, at an inlet pressure and subcooling of respectively 16 bar (saturation temperature of 57.9 °C) and 2 K, the resulting distribution of the mass flow rates in the microevaporators were 3.6, 4.0, 4.5 and 7.4 kg/h (largest flow rate for lowest heat load) and the total pressure drop over the entire section was 0.6 kPa. The CHF and maximum chip temperature remained below of the critical limits. Preliminary comparisons with experimental tests showed errors in the predictions of mean chip temperature and mixing vapor quality to be within ±10%.

scholarly journals Experimental Investigation and Prediction on Pressure Drop during Flow Boiling in Horizontal Microchannels

Micromachines ◽  
2021 ◽  
Vol 12 (5) ◽  
pp. 510
Author(s):  
Yan Huang ◽  
Bifen Shu ◽  
Shengnan Zhou ◽  
Qi Shi
Keyword(s):  
Pressure Drop ◽  
Flow Model ◽  
Two Phase Flow ◽  
Flow Boiling ◽  
Separated Flow ◽  
Heat Fluxes ◽  
Phase Flow ◽  
Vapor Quality ◽  
Two Phase ◽  
Gas Flux

In this paper, two-phase pressure drop data were obtained for boiling in horizontal rectangular microchannels with a hydraulic diameter of 0.55 mm for R-134a over mass velocities from 790 to 1122, heat fluxes from 0 to 31.08 kW/m2 and vapor qualities from 0 to 0.25. The experimental results show that the Chisholm parameter in the separated flow model relies heavily on the vapor quality, especially in the low vapor quality region (from 0 to 0.1), where the two-phase flow pattern is mainly bubbly and slug flow. Then, the measured pressure drop data are compared with those from six separated flow models. Based on the comparison result, the superficial gas flux is introduced in this paper to consider the comprehensive influence of mass velocity and vapor quality on two-phase flow pressure drop, and a new equation for the Chisholm parameter in the separated flow model is proposed as a function of the superficial gas flux . The mean absolute error (MAE ) of the new flow correlation is 16.82%, which is significantly lower than the other correlations. Moreover, the applicability of the new expression has been verified by the experimental data in other literatures.

Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

2015 ◽  
Author(s):  
Raphael Mandel ◽  
Serguei Dessiatoun ◽  
Patrick McCluskey ◽  
Michael Ohadi
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Saturation Temperature ◽  
Absolute Pressure ◽  
High Flux ◽  
Vapor Quality ◽  
Two Phase ◽  
Fluid Delivery ◽  
Future Work

This work presents the experimental design and testing of a two-phase, embedded manifold-microchannel cooler for cooling of high flux electronics. The ultimate goal of this work is to achieve 0.025 cm2-K/W thermal resistance at 1 kW/cm2 heat flux and evaporator exit vapor qualities at or exceeding 90% at less than 10% absolute pressure drop. While the ultimate goal is to obtain a working two-phase embedded cooler, the system was first tested in single-phase mode to validate system performance via comparison of experimentally measured heat transfer coefficient and pressure drop to the values predicted by CFD simulations. Upon validation, the system was tested in two phase mode using R245fa at 30°C saturation temperature and achieved in excess of 1 kW/cm2 heat flux at 45% vapor quality. Future work will focus on increasing the exit vapor quality as well as use of SiC for the heat transfer surface upon completion of current experiments with Si.

Inverse Determination of Temperature-Dependent Thermal Conductivity Using Steady Surface Data on Arbitrary Objects

2000 ◽  
Vol 122 (3) ◽  
pp. 450-459 ◽  
Author(s):  
T. J. Martin ◽  
G. S. Dulikravich
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Steady State ◽  
Measurement Errors ◽  
Three Dimensional ◽  
Convection Heat Transfer ◽  
Computational Procedure ◽  
Heat Fluxes ◽  
Computational Method ◽  
Transfer Coefficients

An inverse computational method has been developed for the nonintrusive and nondestructive evaluation of the temperature-dependence of thermal conductivity. The methodology is based on an inverse computational procedure that can be used in conjunction with an experiment. Given steady-state heat flux measurements or convection heat transfer coefficients on the surface of the specimen, in addition to a finite number of steady-state surface temperature measurements, the algorithm can predict the variation of thermal conductivity over the entire range of measured temperatures. Thus, this method requires only one temperature probe and one heat flux probe. The thermal conductivity dependence on temperature (k-T curve) can be completely arbitrary, although a priori knowledge of the general form of the k-T curve substantially improves the accuracy of the algorithm. The influence of errors of measured surface temperatures and heat fluxes on the predicted thermal conductivity has been evaluated. It was found that measurement errors of temperature up to five percent standard deviation were not magnified by this inverse procedure, while the effect of errors in measured heat fluxes were even lower. The method is applicable to two-dimensional and three-dimensional solids of arbitrary shape and size. [S0022-1481(00)01703-5]

High Heat Flux Subcooled Flow Boiling of Methanol in Microtubes

2015 ◽  
Author(s):  
Farzad Houshmand ◽  
Hyoungsoon Lee ◽  
Mehdi Asheghi ◽  
Kenneth E. Goodson
Keyword(s):  
Heat Flux ◽  
Pressure Drop ◽  
Flow Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
Two Phase ◽  
Subcooled Flow Boiling ◽  
Subcooled Flow ◽  
Inner Diameter ◽  
Phase Pressure

As the proper cooling of the electronic devices leads to significant increase in the performance, two-phase heat transfer to dielectric liquids can be of an interest especially for thermal management solutions for high power density devices with extremely high heat fluxes. In this paper, the pressure drop and critical heat flux (CHF) for subcooled flow boiling of methanol at high heat fluxes exceeding 1 kW/cm2 is investigated. Methanol was propelled into microtubes (ID = 265 and 150 μm) at flow rates up to 40 ml/min (mass fluxes approaching 10000 kg/m2-s), boiled in a portion of the microtube by passing DC current through the walls, and the two-phase pressure drop and CHF were measured for a range of operating parameters. The two-phase pressure drop for subcooled flow boiling was found to be significantly lower than the saturated flow boiling case, which can lead to lower pumping powers and more stability in the cooling systems. CHF was found to be increasing almost linearly with Re and inverse of inner diameter (1/ID), while for a given inner diameter, it decreases with increasing heated length.

Variations of Buoyancy-Induced Mass Flux From Single-Phase to Two-Phase Flow in a Vertical Porous Tube With Constant Heat Flux

1999 ◽  
Vol 121 (3) ◽  
pp. 646-652 ◽  
Author(s):  
T. S. Zhao ◽  
Q. Liao ◽  
P. Cheng
Keyword(s):  
Heat Flux ◽  
Mass Flux ◽  
Single Phase ◽  
Two Phase Flow ◽  
Constant Heat Flux ◽  
Heat Fluxes ◽  
Phase Flow ◽  
Constant Heat ◽  
Two Phase ◽  
Porous Tube

This paper presents an experimental study of a buoyancy-induced flow of water with phase-change heat transfer in a vertical porous tube heated at a constant heat flux. Experiments were carried out from subcooled liquid flow to connective boiling by varying the imposed heat fluxes. At a prescribed heat flux the steady-state mass flux of water, as well as the temperatures along the tube wall and along the centerline of the packed tube, were measured. It is shown that for both single-phase flow and the two-phase flow with a rather low vapor fraction, the induced mass flux increased as the heat flux was increased. However, as the imposed heat flux was increased further, the induced mass flux dropped drastically, and remained relatively constant afterwards. The influences of various parameters such as the porous tube diameter, the particle sizes, and the hydrostatic head on the induced mass flux are also examined.

scholarly journals Numerical Simulation of Evaporating Two-Phase Flow in a High-Aspect-Ratio Microchannel with Bends

2017 ◽  
Vol 139 (8) ◽  
Author(s):  
Adam Girard ◽  
Seung M. You ◽  
Suresh V. Garimella
Keyword(s):  
Heat Flux ◽  
Contact Angle ◽  
Flow Boiling ◽  
Vertical Component ◽  
Hydrophobic Surface ◽  
Surface Tension Force ◽  
Heat Fluxes ◽  
Vertical Force ◽  
Two Phase ◽  
Hydrophobic Contact

Flow boiling was investigated on a hydrophobic surface by coating Teflon® onto a 1×1 cm2 copper surface, resulting in contact angle of 118°. The images depicted were taken using distilled water flowing at 299 kg/m2s with 3°C subcooling. In the first series, the number of active nucleation sites increased as heat flux increased. For lower values of heat flux (< 80 kW/m2), vapor bubbles remained almost stationary on the surface. The hydrophobic contact angle makes the horizontal component of surface tension force act radially outward, causing the bubble interface to grow. This leads to increased triple contact line and increased vertical component surface force. The buoyancy force due to the vapor bubble volume appears to be insufficient to overcome this vertical force for liftoff. This explains the stationary bubbles observed at the lower heat fluxes. The bubbles show an increase in size and number with heat flux. After this increasing trend, the bubble continues to grow larger when heat flux is higher than 80 kW/m2, eventually leading to the dryout at 117.5 kW/m2. The later bubble growth at high heat fluxes is caused primarily by the coalescences of neighboring bubbles. These larger bubbles are more affected by flow induced drag forces and move downstream. This can be seen in the lower sequential series at 100 kW/m2. The larger vapor masses slide across the surface, continue to absorb smaller bubbles as they move downstream, and are swept off the surface.

A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

2015 ◽  
Vol 137 (4) ◽  
Author(s):  
Craig Green ◽  
Peter Kottke ◽  
Xuefei Han ◽  
Casey Woodrum ◽  
Thomas Sarvey ◽  
...  
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Three Dimensional ◽  
High Heat ◽  
Heat Fluxes ◽  
Thermal Design ◽  
High Heat Flux ◽  
Two Phase ◽  
Forced Cooling ◽  
Fluidic Routing

Three-dimensional (3D) stacked electronics present significant advantages from an electrical design perspective, ranging from shorter interconnect lengths to enabling heterogeneous integration. However, multitier stacking exacerbates an already difficult thermal problem. Localized hotspots within individual tiers can provide an additional challenge when the high heat flux region is buried within the stack. Numerous investigations have been launched in the previous decade seeking to develop cooling solutions that can be integrated within the 3D stack, allowing the cooling to scale with the number of tiers in the system. Two-phase cooling is of particular interest, because the associated reduced flow rates may allow reduction in pumping power, and the saturated temperature condition of the coolant may offer enhanced device temperature uniformity. This paper presents a review of the advances in two-phase forced cooling in the past decade, with a focus on the challenges of integrating the technology in high heat flux 3D systems. A holistic approach is applied, considering not only the thermal performance of standalone cooling strategies but also coolant selection, fluidic routing, packaging, and system reliability. Finally, a cohesive approach to thermal design of an evaporative cooling based heat sink developed by the authors is presented, taking into account all of the integration considerations discussed previously. The thermal design seeks to achieve the dissipation of very large (in excess of 500 W/cm2) background heat fluxes over a large 1 cm × 1 cm chip area, as well as extreme (in excess of 2 kW/cm2) hotspot heat fluxes over small 200 μm × 200 μm areas, employing a hybrid design strategy that combines a micropin–fin heat sink for background cooling as well as localized, ultrathin microgaps for hotspot cooling.

Thermal Management of Time-Varying High Heat Flux Electronic Devices

2014 ◽  
Vol 136 (2) ◽  
Author(s):  
T. David ◽  
D. Mendler ◽  
A. Mosyak ◽  
A. Bar-Cohen ◽  
G. Hetsroni
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Steady State ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Heat Fluxes ◽  
Vapor Quality ◽  
Flow Loop ◽  
Pin Fin ◽  
The Heat Transfer Coefficient

The thermal characteristics of a laboratory pin-fin microchannel heat sink were empirically obtained for heat flux, q″, in the range of 30–170 W/cm2, mass flux, m, in the range of 230–380 kg/m2 s, and an exit vapor quality, xout, from 0.2 to 0.75. Refrigerant R 134a (HFC-134a) was chosen as the working fluid. The heat sink was a pin-fin microchannel module installed in open flow loop. Deviation from the measured average temperatures was 1.5 °C at q = 30 W/cm2, and 2.0 °C at q = 170 W/cm2. These results indicate that use of pin-fin microchannel heat sink enables keeping an electronic device near uniform temperature under steady state and transient conditions. The heat transfer coefficient varied significantly with refrigerant quality and showed a peak at an exit vapor quality of 0.55 in all the experiments. At relatively low heat fluxes and vapor qualities, the heat transfer coefficient increased with vapor quality. At high heat fluxes and vapor qualities, the heat transfer coefficient decreased with vapor quality. A noteworthy feature of the present data is the larger magnitude of the transient heat transfer coefficients compared to values obtained under steady state conditions. The results of transient boiling were compared with those for steady state conditions. In contrast to the more common techniques, the low cost technique, based on open flow loop was developed to promote cooling using micropin fin sinks. Results of this experimental study may be used for designing the cooling high power laser and rocket-born electronic devices.

A Revised Methodology to Assess In-Vessel Retention Strategy for High-Power Reactors

2018 ◽  
Author(s):  
F. Fichot ◽  
L. Carénini ◽  
W. Villanueva ◽  
S. Bechta
Keyword(s):  
Heat Flux ◽  
Steady State ◽  
High Power ◽  
Molten Pool ◽  
Metal Layer ◽  
Heat Fluxes ◽  
Standard Approach ◽  
Primary Circuit ◽  
Focusing Effect ◽  
Safety Margins

The In-Vessel Retention (IVR) strategy for Light Water Reactors (LWR) intends to stabilize and isolate corium and fission products in the reactor pressure vessel and in the primary circuit. This type of Severe Accident Management (SAM) strategy has already been incorporated in the design and SAM guidances (SAMGs) of several operating small and medium capacity LWRs (reactors below 500 MWe, e.g. VVER440) and is part of the SAMG strategies for some Gen III+ PWRs of higher power such as the AP1000 or the APR1400. However, the demonstration of IVR feasibility for high power reactors requires using less conservative models as the safety margins are reduced. In Europe, the IVMR project aims at providing new experimental data and a harmonized methodology for IVR. A synthesis of the methodology applied to demonstrate the efficiency of IVR strategy for VVER-440 in Europe (Finland, Slovakia, Hungary and Czech Republic) was made. It showed very consistent results, following quite comparable methodologies. The main weakness was identified in the evaluation of the heat flux that could be reached in transient situations, e.g. under the “3-layers” configuration, where the “focusing effect” may cause higher heat fluxes than in steady-state (due to transient “thin” metal layer on top). Analyses of various designs of reactors with a power between 900 and 1300 MWe were also made. Different models for the description of the molten pool were used: homogeneous, stratified with fixed configuration, stratified with evolving configuration. The last type of model provides the highest heat fluxes (above 3 W/m2) whereas the first type provides the lowest heat fluxes (around 500 kW/m2) but this model is not realistic due to the immiscibility of molten steel with oxide melt. Obviously, there is a need to reach a consensus about best estimate practices for IVR assessment to be used in the major codes used for safety analysis, such as ASTEC, MELCOR, SOCRAT, MAAP, ATHLET-CD, SCDAP/RELAP, etc. Despite the model discrepancies, and leaving aside the unrealistic case of homogeneous pool, the average calculated heat fluxes can reach, in many cases, values which are well above 1 MW/m2. This could reduce the residual thickness of the vessel considerably and threaten its strength and integrity. Therefore, it is clear that the safety demonstration of IVR in high power reactors requires a more careful evaluation of the situations which can lead to formation of either a very thin top metal layer provoking the focusing effect or significantly overheated metal, e.g. after oxide and metal layer inversion. Both situations are illustrated in this paper. The demonstration also requires an accurate thermo-mechanical analysis of the ablated vessel. The standard approach based on “yield stress” (plastic behaviour) is compared with more detailed calculations made on realistic profiles of ablated vessels. The validity of the standard approach is discussed. The current approach followed by many experts for IVR is a compromise between a deterministic analysis using the significant knowledge gained during the last two decades and a probabilistic analysis to take into account large uncertainties due to the lack of data for some physical phenomena, e.g. associated with molten pool transient behaviour, and due to excessive simplifications of models. A harmonization of the positions of safety authorities on the IVR strategy is necessary to allow decision making based on shared scientific knowledge. Some elements that might help to reach such harmonization are proposed in this paper, with a preliminary revision of the methodology that could be used to address the IVR issue. In the proposed revised methodology, the safety criterion is not based on a comparison of the heat flux and the Critical Heat Flux (CHF) profiles as in the current approaches but on the minimum vessel thickness reached after ablation and the maximum pressure load that is applied to the vessel during the transient. The main advantage of this revised criterion is in consideration of both steady-state and transient loads on the RPV. Another advantage is that this criterion is more straightforward to be used in a deterministic approach.

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