Thermal Conductivity of Diamond-Containing Grease

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Hung-En Chou ◽  
Shang-Ray Yang ◽  
Sea-Fue Wang ◽  
James C. Sung
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Filler Content ◽  
Electronic Devices ◽  
Terminal Group ◽  
Thermal Interface Material ◽  
Particle Sizes ◽  
Thermal Interface ◽  
Thermal Grease ◽  
Single Filler

As a thermal interface material, thermal grease (TG) has been extensively applied to facilitate heat dissipation in electronic devices. Despite the superior thermal conductivity of diamond, researches on diamond-containing TGs remain rare. In this study, four kinds of TGs in which diamond served as essential filler were prepared and hot disk technique was applied to measure their thermal conductivity k(TG). After two unoverlapped particle sizes were selected, the volumetric filler content, terminal group, and viscosity of a polydimethylsiloxane (PDMS) matrix were modified in sequence. Based on the preferred recipe of a single-filler TG, two double-filler TG series were prepared by retaining the large diamonds and replacing the small ones by Al2O3 or ZnO, respectively. Depending on the content, it was found that diamond was not always the best choice for small filler. The highest k(TG), which was 23 times greater than the original k(PDMS), appeared in a ZnO-containing double-filler grease (=3.52 W/mK). The prediction for the maximum attainable thermal conductivity was preliminarily supported.

Development of High Thermally Conductive Die Attach for TIM Applications

2019 ◽  
Vol 2019 (1) ◽  
pp. 000312-000315
Author(s):  
Maciej Patelka ◽  
Sho Ikeda ◽  
Koji Sasaki ◽  
Hiroki Myodo ◽  
Nortisuka Mizumura
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Power Semiconductor ◽  
Die Attach ◽  
Industry Standards ◽  
Thermally Conductive ◽  
Low Modulus ◽  
Thermal Grease

Abstract High power semiconductor applications require a Thermal Interface Die Attach Material with high thermal conductivity to efficiently release the heat generated from these devices. Current Thermal Interface Material solutions such as thermal grease, thermal pads and silicones have been industry standards, however may fall short in performance for high temperature or high-power applications. This presentation will focus on development of a cutting-edge Die Attach Solution for Thermal Interface Management, focusing on Fusion Type epoxy-based Ag adhesive with an extremally low Storage Modulus and the Thermal Conductivity reaching up to 30W/mK, and also Very Low Modulus, Low-Temperature Pressureless Sintered Silver Die Attach with the Thermal Conductivity of 70W/mK.

scholarly journals Application of Graphene Silicone Grease in heat dissipation for the Intel Core i5 Processor

2019 ◽  
Vol 3 (2-2) ◽  
Author(s):  
Phuong Thi Mai ◽  
Tuan Anh Bui ◽  
Hau Van Tran ◽  
Trinh Van Pham ◽  
Dinh Nang Nguyen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Saturation Temperature ◽  
High Energy ◽  
Thermal Interface Material ◽  
Thermal Dissipation ◽  
Single Layer Graphene ◽  
Silicone Grease ◽  
Uniform Dispersion ◽  
Thermal Grease

Graphene was known as the material that owning many superiority properties and high thermal conductivity. Thermal conductivity of single-layer graphene was up to 5200 W/mK (compared to the thermal conductivity of Carbon nanotubes 2000 W/mK and Silver 410 W/mK). This had suggested that graphene is the most potential material for heat dissipation applications for electronic devices, such as a computer microprocessor, high power LED... To enhance the dispersion of the GNPs silicone matrix, we were functionalized graphene nanoplatelets (GNPs) with carboxyl (-COOH) groups. The silicone thermal greases containing GNPs were prepared by High- Energy Ball Milling method (8000D Mixer /Mill). The results of SEM, FTIR, Raman showed the presence of the carboxyl groups in GNPs and GNPs uniform dispersion dispersed in grease. The results of thermal conductivity from Transient Hot Bridge THB-100 showed that thermal conductivity enhancement was up to 234 % with Gr-COOH 1.0 vol.%. Thermal grease is used as a thermal interface material to coolants for Intel Core i5 processor. The results of thermal dissipation efficiency shown the saturation temperature of the processor using thermal grease containing 1.0 vol.% Gr-COOH decreased 4℃, compared to the silicone grease.

scholarly journals Thermal Conductivity Characterization of Thermal Grease Containing Copper Nanopowder

Materials ◽  
2020 ◽  
Vol 13 (8) ◽  
pp. 1893 ◽  
Author(s):  
Haneul Kang ◽  
Hyunji Kim ◽  
Jihye An ◽  
Siyeon Choi ◽  
Jinho Yang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Internal Heat ◽  
Upward Trend ◽  
Heat Transfer Medium ◽  
Conductive Materials ◽  
Increasing Trend ◽  
Thermal Grease

As electronic devices and mainboards become smaller, the need for thermal conductive materials having excellent internal heat dissipation is increasing. In this study, nano thermal grease was prepared by mixing in copper nanopowder, which is used as a heat transfer medium in thermal grease, which is a kind of thermal conductive material, with silicon oil. In addition, copper powder was mixed with graphene and alumina, respectively, and the thermal conductivity performance was compared. As a result, the thermal conductivity improved by 4.5 W/m·k over the silicon base, and the upward trend of thermal conductivity increased steadily up to 15 vol. %, and the increasing trend decreased after 20 vol. %. In addition, the increased rate of thermal conductivity from 0 to 5 vol. % and 10 to 15 vol. % was the largest.

Thermal Conductivity Enhancement in Polymer-Clay Nanocomposite Using Casting Techniques

2020 ◽  
Vol 995 ◽  
pp. 15-20
Author(s):  
Ivy Ann C. Razonado ◽  
Emee Grace T. Suarnaba ◽  
Lawrence V. Madriaga ◽  
Leslie Joy L. Diaz
Keyword(s):  
Thermal Conductivity ◽  
Heat Dissipation ◽  
Thermal Conductivity Coefficient ◽  
Unsaturated Polyester ◽  
Tape Casting ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Conductivity Enhancement ◽  
Casting Technique ◽  
Polymer Clay Nanocomposite

Nowadays, there is a need for efficiency and miniaturization in electronic products. However, in the chip level, heat dissipation can limit the performance of these gadgets. Semiconductor industries addressed this thermal management challenge by using thermal interface material. Previous studies have shown that polymer-clay nanocomposite has an enhanced thermal conductivity which can be used as a thermal interface material. In this study, the aim was to determine the effect of casting techniques on the microstructure and thermal conductivity of the polymer-clay nanocomposites. Solution intercalation method was used in fabricating the 5vol% polymer-clay nanocomposite. Organo-modified montmorillonite (MMT) was dispersed in unsaturated polyester (UP) matrix by means of high frequency ultrasonication and formed using two casting techniques; mold casting and tape casting. Results showed a slight increase in the thermal conductivity coefficient of the tape-casted samples at 2.99 W/m-K compared to the mold-casted samples at 2.87 W/m-K. Transmission electron microscopy (TEM) and x-ray diffraction (XRD) results exhibited dispersed microstructure for both casting techniques. Polymer intercalation of ~16% increase in d-spacing of clay for mold-casted samples and with a ~20% increase in d-spacing of clay for tape-casted samples were observed. With these microstructure modifications, the increase in the thermal conductivity coefficient of the tape-casted samples can be attributed to the shear force employed by the tape casting technique.

scholarly journals Synthesis of Nitrogen-Doped Graphene on Copper Nanowires for Efficient Thermal Conductivity and Stability by Using Conventional Thermal Chemical Vapor Deposition

Nanomaterials ◽  
2019 ◽  
Vol 9 (7) ◽  
pp. 984 ◽  
Author(s):  
Minjeong Park ◽  
Seul-Ki Ahn ◽  
Sookhyun Hwang ◽  
Seongjun Park ◽  
Seonpil Kim ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Growth Temperature ◽  
Electronic Devices ◽  
Oxidation Stability ◽  
Thermal Interface Material ◽  
Amine Group ◽  
Thermal Interface ◽  
Aspect Ratios ◽  
Doped Graphene

Cu nanowires (NWs) possess remarkable potential a slow-cost heat transfer material in modern electronic devices. However, Cu NWs with high aspect ratios undergo surface oxidation, resulting in performance degradation. A growth temperature of approximately <1000 °C is required for preventing the changing of Cu NW morphology by the melting of Cu NWs at over 1000 °C. In addition, nitrogen (N)-doped carbon materials coated on Cu NWs need the formation hindrance of oxides and high thermal conductivity of Cu NWs. Therefore, we investigated the N-doped graphene-coated Cu NWs (NG/Cu NWs) to enhance both the thermal conductivity and oxidation stability of Cu NWs. The Cu NWs were synthesized through an aqueous method, and ethylenediamine with an amine group induced the isotropic growth of Cu to produce Cu NWs. At that time, the amine group could be used as a growth source for the N-doped graphene on Cu NWs. To grow an N-doped graphene without changing the morphology of Cu NWs, we report a double-zone growth process at a low growth temperature of approximately 600 °C. Thermal-interface material measurements were conducted on the NG/Cu NWs to confirm their applicability as heat transfer materials. Our results show that the synthesis technology of N-doped graphene on Cu NWs could promote future research and applications of thermal interface materials in air-stable flexible electronic devices.

scholarly journals Development of High Thermally Conductive Die Attach for TIM Applications

2020 ◽  
Vol 17 (3) ◽  
pp. 106-109
Author(s):  
Maciej Patelka ◽  
Sho Ikeda ◽  
Koji Sasaki ◽  
Hiroki Myodo ◽  
Nortisuka Mizumura
Keyword(s):  
Thermal Conductivity ◽  
High Power ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Power Semiconductor ◽  
Die Attach ◽  
Industry Standards ◽  
Thermally Conductive ◽  
Low Modulus ◽  
Thermal Grease

Abstract High-power semiconductor applications require a thermal interface die attach material with high thermal conductivity to efficiently release the heat generated from these devices. Current thermal interface material solutions such as thermal grease, thermal pads, and silicones have been industry standards, however may fall short in performance for high-temperature or high-power applications. This article focuses on development of a cutting-edge die attach solution for thermal interface management, focusing on fusion-type epoxy-based Ag adhesive with an extremely low storage modulus and the thermal conductivity reaching up to 30 W/mK, and also very low-modulus, low-temperature pressureless sintering silver die attach with a thermal conductivity of 70 W/mK.

A Study on the Thermal Conductivity of Thermal Grease According to Cu-Ni Content

2021 ◽  
Vol 880 ◽  
pp. 71-76
Author(s):  
Haneul Kang ◽  
Hyunji Kim ◽  
Sunghoon Im ◽  
Jinho Yang ◽  
Sunchul Huh
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Electronic Device ◽  
Thermal Contact ◽  
Thermal Characteristics ◽  
Internal Heat ◽  
Thermal Interface Material ◽  
Thermal Grease

An increase in power consumption density is related to the internal thermal characteristics of an electronic device, and the heat dissipation of the device is directly related to the high performance and miniaturization of the device. TIM (thermal interface material) with excellent internal heat dissipation performance are mainly used to improve the heat dissipation performance of electronic devices. Recently, the need for a high-efficiency TIM with high-performance thermal conductivity and low thermal contact resistance has increased. In this study, thermal grease was prepared by mixing Cu-Ni nanopowders with silicon oil, the thermal grease was then used as a heat transfer material. Compared to silicone thermal grease, the thermal conductivity of all prepared samples was excellent. In particularly, thermal conductivity was improved by about maximum 212% compared to that of thermal silicone of thermal grease mixed with Cu-Ni powder.

Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus

2005 ◽  
Vol 128 (1) ◽  
pp. 46-52 ◽  
Author(s):  
Jong-Jin Park ◽  
Minoru Taya
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Network Model ◽  
Thermal Interface Material ◽  
Thermal Impedance ◽  
Thermal Interface ◽  
Resistor Network ◽  
New Device ◽  
Thermal Grease ◽  
Measured Thermal Conductivity

A thermal interface material (TIM) is a crucial material for transferring heat from a die to a heatsink. We developed a new TIM composed of carbon nanotubes, silicon thermal grease, and chloroform. The thermal impedance of the TIM was measured using a new device based on thermometer principles to measure thermal impedance and resistance. This device consists of an alumina substrate, titanium tungsten (TiW) layers, gold layers, and thin alumina layers. Then the measured thermal conductivity of the TIM was compared with predictions made by the thermal resistor network model, and the experimental results were found to be consistent with the predictions made by the model.

scholarly journals Rheological Properties and Thermal Conductivity of Epoxy Resins Filled with a Mixture of Alumina and Boron Nitride

Polymers ◽  
2019 ◽  
Vol 11 (4) ◽  
pp. 597 ◽  
Author(s):  
Van-Dung Mai ◽  
Dae-Il Lee ◽  
Jun-Hong Park ◽  
Dai-Soo Lee
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Electronic Packaging ◽  
Epoxy Resins ◽  
Heat Dissipation ◽  
Filler Content ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Packaging Materials ◽  
Thermally Conductive

Electronic packaging materials with high thermal conductivity and suitable viscosity are necessary in the manufacturing of highly integrated electronic devices for efficient heat dissipation during operation. This study looked at the effect of boron nitride (BN) platelets on the rheology and thermal conductivity of composites based on alumina (Al2O3) and epoxy resin (EP) for the potential application as electronic packaging. The viscosity and thermal conductivity of the composite were increased upon increasing filler content. Furthermore, thermal conductivity of the BN/Al2O3/EP was much higher than that of Al2O3/EP at almost the same filler loadings. These unique properties resulted from the high thermal conductivity of the BN and the synergistic effect of the spherical and plate shapes of these two fillers. The orientation of BN platelets can be controlled by adjusting their loading to facilitate the formation of higher thermally conductive pathways. The optimal content of the BN in the Al2O3/EP composites was confirmed to be 5.3 vol %, along with the maximum thermal conductivity of 4.4 W/(m·K).

Thermal conduction characteristics of silicone composites including ultrasonic-treated graphite

2021 ◽  
pp. 002199832110595
Author(s):  
Weontae Oh ◽  
Jong-Seong Bae ◽  
Hyoung-Seok Moon
Keyword(s):  
Thermal Conductivity ◽  
Ultrasonic Treatment ◽  
Thermal Conduction ◽  
Light Emitting Diode ◽  
Thermal Interface Material ◽  
Ultrasonic Power ◽  
Lighting System ◽  
Thermal Interface ◽  
Light Emitting ◽  
Inorganic Oxides

The microstructural change of graphite was studied after ultrasonic treatment of the graphite. When the graphite solution was treated with varying ultrasonic power and time, the microstructure changed gradually, and accordingly, the thermal conductivity characteristics of the composite containing the as-treated graphite was also different with each other. Thermal conductivity showed the best result in the silicone composite containing graphite prepared under the optimum condition of ultrasonic treatment, and the thermal conductivity of the composite improved proportionally along with the particle size of graphite. When the silicone composite was prepared by using a mixture of inorganic oxides and graphite rather than graphite alone, the thermal conductivity of the silicone composite was further increased. A silicone composite containing graphite was used for LED (light emitting diode) lighting system as a thermal interface material (TIM), and the temperature elevation due to heat generated, while the lighting was actually operated, was analyzed.

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