An Experimental Investigation of the Effect of Subcooling on Bubble Growth and Waiting Time in Nucleate Boiling

1985 ◽  
Vol 107 (1) ◽  
pp. 168-174 ◽  
Author(s):  
E. A. Ibrahim ◽  
R. L. Judd
Keyword(s):  
Heat Flux ◽  
Waiting Time ◽  
Bubble Growth ◽  
Nucleate Boiling ◽  
Copper Surface ◽  
Growth Theory ◽  
Growth Time ◽  
Time Data ◽  
Relationship Of ◽  
Different Levels

The effect of subcooling on bubble waiting time and growth time for water boiling on a copper surface was examined in conjunction with measurements obtained over a range of subcooling from 0 to 15°C and three different levels of heat flux 166, 228, and 291 kW/m2. The growth-time data was successfully correlated with a model that combined the bubble growth theory of Mikic, Rohsenow, and Griffith with the bubble departure diameter relationship of Staniszewski, thereby establishing confidence in the measuring procedure. The waiting time data agreed with the predictions of the Han and Griffith waiting time theory at lower levels of subcooling but then showed a behavior contrary to that predicted for higher levels of subcooling.

scholarly journals Interaction of the Nucleation Phenomena at Adjacent Sites in Nucleate Boiling

1983 ◽  
Vol 105 (1) ◽  
pp. 3-9 ◽  
Author(s):  
M. Sultan ◽  
R. L. Judd
Keyword(s):  
Active Sites ◽  
Heating Surface ◽  
Nucleate Boiling ◽  
Copper Surface ◽  
Nucleation Sites ◽  
Theoretical Predictions ◽  
Experimental Findings ◽  
Relationship Of ◽  
The Relationship ◽  
Different Levels

The present investigation is an original study in nucleate pool boiling heat transfer combining theory and experiment in which water boiling at atmospheric pressure on a single copper surface at two different levels of heat and different levels of subcooling was studied. Cross spectral analysis of the signals generated by the emission of bubbles at adjacent nucleation sites was used to determine the relationship of the time elapsed between the start of bubble growth at the two neighbouring active sites with the distance separating them. The experimental results obtained indicated that for the lower level of heat flux at three different levels of subcooling, the elapsed time and distance were directly related. Theoretical predictions of a temperature disturbance propagating through the heating surface in the radial direction gave good agreement with the experimental findings, suggesting that this is the mechanism responsible for the activation of the surrounding nucleation sites.

Orientation Effects on Pool Boling of Microporous Coating in Water

2017 ◽  
Vol 139 (2) ◽  
Author(s):  
Seongchul Jun ◽  
Jinsub Kim ◽  
Hwan Yeol Kim ◽  
Seung M. You
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Bubble Growth ◽  
Boiling Heat Transfer ◽  
Pool Boiling ◽  
Nucleate Boiling ◽  
Copper Surface ◽  
Large Bubble ◽  
Microporous Coating ◽  
Plain Surface

Copper HTCMC (High-temperature, Thermally Conductive Microporous Coating) with a coating thickness of ~300 µm was created by sintering 67 µm copper particles onto a flat copper surface. This was shown to be the optimum particle size and thickness combination, in terms of boiling heat transfer enhancement with water, during a prior pool boiling study conducted by Jun et al. [1]. The effects of orientation of pool boiling heat transfer in saturated distilled water at 1 atm were tested experimentally and compared with a plain copper surface. An SEM image (top left) shows the porous structure of HTCMC demonstrating reentrant cavities which promote nucleate boiling and lead to significant critical heat flux (CHF) enhancement compared to the plain copper surface (top right). The nucleate boiling incipience heat flux of HTCMC was demonstrated to be 5 kW/m2, which was an 8x reduction when compared to a plain copper surface which was found to have an incipience heat flux of 40 kW/m2. At this same 40 kW/m2 heat flux, the activated nucleation site density of HTCMC was extremely high, and each bubble appeared much smaller compared to a plain surface. This can be seen in the first row of images, captured with a high speed camera at 2,000 fps. The bubble growth times and departing bubble sizes of 0° and 90° are comparable for both HTCMC and plain surfaces with the order of 10 milliseconds and 100 micrometers. However, when oriented at 180°, the bubble growth time was the order of 100 milliseconds for both HTCMC and plain surface, and the departing bubble size was the order of 10 millimeters. This is due to the growth of a large bubble which coalesced with adjacent bubbles to become a relatively huge bubble which was stretched by buoyance forces before the bubble departed.

A Photographic Study on the Effects of Hydrophobic-Spot Size and Subcooling on Local Film Boiling

2013 ◽  
Author(s):  
Bambang Joko Suroto ◽  
Masahiro Tashiro ◽  
Sana Hirabayashi ◽  
Sumitomo Hidaka ◽  
Masamichi Kohno ◽  
...  
Keyword(s):  
Heat Flux ◽  
High Speed ◽  
Bubble Dynamics ◽  
Pure Water ◽  
Nucleate Boiling ◽  
Spot Size ◽  
Copper Surface ◽  
Film Boiling ◽  
Working Fluid ◽  
Boiling Regime

The effects of hydrophobic circle spot size and subcooling on local film boiling phenomenon from the copper surface with single PTFE (Polytetrafluoroethylene) hydrophobic circle spot at low heat flux has been investigated. The experiments were performed using pure water as the working fluid and subcooling ranging from 0 and 10K. The heat transfer surfaces are used polished copper block with single PTFE hydrophobic circle spot of diameters 2, 4 and 6 mm, respectively. A high-speed camera was used to capture bubble dynamics and disclosed the sequence of the process leading to local film boiling. The result shows that local films boiling occurs on the PTFE circle spot at low heat flux and was triggered by the merging of neighboring bubbles. The study also showed that transition time required for change from nucleate boiling regime to local film boiling regime depends on the diameter of the hydrophobic circle spot and the subcooling. A stable local film boiling occurs at the smallest diameter of hydrophobic spot. Subcooling cause the local film boiling occur at negative superheat and oscillation of bubble dome.

Nucleate Boiling of Dielectric Liquids on Hydrophobic Patterned Surfaces

2014 ◽  
Author(s):  
Nihal E. Joshua ◽  
Denesh K. Ajakumar ◽  
Huseyin Bostanci
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Nucleate Boiling ◽  
High Heat ◽  
Copper Surface ◽  
Dielectric Liquid ◽  
Working Fluid ◽  
Patterned Surfaces ◽  
High Heat Flux ◽  
Dielectric Liquids

This study experimentally investigated the effect of hydrophobic patterned surfaces in nucleate boiling heat transfer. A dielectric liquid, HFE-7100, was used as the working fluid in the saturated boiling tests. Dielectric liquids are known to have highly-wetting characteristics. They tend to fill surface cavities that would normally trap vapor/gas, and serve as active nucleation sites during boiling. With the lack of these vapor filled cavities, boiling of a dielectric liquid leads to high incipience superheats and accompanying temperature overshoots. Heater samples in this study were prepared by applying a thin Teflon (AF400, Dupont) coating on 1-cm2 smooth copper surfaces following common photolithography techniques. Matching size thick film resistors, attached onto the copper samples, generated heat and simulated high heat flux electronic devices. Tests investigated the heater samples featuring circular pattern sizes between 40–100 μm, and corresponding pitch sizes between 80–200 μm. Additionally, a plain, smooth copper surface was tested to obtain reference data. Based on data, hydrophobic patterned surfaces effectively eliminated the temperature overshoot at boiling incipience, and considerably improved nucleate boiling performance in terms of heat transfer coefficient and critical heat flux over the reference surface. Hydrophobic patterned surfaces therefore demonstrated a practical surface modification method for heat transfer enhancement in immersion cooling applications.

Effects of UV-Visible Irradiation on Pool Boiling Behavior of Copper

2011 ◽  
Author(s):  
Chad N. Hunter ◽  
Nicholas R. Glavin ◽  
Andrey A. Voevodin ◽  
David B. Turner ◽  
Michael H. Check ◽  
...  
Keyword(s):  
Heat Flux ◽  
Light Source ◽  
Light Exposure ◽  
Nucleate Boiling ◽  
Copper Surface ◽  
Exposed Region ◽  
Surface Oxide Formation ◽  
Visible Irradiation ◽  
Uv Visible ◽  
Nanoscale Features

Roughened copper substrates were exposed to a broadband UV-VIS light source during nucleate boiling at a heat flux of 60–70% of the amount expected to result in critical heat flux (CHF) without exposure to a light source. The surface temperature decreased by 0.5–1.0°C within minutes after the UV-VIS light exposure began. CHF occurred after less than 20 minutes of exposure to the light source. Nanoscale features were observed in the light-exposed region of the copper surface after boiling, which were primarily associated with formation of Cu2O. The induced CHF likely occurred due to surface oxide formation, a resultant decrease in wettability of the surface.

Effects of Heater Material and Surface Orientation on Heat Transfer Coefficient and Critical Heat Flux of Nucleate Boiling

2017 ◽  
Author(s):  
Yong Mei ◽  
Yechen Zhu ◽  
Botao Zhang ◽  
Shengjie Gong ◽  
Hanyang Gu
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Boiling Heat Transfer ◽  
Orientation Angle ◽  
Nucleate Boiling ◽  
Copper Surface ◽  
Surface Orientation ◽  
Reactor Vessel

External reactor vessel cooling (ERVC) is the key technology for In-Vessel Retention (IVR) to ensure the safety of a nuclear power plant (NPP) under severe accident conditions. The thermal margin of nucleate boiling heat transfer on the reactor pressure vessel (RPV) lower head is important for ERVC and of wide concern to researchers. In such boiling heat transfer processes, the reactor vessel wall inclination effect on the heat transfer coefficient (HTC) and critical heat flux (CHF) should be considered. In this study, experiments were performed to investigate the effects of heater material and surface orientation on the HTC and CHF of nucleate boiling. Copper and stainless steel (SS) surfaces were used to perform boiling tests under atmosphere pressure. The orientation angle of both boiling surfaces were varied between 0° (upward) and 180° (downward). The experimental results show that the surface orientation effects on the HTC is slight for both the copper surface and the SS surface. In addition, the relationship of measured CHF values with the inclination angles was obtained and it shows that the CHF value changes little as the inclination angle increases from 0° to 120° but it decreases rapidly as the orientation angle increases towards 180° for both boiling surfaces. The material effect on CHF is also observed and the copper surface has higher CHF value than the SS surface. Based on the experimental data, a correlation for CHF prediction is developed which includes both the surface orientation effect and the heater material effect.

Bubbles Transient Growth in Saturation Boiling of PF-5060 Dielectric Liquid on Dimpled Cu Surfaces

2016 ◽  
Vol 8 (2) ◽  
Author(s):  
Arthur Suszko ◽  
Mohamed S. El-Genk
Keyword(s):  
Heat Flux ◽  
Bubble Diameter ◽  
Nucleate Boiling ◽  
Bubble Nucleation ◽  
Dielectric Liquid ◽  
Growth Time ◽  
Transient Growth ◽  
Vapor Bubbles ◽  
Volumetric Growth ◽  
Video Images

Investigated is the transient growth of vapor bubbles in saturation boiling of PF-5060 dielectric liquid on 10 × 10 mm, uniformly heated Cu surfaces with circular dimples, at an applied heat flux of 0.5 W/cm2. At such low heat flux, the surfaces are populated with growing discrete bubbles, emanating mostly from the manufactured dimples. The 300, 400, and 500 μm diameter and 200 μm deep dimples are manufactured in a triangular lattice with a pitch-to-diameter ratio of 2.0; thus, the total number of dimples increases with decreasing the dimple diameter. Captured video images of growing discrete bubbles at a speed of 210 frames per second (fps) confirm that the bubble diameter increases proportional to the square root of the growth time, and the bubble departure diameter and detachment frequency increase with increasing the dimple diameter. The total volumetric growth rate and diameter of the bubbles at departure increase with increasing the dimple diameter, ∼1.81, ∼4.75, and ∼8.2 mm3/s and ∼738 μm, ∼963 μm, and ∼1051 μm for the 300, 400, and 500 μm diameter dimples, respectively. The corresponding bubble detachment frequency is ∼8.6 Hz, ∼10.2 Hz, and ∼13.5 Hz, respectively. The fraction of the active dimples for bubble nucleation on the surfaces with 300, 400, and 500 μm dimples, at an applied heat flux of 0.5 W/cm2, is ∼0.85, ∼0.64, and ∼0.53, respectively. On these surfaces, the estimated bubble volume at departure is ∼0.21 mm3, ∼0.47 mm3, and ∼0.61 mm3, and the corresponding rate of energy removed by a single bubble is ∼1.99 mW, ∼5.24 mW, and ∼9.02 mW, respectively. These results help explain the measured enhancements in nucleate boiling and the critical heat flux (CHF) on the dimpled Cu surfaces.

Study on Heat Transfer Mechanism of Isolated Bubble Nucleate Boiling With MEMS Sensors

2010 ◽  
Author(s):  
Tomohide Yabuki ◽  
Osamu Nakabeppu
Keyword(s):  
Thin Film ◽  
Heat Transfer ◽  
Heat Flux ◽  
Bubble Growth ◽  
Local Heat ◽  
Nucleate Boiling ◽  
Heat Transfer Mechanism ◽  
Mems Sensors ◽  
Local Heat Flux ◽  
Dry Out

This paper describes an experimental investigation of heat transfer mechanism beneath isolated bubble during nucleate boiling with MEMS sensors having high temporal and spatial resolution in temperature measurement. The MEMS sensor fabricated for the boiling research includes eight thin film thermocouples and an electrolysis trigger on the topside of 20 × 20 mm2 silicon substrate and thin film heater on the backside. The electrolysis trigger initiates bubble growth by supplying hydrogen gasses as bubble nuclei with the electrolysis of the water by two electrodes. In the experiment, temperature fluctuation beneath an isolated bubble during saturated nucleate boiling of water was measured with the sensor. The measurement data presented strong evaporation and dry-out of the microlayer in the bubble growth phase and rewetting of the dry-out area in the bubble departure phase. Moreover, heat transfer induced by the boiling bubble was evaluated by computing local heat flux through a transient heat conduction simulation in the sensor substrate using the measured data as boundary condition. The heat transfer analysis shows that the local heat flux in the microlayer evaporation area has high value of the order of MW/m2, and the maximum value of about 2 MW/m2 is indicated near the center in an early phase of the bubble growth. On the other hand, the heat flux is very low of around zero at the dry-out area, where microlayer had disappeared completely, and slight increase was observed at the rewetting area. Total heat transferred from the surface reached to about half of latent heat in the bubble until the bubble departure. Finally, initial thickness of the microlayer under the bubble was estimated by integrating the derived local heat flux. As the result, it was distributed in a few μm within the measurement area.

Suppression of Flow Boiling Instabilities in Microchannels Using Artificial Reentrant Cavities

2007 ◽  
Author(s):  
Chih-Jung Kuo ◽  
Yoav Peles
Keyword(s):  
Heat Flux ◽  
Critical Heat Flux ◽  
Bubble Growth ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
Hydraulic Diameter ◽  
Local Temperature ◽  
Parallel Channel ◽  
Flow Oscillation ◽  
Microchannel Devices

Flow boiling instability in parallel microchannel and the ability of artificial reentrant cavities to suppress their occurrence was experimental studied. Experiments were conducted using two types of 226 μm hydraulic diameter parallel microchannel devices: microchannel with reentrant cavities and plain-wall microchannel. Onset of nucleate boiling (ONB), critical heat flux (CHF) condition, onset of flow oscillation (OFO), and local temperature were also obtained and compared. It was found that reentrant cavities on channel walls can assist mitigating the rapid bubble growth instability and postpone the parallel channel and compressible volume instability, which resulted in the delay of CHF.

Effect of Surface Orientation on Nucleate Boiling of FC-72 on Porous Graphite

2006 ◽  
Vol 128 (11) ◽  
pp. 1159-1175 ◽  
Author(s):  
Jack L. Parker ◽  
Mohamed S. El-Genk
Keyword(s):  
Heat Flux ◽  
High Surface ◽  
Nucleate Boiling ◽  
Copper Surface ◽  
Subcooled Boiling ◽  
Porous Graphite ◽  
Nucleate Boiling Heat Transfer ◽  
Inclination Angles ◽  
Boiling Heat Transfer Coefficient ◽  
Reported Data

Effects of orientations of porous graphite and smooth copper surfaces, measuring 10mm×10mm, on saturation nucleate boiling and critical heat flux (CHF) of FC-72 dielectric liquid and of liquid subcooling (0, 10, 20, and 30K) on nucleate boiling in the upward facing orientation are investigated. Inclination angles (θ) considered are 0deg (upward-facing), 60, 90, 120, 150, and 180deg (downward facing). The values of nucleate boiling heat flux, nucleate boiling heat transfer coefficient (NBHTC), and CHF are compared with those measured on the smooth copper surface of the same dimensions and CHF values on both copper and porous graphite are compared with those reported by other investigators on the smooth surfaces and microporous coatings. Results demonstrated higher NBHTC and CHF on porous graphite, particularly in the downward-facing orientation (θ=180deg). In the upward-facing orientation, NBHTCs on both surfaces decrease with increased subcooling, but increase with increased surface superheat reaching maxima then decrease with further increase in surface superheat. In saturation boiling on copper and both saturation and subcooled boiling on porous graphite these maxima occur at or near the end of the discrete bubble region, and near CHF in subcooled boiling on copper. Maximum saturation NBHTC on porous graphite increases with decreased surface superheat and inclination angle, while that on copper increases with increased surface superheat and decreased surface inclination. At low surface superheats, saturation nucleate boiling heat flux increases with increased inclination, but decreases with increased inclination at high surface superheats, consistent with previously reported data for dielectric and nondielectric liquids. The fractional decreases in saturation CHF with increased θ on smooth copper and microporous coatings are almost identical, but markedly larger than on porous graphite, particularly in the downward-facing orientation. In this orientation, saturation CHF on porous graphite of 16W∕cm2 is much higher than on copper (4.9W∕cm2) and as much as 53% of that in the upward-facing orientation, compared to only ∼18% on copper.

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