Charging Station of a Planar Miniature Heat Pipe Thermal Ground Plane

2012 ◽  
Vol 135 (2) ◽  
Author(s):  
Mohammed T. Ababneh ◽  
Shakti Chauhan ◽  
Frank M. Gerner ◽  
Doug Hurd ◽  
Peter de Bock ◽  
...  
Keyword(s):  
High Performance ◽  
Ground Plane ◽  
Heat Pipes ◽  
Working Fluid ◽  
Liquid Volume ◽  
Two Phase ◽  
Gravitational Fields ◽  
Charging Station ◽  
Error Characterization ◽  
Key Factor

Thermal ground planes (TGPs) are planar, thin (thickness of 3 mm or less) heat pipes which use two-phase heat transfer. The objective is to utilize TGPs as thermal spreaders in several microelectronic cooling applications. TGPs are innovative high-performance, integrated systems able to operate at a high power density with a reduced weight and temperature gradient. Moreover, being able to dissipate large amounts of heat, they have very high effective axial thermal conductivities and can operate in high adverse gravitational fields due to nanoporous wicks. A key factor in the design of the TGP is evacuation prior to filling and introduction of the proper amount of working fluid (water) into the device. The major challenge of this work is to fill heat pipes with a total liquid volume of less than 1 ml, without being able to see into the device. The current filling station is an improvement over the current state of the art as it allows for accurate filling of microliter sized volumes. Tests were performed to validate performance of the system and to verify that little to no noncondensable gasses were introduced to the system. Careful calibration of the amount of liquid introduced is important. Therefore, calibration of the burettes utilized for a liquid fill range of 0.01 ml to 100 ml was important. The magnitude of the pressure inside the TGP device is also an important factor. Charging station validation demonstrated the capability of charging TGPs with accuracy of ±1.64 μl. Calibration curves for the burettes and error characterization curves for a range of liquid charging volumes will be presented and discussed in this paper.

Charging Station of a Planar Miniature Thermal Ground Plane

2011 ◽  
Author(s):  
Mohammed T. Ababneh ◽  
Frank M. Gerner ◽  
Doug Hurd ◽  
Peter de Bock ◽  
Shakti Chauhan ◽  
...  
Keyword(s):  
Ground Plane ◽  
Heat Pipes ◽  
Working Fluid ◽  
Liquid Volume ◽  
Two Phase ◽  
Charging Station ◽  
Filling Station ◽  
Error Characterization ◽  
Wide Range ◽  
Key Factor

Thermal ground planes (TGPs) are flat thin (less than 1 mm thick) heat pipes that can be used as a thermal spreader in a variety of microelectronic cooling applications. Like conventional heat pipes, TGP’s utilize two-phase cooling. Major advantages, include the ability to integrate directly with the microelectronic substrate for a wide range of applications; and the ability to operate in an adverse gravity environment of up to 20g. Other advantages include a very high thermal conductivity, reliability, no moving parts, electrodes, or need for external power. A key factor in the design of the TGP is evacuation prior to filling and introduction of the proper amount of working fluid (water) into the device. The major challenge of this work is to fill heat pipes with a total liquid volume of less than 1 ml, without being able to see into the device. The current filling station is an improvement over the current state of the art as it allows for accurate filling of micro liter sized volumes. Tests were performed to validate performance of the system and to verify that little to no non-condensable gasses were introduced to the system. Careful calibration of the amount of liquid introduced is essential. Therefore, calibration of the burettes utilized for a liquid fill range of 0.1 ml to 100ml was important. The magnitude of the pressure inside the TGP envelope is also an important factor. Calibration curves for the burettes and error characterization curves for a range of liquid charging volumes will be presented and discussed.

Development and Experimental Validation of a Micro/Nano Thermal Ground Plane

2011 ◽  
Author(s):  
H. Peter J. de Bock ◽  
Shakti Chauhan ◽  
Pramod Chamarthy ◽  
Chris Eastman ◽  
Stanton Weaver ◽  
...  
Keyword(s):  
Experimental Validation ◽  
Ground Plane ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Working Fluid ◽  
Heat Sources ◽  
Two Phase ◽  
Evaporation And Condensation ◽  
Two Phase Heat Transfer ◽  
Thermal Ground Plane

Heat pipes are commonly used in electronics cooling applications to spread heat from a concentrated heat source to a larger heat sink. Heat pipes work on the principles of two-phase heat transfer by evaporation and condensation of a working fluid. The amount of heat that can be transported is limited by the capillary and hydrostatic forces in the wicking structure of the device. Thermal ground planes are two-dimensional high conductivity heat pipes that can serve as thermal ground to which heat can be rejected by a multitude of heat sources. As hydrostatic forces are dependent on gravity, it is commonly known that heat pipe and thermal ground plane performance is orientation dependent. The effect of variation of gravity force on performance is discussed and the development of a miniaturized thermal ground plane for high g operation is described. In addition, experimental results are presented from zero to −10g acceleration. The study shows and discusses that minimal orientation or g-force dependence can be achieved if pore dimensions in the wicking structure can be designed at micro/nano-scale dimensions.

Experimental Study of Linear and Radial Two-Phase Heat Transport Devices Driven by Electrohydrodynamic Conduction Pumping

2015 ◽  
Vol 137 (2) ◽  
Author(s):  
Matthew R. Pearson ◽  
Jamal Seyed-Yagoobi
Keyword(s):  
Heat Source ◽  
Capillary Pressure ◽  
Heat Transport ◽  
Radial Direction ◽  
Heat Pipes ◽  
Working Fluid ◽  
Phase Flow ◽  
Transport Capacity ◽  
Two Phase ◽  
Capillary Phenomenon

Heat pipes are well known as simple and effective heat transport devices, utilizing two-phase flow and the capillary phenomenon to remove heat. However, the generation of capillary pressure requires a wicking structure and the overall heat transport capacity of the heat pipe is generally limited by the amount of capillary pressure generation that the wicking structure can achieve. Therefore, to increase the heat transport capacity, the capillary phenomenon must be either augmented or replaced by some other pumping technique. Electrohydrodynamic (EHD) conduction pumping can be readily used to pump a thin film of a dielectric liquid along a surface, using electrodes that are embedded into the surface. In this study, two two-phase heat transport devices are created. The first device transports the heat in a linear direction. The second device transports the heat in a radial direction from a central heat source. The radial pumping configuration provides several advantages. Most notably, the heat source is wetted with fresh liquid from all directions, thereby reducing the amount of distance that must be travelled by the working fluid. The power required to operate the EHD conduction pumps is a trivial amount relative to the heat that is transported.

scholarly journals An investigation on effect of EDL on heat transfer of micro heat pipe with square and triangular cross section

2020 ◽  
Vol 21 (3) ◽  
pp. 309
Author(s):  
Maryam Fallah Abbasi ◽  
Hossein Shokouhmand ◽  
Morteza Khayat
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Double Layer ◽  
Electric Double Layer ◽  
Heat Pipes ◽  
The Body ◽  
Working Fluid ◽  
Two Phase ◽  
Micro Heat Pipe ◽  
Micro Heat Pipes

Electronic industries have always been trying to improve the efficiency of electronic devices with small dimensions through thermal management of this equipment, thus increasing the use of small thermal sinks. In this study micro heat pipes with triangular and square cross sections have been manufactured and tested. One of the main objectives is to obtain an understanding of micro heat pipes and their role in energy transmission with electrical double layer (EDL). Micro heat pipes are highly efficient heat transfer devices, which use the continuous evaporation/condensation of a suitable working fluid for two-phase heat transport in a closed system. Since the latent heat of vaporization is very large, heat pipes transport heat at small temperature difference, with high rates. Because of variety of advantage features these devices have found a number of applications both in space and terrestrial technologies. The theory of operation micro heat pipes with EDL is described and the micro heat pipe has been studied. The temperature distribution have achieved through five thermocouples installed on the body. Water and different solution mixture of water and ethanol have used to investigate effect of the electric double layer heat transfer. It was noticed that the electric double layer of ionized fluid has caused reduction of heat transfer.

Heat Transport Characteristics in Closed Loop Oscillating Heat Pipes

2005 ◽  
Author(s):  
Shuangfeng Wang ◽  
Shigefumi Nishio
Keyword(s):  
Heat Pipe ◽  
Heat Transport ◽  
Closed Loop ◽  
Flow Behavior ◽  
Working Fluid ◽  
Liquid Volume ◽  
High Heat Flux ◽  
Two Phase ◽  
Working Fluids ◽  
Inner Diameter

Heat transport rates of micro scale SEMOS (Self-Exciting Mode Oscillating) heat pipe with inner diameter of 1.5mm, 1.2mm and 0.9mm, were investigated by using R141b, ethanol and water as working fluids. The effects of inner diameter, liquid volume faction, and material properties of the working fluids are examined. It shows that the smaller the inner diameter, the higher the thermal transport density is. For removing high heat flux, the water is the most promising working fluid as it has the largest critical heat transfer rate and the widest operating range among the three kinds of working fluids. A one-dimensional numerical simulation is carried out to describe the heat transport characteristics and the two-phase flow behavior in the closed loop SEMOS heat pipe. The numerical prediction agrees with the experimental results fairly well, when the input heat through was not very high and the flow pattern was slug flow.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

Factors Affecting Oil Removal From an Aeroengine Bearing Chamber

2010 ◽  
Author(s):  
Budi Chandra ◽  
Kathy Simmons ◽  
Stephen Pickering ◽  
Marc Tittel
Keyword(s):  
Heat Generation ◽  
Volumetric Flow Rate ◽  
Volume Measurement ◽  
Working Fluid ◽  
Liquid Volume ◽  
Simple Liquid ◽  
Oil Removal ◽  
Two Phase ◽  
Ongoing Research ◽  
Excessive Heat

Aeroengines incorporate various bearing chambers that house the shaft bearings and the oil used to cool and lubricate these bearings must subsequently be recovered from these chambers. Effective oil removal (scavenge) is essential to avoid heat generation through unnecessary working of the oil which can lead to excessive heat generation and reduced overall efficiency. Therefore the design of the scavenge region (sump) in a bearing chamber, as well as the ability to assess its performance is very important. An ongoing research program into bearing chamber scavenge comprising experimental and computational components is being conducted at the University of Nottingham Technology Centre in Gas Turbine Transmission Systems. This program is enhancing understanding of sump performance and design. In this paper an experimental study into a simplified but representative scavenge is reported. This experimental work helps to further understanding of the complex two-phase flow physics in a bearing chamber, particularly in the scavenge region, by means of various measurements and flow visualization. For the study a bespoke test rig has been built. It consists of a simplified, generic bearing chamber with simple sump geometry constructed entirely of Perspex to allow visualization. A shaft in the centre of the chamber capable of rotating up to 15,000 rpm is employed to introduce a windage flow in the chamber. Water (the working fluid) is fed to the chamber via an inlet pump and an outlet pump removes liquid from the chamber, closing the circuit. Several pneumatic pinch valves are installed in the flow circuit to allow residence volume measurement. A completely air-tight reservoir with internal baffle functions as a simple liquid-gas separator, allowing measurement of gas volumetric flow rate in the off-take pipe; hence the scavenge ratio (ratio of total exit volume to liquid volume) can be obtained. Residence volume measurements highlight the importance of sump geometry as an ill-designed sump can lead to an undesirable increase in residence volume.

Experimental Study on Applied Thin Vapor Chamber and Embedded Heat Pipe Heat Sinks

2009 ◽  
Author(s):  
Garrett A. Glover ◽  
Yongguo Chen ◽  
Annie Luo ◽  
Herman Chu
Keyword(s):  
Heat Pipe ◽  
Heat Sink ◽  
High Performance ◽  
Structural Integrity ◽  
Heat Pipes ◽  
Electronic Cooling ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Trade Offs ◽  
Pipe Heat

The current work is a survey of applied applications of passive 2-phase technologies, such as heat pipe and vapor chamber, in heat sink designs with thin base for electronic cooling. The latest improvements of the technologies and manufacturing processes allow achievable heat sink base thickness of 3 mm as compared to around 5 mm previously. The key technical challenge has been on maintaining structural integrity for adequate hollow space for the working fluid vapor in order to retain high performance while reducing the thickness of the overall vapor chamber or flattened heat pipe. Several designs of thin vapor chamber base heat sink and embedded heat pipe heat sink from different vendors are presented for a moderate power density application of a 60 W, 13.2 mm square heat source. Numerous works have been published by both academia and commercial applications in studying the fundamental science of passive 2-phase flow technologies; their performance has been compared to solid materials, like aluminum and copper. These works have established the merits of using heat pipes and vapor chambers in electronic cooling. The intent of this paper is to provide a methodical approach to help to accelerate the process in evaluating the arrays of different commercial designs of these devices in our product design cycle. In this paper, the trade-offs between the different types of technologies are discussed for parameters such as performance advantages, physical attributes, and some cost considerations. This is a bake-off evaluation of the complete heat sink solutions from the various vendors and not a fundamental research of vapor chambers and heat pipes — for that, it is best left to the vendors and universities.

A Comprehensive Experimental Investigation of the Performance of Closed-Loop Pulsating Heat Pipes

2017 ◽  
Vol 139 (9) ◽  
Author(s):  
M. Halimi ◽  
A. Abbas Nejad ◽  
M. Norouzi
Keyword(s):  
Thermal Resistance ◽  
Flow Regime ◽  
Thermal Performance ◽  
Closed Loop ◽  
Heat Pipes ◽  
Filling Ratio ◽  
Working Fluid ◽  
Physical Parameters ◽  
Two Phase ◽  
Laboratory Conditions

Closed-loop pulsating heat pipes (CLPHPs) are a new type of two-phase heat transfer devices that can transfer considerable heat in a small space via two-phase vapor and liquid pulsating flow and work with various types of two-phase instabilities so the operating mechanism of CLPHP is not well understood. In this work, two CLPHPs, made of Pyrex, were manufactured to observe and investigate the flow regime that occurs during the operation of CLPHP and thermal performance of the device under different laboratory conditions. In general, various working fluids were used in filling ratios of 40%, 50%, and 60% in horizontal and vertical modes to investigate the effect of thermo-physical parameters, filling ratio, nanoparticles, gravity, CLPHP structure, and input heat flux on the thermal performance of CLPHP. The results indicate that three types of flow regime may be observed given laboratory conditions. Each flow regime exerts a different effect on the thermal performance of the device. There is an optimal filling ratio for each working fluid. The increased number of turns in CLPHP generally improves the thermal performance of the system reducing the effect of the type of the working fluid on the aforementioned performance. The adoption of copper nanoparticles, which positively affect fluid motion, decreases the thermal resistance of the system as much as 6.06–42.76% depending on laboratory conditions. Moreover, gravity brings about positive changes in the flow regime decreasing thermal resistance as much as 32.13–52.58%.

Minimizing the Wick Thickness in a Planar Microscale Loop Heat Pipe Using Efficient Thermodynamic Design

2011 ◽  
Author(s):  
Navdeep S. Dhillon ◽  
Jim C. Cheng ◽  
Albert P. Pisano
Keyword(s):  
Heat Flow ◽  
Heat Pipe ◽  
Thermal Characteristics ◽  
Heat Pipes ◽  
Working Fluid ◽  
Loop Heat Pipe ◽  
Two Phase ◽  
Loop Heat Pipes ◽  
Evaporator Section ◽  
Compensation Chamber

Theoretical and numerical thermodynamic analysis of the evaporator section of a planar microscale loop heat pipe is presented, to minimize the permissible wick thickness in such a device. In conventional cylindrical loop heat pipes, a minimum wick thickness is required in order to reduce parasitic heat flow, and prevent vapor leakage, into the compensation chamber. By taking advantage of the possibilities allowed by microfabrication techniques, a planar evaporator/compensation chamber design topology is proposed to overcome this limitation, which will enable wafer-based loop heat pipes with device thicknesses on the order of a millimeter or less. Thermodynamic principles governing two-phase flow of the working fluid in a loop heat pipe are analyzed to elucidate the fundamental requirements that would characterize the startup and steady state operation of a planar phase-change device. A three dimensional finite element thermal-fluid solver is implemented to study the thermal characteristics of the evaporator section and compensation chamber regions of a planar vertically wicking micro-columnated loop heat pipe. The use of in-plane thermal conduction barriers to reduce parasitic heat flow into the compensation chamber is demonstrated.

A Compact Integrated Thermosyphon Heat Sink for Power Electronics Cooling

2019 ◽  
Author(s):  
Ahmed Elkholy ◽  
Roger Kempers
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Flow Boiling ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Heat Sinks ◽  
Working Fluid ◽  
Convection Heat ◽  
Two Phase ◽  
Spreading Resistance

Abstract The trend in miniaturization of power electronic components requires the development of new robust and passive cooling methods to meet increased heat flux demands. Conventional heat sinks encounter inherent shortcomings due to heat spreading resistance of the heat sink baseplate particularly in natural convection heat sinks used to cool small localized heat sources. Heat pipes embedded within the base of heat sinks can be used to improve spreading performance but are limited by the ability to conduct heat into and out of the heat pipes. In the current study, a small, naturally aspirated two-phase thermosyphon heat sink was developed and characterized experimentally. The proposed architecture integrates all thermosyphon components into one compact device, where the evaporator, riser and the downcomer are incorporated at the heat sink base. The downcomer also serves as the condenser within the base of a vertical finned natural convection heat sink. The side-heated evaporator consists of an array mini-channels configuration which can operate in either pool boiling or flow boiling configuration, which allows the thermosyphon heat sink to operate in either reflux mode or looped mode, respectively. Experiments were carried out using HFE 7000 as the working fluid. The effect of the of input power on the thermal performance is examined for both modes for powers ranging from 10 to 80 W. Results demonstrate that this approach significantly reduces the spreading resistance resulting in a net improvement which can be traded-off for a decrease the overall size or weight of the heat sink.

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