Further Observations on A533-B Steel Plate Tailored for Improved Radiation Embrittlement Resistance

1976 ◽  
Vol 98 (2) ◽  
pp. 111-117 ◽  
Author(s):  
J. R. Hawthorne

A series of advanced investigations on the radiation performance of four 6-in-thick plates from a large (30-ton) commercial melt of A533-B steel is described. The melt represented the first commercial scale demonstration test of improved radiation embrittlement resistance through the control (minimization) of selected residual impurity elements. Melt specifications emphasized the attainment of a low copper and phosphorus content; one half of the melt was modified, however, by a copper addition (0.03 percent Cu increased to 0.13 percent Cu). Initial plate tests described superior 550 F (288 C) radiation resistance, in terms of notch ductility retention, for the primary melt composition and verified the detrimental influence of impurity copper on irradiation behavior. Promising capability of the primary melt composition for very high fluence (∼2.5 × 1020 n/cm2 > 1 MeV) service is shown by the current investigations. In addition, a significant influence of copper content on radiation resistance is revealed for a broad range of exposure temperatures. A dependence of 650 F (343 C) postirradiation heat treatment response (notch ductility recovery) on copper content was also found. Charpy-V versus dynamic tear test performance and tensile strength trends with temperature are examined for low (<450 F, 121 C) and elevated (550 to 585 F, 288 to 307 C) temperature irradiation conditions.

1998 ◽  
Vol 540 ◽  
Author(s):  
S. Ohnuki ◽  
K. Shiba ◽  
Y. Kohno ◽  
A. Kohyama ◽  
J. P. Robertson ◽  
...  

AbstractSingle variable experiments are being conducted to study effects of H/He/dpa on properties based on isotopically tailored alloys. 54Fe has been used to prepare an isotopically tailored duplicate of the commercial steel F82H, and a small number of TEM disks have been irradiated in order to study radiation embrittlement. From single disk specimens, mechanical properties were obtained using a shear punch technique that produces a 1 mm blank from the 3 mm disk, and microstructural information was obtained from the 1 mm blanks thinned to electron transparency.


1992 ◽  
Author(s):  
A V Sobolev ◽  
L V Dmitriev ◽  
O P Tsameryan ◽  
N N Kononkova ◽  
P T Robinson

1972 ◽  
Vol 94 (3) ◽  
pp. 807-814 ◽  
Author(s):  
J. R. Hawthorne ◽  
E. Fortner

Experimental weld filler metals having high resistance to radiation embrittlement at ≃550 F (288 C) have been developed for quenched and tempered A543 and A542 steel. The filler metals are from a special 2-1/4 Cr-1 Mo-0.40Si-0.10C composition series formulated to study the effects of variable copper, nickel, and manganese contents on weld performance. This report presents an advanced evaluation of weld deposit performance based on new Charpy-V (Cv) and tension data and an analysis of temper embrittlement and radiation embrittlement processes. High fluence assessments confirm the high resistance to radiation embrittlement of the low copper content filler metal group. A 530 F (277 C) irradiation of one typical submerged arc weld deposit to a fluence of 3.8 × 1020 n/cm2 &gt; 1 MeV did not elevate its Cv 30 ft-lb transition temperature to above 275 F (135 C) or reduce its Cv shelf energy level to below 50 ft-lb. Radiation embrittlement saturation was not evident. Temper embrittlement and radiation embrittlement development and the probable mechanisms of copper and phosphorus influences on radiation embrittlement sensitivity are analyzed with the aid of experimental data for the weld metals and A543 plate. Temper embrittlement and radiation embrittlement are shown to be additive effects which can occur simultaneously or sequentially. A separate component of irradiation effects, manifested as a strength increase without embrittlement, is revealed. The enhancement of radiation sensitivity by high copper content (≧0.16–0.27 percent Cu) is related to a copper influence on the radiation elevation of yield strength; the enhancement of radiation sensitivity of phosphorus is ascribed to a detrimental effect similar to that of temper embrittlement. It is proposed that copper acts to pin radiation-induced defect aggregates and dislocation arrays in the matrix and that phosphorus segregates during irradiation to weaken the interface of ferrite platelets and carbides.


2014 ◽  
Vol 7 (6) ◽  
pp. 464-469 ◽  
Author(s):  
I. R. Sides ◽  
M. Edmonds ◽  
J. Maclennan ◽  
D. A. Swanson ◽  
B. F. Houghton

10.30544/80 ◽  
2015 ◽  
Vol 21 (3) ◽  
pp. 195-206 ◽  
Author(s):  
M. Dehnavi ◽  
F. Kuhestani ◽  
M. Haddad-Sabzevar

There are many techniques available for investigating the solidification of metals and alloys. In recent years computer-aided cooling curve analysis (CA-CCA) has been used to determine thermo-physical properties of alloys, latent heat and solid fraction. In this study, the effect of cooling rate and copper addition was taken into consideration in non- equilibrium eutectic transformation of binary Al- Cu melt via cooling curve analysis. For this purpose, melts with different copper weight percent of 2.2, 3.7 and 4.8 were prepared and cooled in controlled rates of 0.04 and 0.42 °C/s. Results show that, latent heat of alloy highly depends upon the post- solidification cooling rate and composition. As copper content of alloy and cooling rate increase, achieved nonequilibrium eutectic phase increases that leads to release of high amount of latent heat and appearing of second deviation in cooling curve. This deviation can be seen in first time derivative curve in the form of a definite peak.


1992 ◽  
Vol 260 ◽  
Author(s):  
M. Park ◽  
S. J. Krause ◽  
S. R. Wilson

ABSTRACTThe effect of copper content on the reaction growth and morphology of Al12W in Al-Cu/Ti-W bilayers was studied with plan view and cross-section transmission electron microscopy. After heat treatment at 450°C for 30 minutes, a spiked growth of A112W penetrated into the grain boundaries of Al-0.5 wt.% Cu film by the reaction of Al with the Ti-W sublayer. Increasing copper addition from 0.5 to 1.5% inhibited the spiked growth of AI12W, resulting in a flat and planar layer (-150Å) of Al12W. It is suggested that increasing copper segregation in the aluminum grain boundaries during heat treatment at 450°C causes a significant change in the growth morphology of the Al12W compound.


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