The Analysis of Heat Transfer in Automotive Turbochargers

Author(s):  
Nick Baines ◽  
Karl D. Wygant ◽  
Antonis Dris

Heat transfers in an automotive turbocharger comprise significant energy flows, but are rarely measured or accounted for in any turbocharger performance assessment. Existing measurements suggest that the difference in turbine efficiency calculated in the conventional way, by means of the fluid temperature change, under adiabatic conditions differs considerably from the usual diabatic test conditions, particularly at low turbine pressure ratio. In the work described in this paper, three commercial turbochargers were extensively instrumented with thermocouples on all accessible external and internal surfaces in order to make comprehensive temperature surveys. The turbochargers were run at ranges of turbine inlet temperature and external ventilation. Adiabatic tests were also carried out to serve as a reference condition. Based on the temperature measurements, the internal heat fluxes from the turbine gas to the turbocharger structure and from there to the lubricating oil and the compressor, and the external heat fluxes to the environment were calculated. A one-dimensional heat transfer network model of the turbocharger was demonstrated to be able to simulate the heat fluxes to good accuracy, and the heat transfer coefficients required were ultimately found to be mostly independent of the turbochargers tested.

Author(s):  
Nick Baines ◽  
Karl D. Wygant ◽  
Antonis Dris

Heat transfers in an automotive turbocharger comprise significant energy flows, but are rarely measured or accounted for in any turbocharger performance assessment. Existing measurements suggest that the difference in turbine efficiency calculated in the conventional way, by means of the fluid temperature change, under adiabatic conditions differs considerably from the usual diabatic test conditions, particularly at low turbine pressure ratio. In the work described in this paper, three commercial turbochargers were extensively instrumented with thermocouples on all accessible external and internal surfaces in order to make comprehensive temperature surveys. The turbochargers were run at ranges of turbine inlet temperature and external ventilation. Adiabatic tests were also carried out to serve as a reference condition. Based on the temperature measurements, the internal heat fluxes from the turbine gas to the turbocharger structure, and from there to the lubricating oil and the compressor, and the external heat fluxes to the environment, were calculated. A one-dimensional heat transfer network model of the turbocharger was demonstrated to be able to simulate the heat fluxes to good accuracy, and that the heat transfer coefficients required were ultimately found to be mostly independent of the turbochargers tested.


1999 ◽  
Vol 121 (3) ◽  
pp. 592-597 ◽  
Author(s):  
J. E. Leland ◽  
M. R. Pais

An experimental investigation was performed to determine the heat transfer rates for an impinging free-surface axisymmetric jet of lubricating oil for a wide range of Prandtl numbers (48 to 445) and for conditions of highly varying properties (viscosity ratios up to 14) in the flowing film. Heat transfer coefficients were obtained for jet Reynolds numbers from 109 to 8592, nozzle orifice diameters of 0.51, 0.84 and 1.70 mm and a heated surface diameter of 12.95 mm. The effect of nozzle to surface spacing (1 to 8.5 mm), was also investigated. Viscous dissipation was found to have an effect at low heat fluxes. Distinct heat transfer regimes were identified for initially laminar and turbulent jets. The data show that existing constant property correlations underestimate the heat transfer coefficient by more than 100 percent as the wall to fluid temperature difference increases. Over 700 data points were used to generate Nusselt number correlations which satisfactorily account for the highly varying properties with a mean absolute error of less than ten percent.


2020 ◽  
Vol 142 (3) ◽  
Author(s):  
Ki Wook Jung ◽  
Eunho Cho ◽  
Hyoungsoon Lee ◽  
Chirag Kharangate ◽  
Feng Zhou ◽  
...  

Abstract High performance and economically viable cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling heat sinks suffer from high pressure drop due to small channel dimensions and long flow paths in two-dimensional (2D) plane. Utilizing direct “embedded cooling” strategy in combination with top access three-dimensional (3D) manifold strategy reduces the pressure drop by nearly an order of magnitude. In addition, it provides more temperature uniformity across large area chips and it is less prone to flow instability in two-phase boiling heat transfer. This study presents the experimental results for single-phase thermofluidic performance of an embedded silicon microchannel cold plate (CP) bonded to a 3D manifold for heat fluxes up to 300 W/cm2 using single-phase R-245fa. The heat exchanger consists of a 5 × 5 mm2 heated area with 25 parallel 75 × 150 μm2 microchannels, where the fluid is distributed by a 3D-manifold with four microconduits of 700 × 250 μm2. Heat is applied to the silicon heat sink using electrical Joule-heating in a metal serpentine bridge and the heated surface temperature is monitored in real-time by infrared (IR) camera and electrical resistance thermometry. The maximum and average temperatures of the chip, pressure drop, thermal resistance, and average heat transfer coefficient (HTC) are reported for flow rates of 0.1, 0.2. 0.3, and 0.37 L/min and heat fluxes from 25 to 300 W/cm2. The proposed embedded microchannels-3D manifold cooler, or EMMC, device is capable of removing 300 W/cm2 at maximum temperature 80 °C with pressure drop of less than 30 kPa, where the flow rate, inlet temperature, and pressures are 0.37 L/min, 25 °C and 350 kPa, respectively. The experimental uncertainties of the test results are estimated, and the uncertainties are the highest for heat fluxes < 50 W/cm2 due to difficulty in precisely measuring the fluid temperature at the inlet and outlet of the microcooler.


Author(s):  
Ki Wook Jung ◽  
Hyoungsoon Lee ◽  
Chirag Kharangate ◽  
Feng Zhou ◽  
Mehdi Asheghi ◽  
...  

Abstract High performance and economically viable thermal cooling solutions must be developed to reduce weight and volume, allowing for a wide-spread utilization of hybrid electric vehicles. The traditional embedded microchannel cooling heat sinks suffer from high pressure drop due to small channel dimensions and long flow paths in 2D-plane. Utilizing direct “embedded cooling” strategy in combination with top access 3D-manifold strategy reduces the pressure drop by nearly an order of magnitude. In addition, it provides more temperature uniformity across large area chips and it is less prone to flow instability in two-phase boiling heat transfer. Here, we present the experimental results for single-phase thermofluidic performance of an embedded silicon microchannel cold-plate bonded to a 3D manifold for heat fluxes up to 300 W/cm2 using single-phase R-245fa. The heat exchanger consists of a 52 mm2 heated area with 25 parallel 75 × 150 μm2 microchannels, where the fluid is distributed by a 3D-manifold with 4 micro-conduits of 700 × 250 μm2. Heat is applied to the silicon heat sink using electrical Joule-heating in a metal serpentine bridge and the heated surface temperature is monitored in real-time by Infra-red (IR) camera and electrical resistance thermometry. The experimental results for maximum and average temperatures of the chip, pressure drop, thermal resistance, average heat transfer coefficient for flow rates of 0.1, 0.2. 0.3 and 0.37 lit/min and heat fluxes from 25 to 300 W/cm2 are reported. The proposed Embedded Microchannels-3D Manifold Cooler, or EMMC, device is capable of removing 300 W/cm2 at maximum temperature 80 °C with pressure drop of less than 30 kPa, where the flow rate, inlet temperature and pressures are 0.37 lit/min, 25 °C and 350 kPa, respectively. The experimental uncertainties of the test results are estimated, and the uncertainties are the highest for heat fluxes < 50 W/cm2 due to difficulty in precisely measuring the fluid temperature at the inlet and outlet of the micro-cooler.


1989 ◽  
Vol 111 (4) ◽  
pp. 877-881 ◽  
Author(s):  
J. W. Baughn ◽  
P. T. Ireland ◽  
T. V. Jones ◽  
N. Saniei

Measurements of the local heat transfer coefficients on a pin fin (i.e., a short cylinder in crossflow) in a duct have been made using two methods, both of which employ liquid crystals to map an isotherm on the surface. The transient method uses the liquid crystal to determine the transient response of the surface temperature to a change in the fluid temperature. The local heat transfer coefficient is determined from the surface response time and the thermal properties of the substrate. The heated-coating method uses an electrically heated coating (vacuum-deposited gold in this case) to provide a uniform heat flux, while the liquid crystal is used to locate an isotherm on the surface. The two methods compare well, especially the value obtained near the center stagnation point of the pin fin where the difference in the thermal boundary condition of the two methods has little effect. They are close but differ somewhat in other regions.


Author(s):  
Rico Poser ◽  
Jens von Wolfersdorf ◽  
Klaus Semmler

Transient heat transfer experiments were performed in a model of a multi-pass gas turbine blade cooling circuit. The inner surface of the Plexiglas model was coated with thermochromic liquid crystals in order to determine the internal heat transfer coefficients. A change in inlet temperature is applied using a pre-cooled heat exchanger. As for simple geometries the analytical solution of Fourier’s equation can often be directly used for data evaluation, one ought to pay attention to complex passages. The reason has to be seen that the flow in complex passages has to be characterized by local and time dependent fluid temperatures. As a direct consequence data evaluation might be limited to small evaluation areas especially far downstream. Otherwise the uncertainties in the heat transfer results will increase substantially. In the present study the sensitivity of the transient method for complex passages has been analyzed theoretically and applied experimentally.


1989 ◽  
Vol 111 (1) ◽  
pp. 63-70 ◽  
Author(s):  
C. Camci

Discrete hole film cooling on highly curved surfaces of a gas turbine blade produces very significant wall temperature gradients and wall heat flux variations near downstream and upstream of rows of circular cooling holes. In this study a set of well-defined external heat transfer coefficient distributions in the presence of discrete hole film cooling is presented. Heat transfer coefficients are measured on the suction side of an HP rotor blade profile in a short-duration facility under well-simulated gas turbine flow conditions. The main emphasis of the study is to evaluate the internal heat flux distributions in a detailed way near the cooling holes by using a computational technique. The method uses the measured external heat transfer coefficients as boundary conditions in addition to available internal heat transfer correlations for the internal passages. The study shows the details of the near hole temperature gradients and heat fluxes. The convective heat transfer inside the circular film cooling holes is shown to be very significant even with their relatively small diameter and lengths compared to the chord length. The study also indicates a nonnegligible wall temperature reduction at near upstream of discrete cooling holes. This is explained with the elliptic nature of the internal conduction field of the blade and relatively low coolant temperature levels at the exit of a film cooling hole compared to the mean blade temperature.


Author(s):  
Gareth F. Davies ◽  
Ian W. Eames ◽  
Paul B. Bailey ◽  
Michael W. Dadd ◽  
Adam Janiszewski ◽  
...  

Computer chips have generally been cooled by means of a heat sink/fan device; however, such systems are now approaching their limits and in future alternative techniques/devices will be needed. A 3-year project, involving collaboration between groups at three UK universities, is being undertaken to develop a miniature refrigeration device for the cooling of future microprocessors and electronic systems. Using conventional vapor compression refrigeration technology for the cooling of small computer packages has generally resulted in low heat fluxes, however, microchannel devices have shown heat transfer coefficients up to 16 times greater, and porous medium channels even higher heat transfer rates. Porous media heat exchangers are being developed by Newcastle University and some results from this work are reported here. Surface contamination by lubricating oil from the compressor often causes problems with small passage heat exchangers. Oxford University’s Cryogenics Group have developed specialised oil-free compressors for low temperature cooling systems for space applications. Such a compressor is being adapted for use in the miniature vapor compression refrigeration device. The paper discusses development work on the compressor design. Conventional size refrigeration systems have sufficient capacity to dampen out transient behaviour resulting from variations in local temperatures and flow rates, but this is not the case for miniature systems. Based on earlier work at London South Bank University, a model has been developed to study transient behaviour in miniature refrigeration systems. The basis of the mathematical model is explained within the paper, as well as providing provisional results from the simulations. The paper identifies the potential need for computer cooling and highlights the opportunity to develop specific cooling solutions. Previous relevant work in this area is also highlighted. The paper provides details of novel work being carried out on modelling, micro-heat transfer and compressor development.


Author(s):  
Jeong-Heon Shin ◽  
Tomer Rozenfeld ◽  
Ashwin Vutha ◽  
Yingying Wang ◽  
Gennady Ziskind ◽  
...  

Experimental and simulation studies were performed to reveal local heat transfer coefficients under jet impinging in micro domain with Nitrogen gas. The experimental device was made of a 500 μm thick Pyrex and 400 μm thick silicon wafers. On the Pyrex wafer, four 100 nm thick resistance temperature detector (RTD) thermistors and a heater were fabricated from titanium. Jet orifices were etched by deep reactive ion etching (DRIE) on a silicon wafer, which was attached to the Pyrex wafer through a vinyl sticker (250 μm thick). A 1.9 mm × 14.8 mm × 250 μm micro channel was formed by laser drilling into the sticker. Varying flow rates of Nitrogen gas and heat fluxes of the heater, temperatures of the four thermistors were collected and local heat transfer coefficients were inferred enabling to divulge the jet impinging cooling characteristics. Initial simulations were used to complement experiments and to obtain detailed flow patterns of the jet, temperature distribution on the heater area, and fluid temperature distribution.


2016 ◽  
Vol 66 (3) ◽  
pp. 203 ◽  
Author(s):  
A. Bhandarkar ◽  
Malsur Dharavath ◽  
M.S.R. Chandra Murty ◽  
P. Manna ◽  
Debasis Chakraborty

<p>Accurate prediction of surface temperature of high speed aerospace vehicle is very necessary for the selection of material and determination of wall thickness. For aerothermal characterisation of any high speed vehicle in its full trajectory, it requires number of detailed computational fluid dynamics (CFD) calculations with different isothermal calculations. From the detailed CFD calculations for different flow conditions and geometries, it is observed that heat transfer coefficients scale with the difference of adiabatic wall temperature and skin temperature. A simple ‘isothermal method’, is proposed to calculate heat flux data with only two CFD simulations one on adiabatic condition and other on isothermal condition. The proposed methodology is validated for number of high speed test cases involving external aerodynamic heating as well as high speed combusting flow. The computed heat fluxes and surface temperatures matches well with experimental and flight measured values.</p>


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