An Investigation of Key Factors Affecting Solder Microdroplet Deposition

1998 ◽  
Vol 120 (1) ◽  
pp. 259-270 ◽  
Author(s):  
B. Xiong ◽  
C. M. Megaridis ◽  
D. Poulikakos ◽  
H. Hoang
Keyword(s):  
Contact Resistance ◽  
Manufacturing Industry ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Surface Oxidation ◽  
Careful Consideration ◽  
Transport Processes ◽  
Modeling Tools ◽  
Factors Affecting ◽  
Solder Bumps

This paper combines a theoretical model with experimental measurements to elucidate the role of key operating parameters affecting solder microdroplet deposition in the electronics manufacturing industry. The experimental investigation is used to evaluate the final deposit (bump) shapes and trends predicted by the model. The effects of substrate temperature, material composition, layer thickness, and thermal contact resistance (including surface oxidation) are delineated. Solder-deposit shape comparisons between experiments and modeling suggest that the value of thermal contact resistance may change with process parameters, and is probably dependent on the solder phase. It is established that inferences regarding the overall shape or solidification times of solder bumps using limited modeling trends should be made only after careful consideration of the substrate composition, accurate representation of the thermal contact resistance, and adequate resolution of the fluid dynamical oscillatory motion and its effects on solidification rates. It is shown that modeling tools can be used in conjunction with experiments to promote our fundamental understanding of the transport processes in the complex solder jetting technology.

Thermal Contact Resistance of Anisotropic Materials

1970 ◽  
Vol 92 (1) ◽  
pp. 17-20 ◽  
Author(s):  
N. Vutz ◽  
S. W. Angrist
Keyword(s):  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Anisotropic Materials ◽  
Geometric Transformation ◽  
Contact Interface ◽  
Material Anisotropy ◽  
Transformation Technique ◽  
Factors Affecting ◽  
Material Hardness

This work presents an extension of the understanding of thermal contact resistance to include anisotropic materials. The extension involves a mathematical geometric transformation which leaves the thermal currents unchanged while making the temperature distribution in the anisotropic materials soluble by previously published methods. The development of this transformation technique is presented, and the effect of material anisotropy is calculated for a set of interface orientations and material conductivities which characterize typical contact situations. The degree of material anisotropy and the orientation of the contact interface are shown to be important factors affecting the contact resistance in addition to surface roughness, material hardness, and contact load.

THERMAL CONTACT RESISTANCE MATCHING TO OPTIMIZE PERFORMANCE IN THERMOELECTRIC GENERATORS

2020 ◽  
Vol 27 (7) ◽  
pp. 617-627
Author(s):  
Yuanyuan Tian ◽  
Mengjun Zhang ◽  
Junli Wang ◽  
Anbang Liu ◽  
Huaqing Xie ◽  
...  
Keyword(s):  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Thermoelectric Generators

High‐Temperature Skin Softening Materials Overcoming the Trade‐Off between Thermal Conductivity and Thermal Contact Resistance

Small ◽  
2021 ◽  
pp. 2102128
Author(s):  
Taehun Kim ◽  
Seongkyun Kim ◽  
Eungchul Kim ◽  
Taesung Kim ◽  
Jungwan Cho ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Contact Resistance ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
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