Modeling and Analysis of the Dynamics of a Drill Penetrating a Thin Plate

1986 ◽  
Vol 53 (3) ◽  
pp. 690-694 ◽  
Author(s):  
P. G. Reinhall ◽  
D. W. Storti
Keyword(s):  
Numerical Methods ◽  
Circular Hole ◽  
Composite Plate ◽  
Material Removal ◽  
Simplified Model ◽  
Drilling Process ◽  
Rigid Plate ◽  
Soft Or ◽  
Modeling And Analysis ◽  
Speed Selection

We propose a simplified model of the drilling process which is useful in understanding the problem of noncircular hole production. The dynamics of a drill penetrating a circular hole in a rigid plate are studied analytically, and numerical methods are then used to include the effects of material removal. We show that certain drill trajectories which lead to noncircular holes can be stabilized by material removal. Based on these findings, we recommend careful drill speed selection as a means of minimizing the probability of noncircular hole production, and explain why even this solution may not be sufficient for the case of very soft or composite plate materials.

The Modeling of the Real Building Object by Using the Model of a Two-Layer Beam of Variable Rigidity on an Elastic Basis

2012 ◽  
Vol 204-208 ◽  
pp. 3596-3599 ◽  
Author(s):  
Andreev Vladimir Igorevich ◽  
Barmenkova Elena Vjacheslavovna
Keyword(s):  
Numerical Methods ◽  
Lower Layer ◽  
System Structure ◽  
Simplified Model ◽  
Sandwich Beams ◽  
Variable Rigidity ◽  
The Real ◽  
Methods Of Calculation ◽  
Elastic Basis ◽  
Real Building

In the present paper is given the calculation of the real building object by using the model of a two-layer beam of variable rigidity on an elastic basis. The lower layer of a two-layer beam simulates the foundation, and the upper - the structure, at the same time is considered the weight of each layer. The characteristics of the upper layer change on length. To solve this problem were used an analytical and numerical methods of calculation. On the basis of the calculations can make the following conclusion: for the calculation of system «structure-foundation-basis» for the stage of pre-proposals it is advisable to apply the simplified model as sandwich beams and plates on elastic basis.

Initial Investigation Into Optimizing Design of a Pressure Vessel Saddle

2008 ◽  
Author(s):  
Shafique M. A. Khan
Keyword(s):  
Numerical Methods ◽  
Stress Distribution ◽  
Pressure Vessel ◽  
Design Guidelines ◽  
Von Mises Stress ◽  
Modeling And Analysis ◽  
Initial Investigation ◽  
Optimizing Design ◽  
Von Mises ◽  
Computational Technology

The ASME Boiler and Pressure Vessel Code does not provide details of the pressure vessel saddle supports. The existing design guidelines are based on classical stress analysis with several assumptions to simplify the problem. With the advances in the computational technology and numerical methods, it is now possible to obtain more detailed information about stress distribution and hence provide optimal saddle design guidelines. This study will present an initial investigation into a 3D computational modeling and analysis of the saddle design. Results are presented for maximum von Mises stress occurring in various parts of the saddle with the increase in load.

scholarly journals Effect of Cutting Parameter on Material Removal Rate and Surface Roughness in Deep Drilling Process

2016 ◽  
Vol 2 (5) ◽  
Author(s):  
Mostafa A. Abdullah  , Ahmed B. Abdulwahhab   ,   Atheer R.
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Spindle Speed ◽  
Cutting Conditions ◽  
Drilling Process ◽  
Tool Diameter ◽  
Twist Drills

In the curents study aimed to assess the effects of cutting conditions  (spindle speed, feed rate, tool diameter) parameters as input impact on material removal rate (MRR) and surface roughness (Ra) as output of steel (AISI 1015). A number of drilling experiments were conducted using the L9 orthogonal array on conventional drilling machine with use feed rate (0.038,0.076,0.203) mm/rev and spindle speed (132,550,930) rpm and tool diameter (11,15,20) mm HSS twist drills under dry cutting conditions. Analysis of variance (ANOVA) was employed to determine the most significant control factors affecting on surface roughness and MRR. The result shown the tool diameter the important factor effect with (64.08%) and (76.12%) on MRR and surface roughness respectively.

Modeling and Analysis of the Effect of Preloaded Pressing Force on Gap Formation during the Drilling of Double-Layered Material

2012 ◽  
Vol 217-219 ◽  
pp. 1541-1546 ◽  
Author(s):  
Yuan Li ◽  
Yong Xiang Hu ◽  
Zhen Qiang Yao
Keyword(s):  
Layered Material ◽  
Burr Formation ◽  
Drilling Process ◽  
Structural Members ◽  
Gap Formation ◽  
Drilling Force ◽  
Modeling And Analysis ◽  
Pressing Force ◽  
Theory Of Plates ◽  
Plates And Shells

The drilling of multi-layered structural members has been a crucial process in aeronautic manufacturing. The burr formation on layer surfaces, especially on inter-layer surfaces, causes extra amount of deburring operations which waste time and cost. The inter-layer burr formation depends greatly on the size of the inter-layer gap which results from different deformations of the upper layers and the lower layers during a drilling process. Based on the theory of plates and shells, this paper discusses the drilling process of two stacked circular Al-2024T3 plates with edges built-in. The dependence of the inter layer gap formation on the pressing parameters and the axial drilling force is also discussed in this report.

Modeling and Analysis of Material Removal Characteristics in Silicon Wafer Double Side Polishing

2012 ◽  
Vol 516 ◽  
pp. 384-389
Author(s):  
Sang Jik Lee ◽  
Hyoung Jae Kim ◽  
Hae Do Jeong
Keyword(s):  
Integrated Circuits ◽  
Process Parameters ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Thickness Variation ◽  
Modeling And Analysis ◽  
Profile Variation ◽  
Friction Energy ◽  
Wafer Edge

As advancing technologies increase the demand for yield and planarity in integrated circuits, wafers have become larger and their specifications more stringent. Flatness, thickness variation and nanotopography have emerged as important concerns in the wafering process. Double side polishing has been adopted as a solution to these problems. This paper focuses on the material removal characteristics and wafer profile variation during Si double side polishing. A polishing experiment to investigate Si removal characteristics according to process parameters was carried out in a single head rotary polisher equipped with a monitoring system for friction force. It was found that the material removal rate is related to friction energy rate, and the polishing state was transited and divided into three conditions according to pressure. On the basis of the experimental results, the wafer profile variation in double side polishing was modelled and simulated according to pressure. The friction energy was calculated to find the material removal amount across the wafer. With the conversion of calculated friction energy to the material removal amount, wafer profile variation was simulated. As a result, the wafer profile variation and its range were increased with a pressure increase, and originated from the position near the wafer edge.

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