Mechanical Properties of Discontinuous SiC Reinforced Aluminum Composites at Elevated Temperatures

1988 ◽  
Vol 110 (2) ◽  
pp. 77-82 ◽  
Author(s):  
T. G. Nieh ◽  
K. Xia ◽  
T. G. Langdon

High temperature mechanical properties of discontinuous, whisker and particulate, SiC reinforced aluminum composites, including 2124 and 6061 alloy matrices, are reviewed. It is shown that the behavior of these composites is similar to conventional oxide dispersion strengthened alloys. Namely, they exhibit a low strain rate senstivity and a high apparent activation energy for creep deformation. Despite the fact that the addition of SiC significantly improves the mechanical properties of aluminum at room temperature, the mechanical strength of the composite at elevated temperatures is dominated by the strength of the aluminum matrix This is because the SiC dispersoids are, in general, too coarse and they are not effective barriers for dislocation motion. It is also demonstrated that SiC particulate composites are less creep resistant than SiC whisker composites.

Author(s):  
Ernest L. Hall ◽  
J. B. Vander Sande

The present paper describes research on the mechanical properties and related dislocation structure of CdTe, a II-VI semiconductor compound with a wide range of uses in electrical and optical devices. At room temperature CdTe exhibits little plasticity and at the same time relatively low strength and hardness. The mechanical behavior of CdTe was examined at elevated temperatures with the goal of understanding plastic flow in this material and eventually improving the room temperature properties. Several samples of single crystal CdTe of identical size and crystallographic orientation were deformed in compression at 300°C to various levels of total strain. A resolved shear stress vs. compressive glide strain curve (Figure la) was derived from the results of the tests and the knowledge of the sample orientation.


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