Erratum: “Heat Conduction in Solids With Random Initial Conditions” (Journal of Heat Transfer, 1974, 96, pp. 474–477)

1975 ◽  
Vol 97 (1) ◽  
pp. 78-78
Author(s):  
G. Ahmadi
Keyword(s):  
Heat Transfer ◽  
Heat Conduction ◽  
Initial Conditions ◽  
Random Initial Conditions

Heat Conduction in Solids With Random Initial Conditions

1974 ◽  
Vol 96 (4) ◽  
pp. 474-477 ◽  
Author(s):  
G. Ahmadi
Keyword(s):  
Temperature Field ◽  
Heat Conduction ◽  
General Theory ◽  
Unbounded Domain ◽  
Initial Conditions ◽  
Bounded Domains ◽  
Random Initial Condition ◽  
Initial Condition ◽  
Random Initial Conditions ◽  
Random Temperature Field

The problem of heat conduction in solids with random initial condition is studied. A general theory is first discussed and several examples are considered. It is observed that the homogeneity of the random initial condition is sufficient for the homogeneity of the temperature field in an unbounded domain. But in bounded domains the random temperature field becomes nonhomogeneous even though the initial condition is homogeneous.

scholarly journals The Single-Blow Problem Including the Effects of Longitudinal Conduction

1964 ◽  
Author(s):  
C. P. Howard
Keyword(s):  
Heat Transfer ◽  
Porous Media ◽  
Heat Conduction ◽  
Transient Behavior ◽  
Step Change ◽  
Graphical Form ◽  
Compact Heat Exchanger ◽  
Fluid Temperature ◽  
Transfer Data ◽  
Method Of Calculation

The results are presented from a numerical finite-difference method of calculation for the transient behavior of porous media when subjected to a step change in fluid temperature considering the case where the longitudinal thermal heat conduction cannot be neglected. These results, given in tabular and graphical form, provide a useful means for evaluating the heat-transfer data obtained from the transient testing of compact heat-exchanger surfaces.

Heat conduction in double-walled carbon nanotubes with intertube additional carbon atoms

2015 ◽  
Vol 17 (25) ◽  
pp. 16476-16482 ◽  
Author(s):  
Liu Cui ◽  
Yanhui Feng ◽  
Peng Tan ◽  
Xinxin Zhang
Keyword(s):  
Heat Transfer ◽  
Carbon Nanotubes ◽  
Heat Conduction ◽  
Heat Transfer Performance ◽  
Transfer Performance ◽  
Reduction Mechanisms ◽  
Double Walled Carbon Nanotubes ◽  
Walled Carbon Nanotubes

Theoretical insights into the heat transfer performance and its reduction mechanisms in double-walled carbon nanotubes with intertube additional carbon atoms.

Numerical and Experimental Investigation of Interface Bonding Via Substrate Remelting of an Impinging Molten Metal Droplet

1996 ◽  
Vol 118 (1) ◽  
pp. 164-172 ◽  
Author(s):  
C. H. Amon ◽  
K. S. Schmaltz ◽  
R. Merz ◽  
F. B. Prinz
Keyword(s):  
Heat Transfer ◽  
Numerical Model ◽  
Molten Metal ◽  
Thermal Stresses ◽  
Initial Conditions ◽  
Metal Droplet ◽  
Solid Substrate ◽  
Numerical Results ◽  
Operating Conditions ◽  
Analytical Approaches

A molten metal droplet landing and bonding to a solid substrate is investigated with combined analytical, numerical, and experimental techniques. This research supports a novel, thermal spray shape deposition process, referred to as microcasting, capable of rapidly manufacturing near netshape, steel objects. Metallurgical bonding between the impacting droplet and the previous deposition layer improves the strength and material property continuity between the layers, producing high-quality metal objects. A thorough understanding of the interface heat transfer process is needed to optimize the microcast object properties by minimizing the impacting droplet temperature necessary for superficial substrate remelting, while controlling substrate and deposit material cooling rates, remelt depths, and residual thermal stresses. A mixed Lagrangian–Eulerian numerical model is developed to calculate substrate remelting and temperature histories for investigating the required deposition temperatures and the effect of operating conditions on remelting. Experimental and analytical approaches are used to determine initial conditions for the numerical simulations, to verify the numerical accuracy, and to identify the resultant microstructures. Numerical results indicate that droplet to substrate conduction is the dominant heat transfer mode during remelting and solidification. Furthermore, a highly time-dependent heat transfer coefficient at the droplet/substrate interface necessitates a combined numerical model of the droplet and substrate for accurate predictions of the substrate remelting. The remelting depth and cooling rate numerical results are also verified by optical metallography, and compare well with both the analytical solution for the initial deposition period and the temperature measurements during droplet solidification.

Transient Heat Transfer in Microscale Porous Materials Heated by Microsecond Laser Pulse of High Power Density

2002 ◽  
Author(s):  
Fangming Jiang ◽  
Dengying Liu ◽  
Jim S.-J. Chen ◽  
Richard S. Cohen
Keyword(s):  
Heat Transfer ◽  
Heat Conduction ◽  
Laser Pulse ◽  
Power Density ◽  
High Power ◽  
Hyperbolic Model ◽  
Transient Temperature ◽  
Hyperbolic Heat Conduction ◽  
High Power Density ◽  
High Heat Transfer

A novel experimental method was developed to measure the rapid transient temperature variations (heating rate > 107 K/s) of porous samples heated by high surface heat fluxes. With a thin film (0.1 μm thick) resistance thermometer of platinum as the temperature sensor and a super-high speed digital oscilloscope (up to 100 MHz) as the data recorder, rapid transient temperature variation in a porous material heated by a microsecond laser pulse of high power density is measured. Experimental results indicate that for high heat transfer cases (q′ > 109 W/m2) with short durations (5 – 20 μs) of heating, non-Fourier heat conduction behaviors appear. The non-Fourier hyperbolic heat conduction model and the traditional Fourier parabolic model are employed to simulate this thermal case respectively and the FDM is used to perform the numerical analysis. The hyperbolic model predicts thermal wave behavior in qualitative agreement with the experimental data.

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