Thermal Contact Resistance of Anisotropic Materials

1970 ◽  
Vol 92 (1) ◽  
pp. 17-20 ◽  
Author(s):  
N. Vutz ◽  
S. W. Angrist
Keyword(s):  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Anisotropic Materials ◽  
Geometric Transformation ◽  
Contact Interface ◽  
Material Anisotropy ◽  
Transformation Technique ◽  
Factors Affecting ◽  
Material Hardness

This work presents an extension of the understanding of thermal contact resistance to include anisotropic materials. The extension involves a mathematical geometric transformation which leaves the thermal currents unchanged while making the temperature distribution in the anisotropic materials soluble by previously published methods. The development of this transformation technique is presented, and the effect of material anisotropy is calculated for a set of interface orientations and material conductivities which characterize typical contact situations. The degree of material anisotropy and the orientation of the contact interface are shown to be important factors affecting the contact resistance in addition to surface roughness, material hardness, and contact load.

Development of an Experimental Procedure for Thermal Contact Resistance Estimation at the Glass/Metal Contact Interface

2013 ◽  
Vol 6 (2) ◽  
Author(s):  
B. Abdulhay ◽  
B. Bourouga ◽  
F. Alzetto ◽  
C. Challita
Keyword(s):  
Heat Flux ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Conditions ◽  
Metal Contact ◽  
Contact Interface ◽  
Equivalent Thermal Conductivity ◽  
Experimental Procedure ◽  
Glass Metal

In this paper, an experimental device is designed and developed in order to estimate thermal conditions at the glass/metal contact interface. This device is made of two parts: The upper part contains the tool (piston) made of bronze and a heating device to raise the temperature of the piston to 700 °C. The lower part is composed of a lead crucible and a glass sample. The assembly is provided with a heating system, an induction furnace of 6 kW for heating the glass up to 950 °C. The developed experimental procedure has permitted the estimation of the thermal contact resistance (TCR) using a developed measurement principle based on the inverse technique developed by Beck et al. (1985, Inverse Heat Conduction: III Posed Problems, Wiley Inter-science, New York). The semitransparent character of the glass has been taken into account by an additional radiative heat flux and an equivalent thermal conductivity. After the set-up tests, reproducibility experiments for a specific contact pressure have been carried out. Results show a good repeatability of the registered and estimated parameters such as the piston surface temperature, heat flux density, and TCR. The estimated value of TCR reaches 2 × 10−3 K m2/W with a maximum dispersion that does not exceed 6%.

scholarly journals Study on Thermal Contact Resistance Estimation in Planar Medium

2018 ◽  
Vol 36 (1) ◽  
pp. 28-34
Author(s):  
Jingjing Wen ◽  
Leitao Li ◽  
Chengwu Liu ◽  
Bin Wu
Keyword(s):  
Heat Transfer ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Estimation Methods ◽  
Transfer Model ◽  
Calculation Error ◽  
Contact Interface ◽  
Temperature Measuring ◽  
Planar Medium

Thermal contact resistance(TCR) is one of the important parameters in heat transfer problems of engineering, and it is necessary to estimate the value of TCR effectively in many engineering fields. Considering the limitation of current estimation methods of TCR such as only focusing on one-dimensional thermal conduction, getting a single value of TCR merely, and the temperature measuring points only being placed in temperature gradient direction of mediums, boundary element method(BEM) and conjugate gradient method are combined to estimate the TCR in planar mediums. The value of TCR in relation to the position of contact interface line is estimated with this method, and the positions of temperature measuring points can be selected randomly because of the characteristic of BEM that there is no necessity to discrete the inner area and it is sufficient to discrete the boundary. The analysis of calculation examples base on heat transfer model of planar medium demonstrates that:this method can estimate the TCR effectively, but the ill-posedness is also existed in this method which is one of the inverse problems, and the calculation error of TCR is increased with the distance from temperature measuring points to contact interface, the estimation precision and stability can be improved after optimization with least square method.

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

2015 ◽  
Author(s):  
Toshio Tomimura ◽  
Yasushi Koito ◽  
Taewan Do ◽  
Masaru Ishizuka ◽  
Tomoyuki Hatakeyama
Keyword(s):  
Contact Resistance ◽  
Contact Pressure ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermal Interface Material ◽  
Surface Model ◽  
Contact Interface ◽  
Fundamental Study ◽  
Thermal Interface ◽  
Wavy Surfaces

The thermal contact resistance (TCR) is the crucial issue in the field of heat removal from systems like electronic equipment, satellite thermal control systems, and so on. To cope with the problem, a lot of studies have been done mainly for flat rough surfaces. However, as pointed out so far, there are still wide discrepancies among measured and predicted TCRs, even for similar materials. To investigate the key factors for the abovementioned discrepancies, a fundamental analysis was conducted in our previous study [1] using a simple contact surface model, which was composed of the unit cell model proposed by Tachibana [2] and Sanokawa [3]. Furthermore, by introducing a 2-D microscopic surface model, which consists of random numbers and Abbott’s bearing area curve, the effects of surface waviness and roughness on the temperature fields near the contact interface have been investigated microscopically [4]. In this study, based on a 1-D wavy surface model, a fundamental study has been conducted to predict TCR and the thermal contact conductance (TCC), which is a reciprocal of TCR, between wavy surfaces with the thermal interface material (TIM) under a relatively low mean nominal contact pressure of 0.1–1.0 MPa. From comparison between the calculated and measured results, it has been shown that, in spite of a simple 1-D analysis, the present model predicts the temperature drop at the contact interface, which is obtained as the product of TCR and the heat rate flowing through TIM, within some 10 to 60% error for a TIM with the thermal conductivity of 2.3 W/(m·K) and the initial thickness of 0.5, 1 and 2 mm.

The Effect of Thermal Contact Resistance on Heat Transfer Between Periodically Contacting Surfaces

1973 ◽  
Vol 95 (3) ◽  
pp. 411-412 ◽  
Author(s):  
J. R. Howard ◽  
A. E. Sutton
Keyword(s):  
Heat Transfer ◽  
Heat Conduction ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Analog Computer ◽  
Contact Interface ◽  
Computer Study ◽  
One Dimensional

An analog-computer study is made of one-dimensional heat conduction through two bars whose axes are in line and whose adjacent ends make and break contact periodically. The work extends a previous study to take account of imperfect thermal contact at the contact interface. The effect of frequency and duration of contact are also discussed.

Evaluation of Thermal Contact Resistance Under High Heat Flux Considering Material Hardness Using Numerical Analysis

2018 ◽  
Vol 2018 (0) ◽  
pp. 0215
Author(s):  
Risako Kibushi ◽  
Kazuhisa Yuki ◽  
Tomoyuki Hatakeyama ◽  
Noriyuki Unno ◽  
Toshio Tomimuta ◽  
...  
Keyword(s):  
Heat Flux ◽  
Numerical Analysis ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
High Heat ◽  
High Heat Flux ◽  
Material Hardness

An Investigation of Key Factors Affecting Solder Microdroplet Deposition

1998 ◽  
Vol 120 (1) ◽  
pp. 259-270 ◽  
Author(s):  
B. Xiong ◽  
C. M. Megaridis ◽  
D. Poulikakos ◽  
H. Hoang
Keyword(s):  
Contact Resistance ◽  
Manufacturing Industry ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Surface Oxidation ◽  
Careful Consideration ◽  
Transport Processes ◽  
Modeling Tools ◽  
Factors Affecting ◽  
Solder Bumps

This paper combines a theoretical model with experimental measurements to elucidate the role of key operating parameters affecting solder microdroplet deposition in the electronics manufacturing industry. The experimental investigation is used to evaluate the final deposit (bump) shapes and trends predicted by the model. The effects of substrate temperature, material composition, layer thickness, and thermal contact resistance (including surface oxidation) are delineated. Solder-deposit shape comparisons between experiments and modeling suggest that the value of thermal contact resistance may change with process parameters, and is probably dependent on the solder phase. It is established that inferences regarding the overall shape or solidification times of solder bumps using limited modeling trends should be made only after careful consideration of the substrate composition, accurate representation of the thermal contact resistance, and adequate resolution of the fluid dynamical oscillatory motion and its effects on solidification rates. It is shown that modeling tools can be used in conjunction with experiments to promote our fundamental understanding of the transport processes in the complex solder jetting technology.

scholarly journals Measurement of Line Distribution of Thermal Contact Resistance Using Microscopic Lock-In Thermography

2021 ◽  
Vol 8 (1) ◽  
pp. 18
Author(s):  
Takuya Ishizaki ◽  
Ai Ueno ◽  
Hosei Nagano
Keyword(s):  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Resistance Measurement ◽  
Phase Lag ◽  
Contact Interface ◽  
Geometrical Condition ◽  
Infrared Microscope ◽  
The One ◽  
Lock In

This paper proposes a new thermal contact resistance measurement method using lock-in thermography. Using the lock-in thermography with an infrared microscope, the local temperature behavior in the frequency domain across the contact interface was visualized in microscale. Additionally, a new thermal contact resistance measurement principle was constructed considering the superimposition of the reflected and transmitted temperature wave at the boundary and taking into account the intensity distribution of the heating laser as the gaussian distribution, and the specific geometrical condition of the laminated plate sample. As a result of the experiments, the one-dimensional distribution of the thermal contact resistance was obtained along the contact interface from the analysis of the phase lag.

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