Effects of Elastic Stress on the Stability of a Solid-Liquid Interface

1990 ◽  
Vol 43 (5S) ◽  
pp. S54-S55
Author(s):  
B. J. Spencer ◽  
S. H. Davis ◽  
G. B. McFadden ◽  
P. W. Voorhees
Keyword(s):  
Elastic Stress ◽  
Melting Process ◽  
Liquid Interface ◽  
Liquid Interfaces ◽  
Morphological Stability ◽  
Directionally Solidified ◽  
Elastic Stresses ◽  
The Stability ◽  
Solid Liquid Interface ◽  
Solid Liquid

The effects of elastic stress on the stability of solid-liquid interfaces under a variety of conditions are discussed. In the cases discussed, the nonuniform composition field in the solid, which accompanies either the melting process or the development of a perturbation on the solid-liquid interface during solidification, generates nonhydrostatic stresses in the solid. Such compositionally generated elastic stresses have been shown experimentally to induce a solidifying solid-liquid interface to become unstable. We are in the process of analyzing the effects of these stresses on the conditions for morphological stability of a directionally solidified binary alloy.

Stability of Solid/Liquid Interface of Pb-80wt%Sn Alloy under Direct Current during Directional Solidification

2013 ◽  
Vol 313-314 ◽  
pp. 245-248
Author(s):  
Ning Li ◽  
Rong Zhang ◽  
Li Min Zhang ◽  
Li Fei Du ◽  
Qian Liu
Keyword(s):  
Growth Rate ◽  
Directional Solidification ◽  
Direct Current ◽  
Liquid Interface ◽  
Density Current ◽  
Medium Density ◽  
Morphological Stability ◽  
The Stability ◽  
Solid Liquid Interface ◽  
Solid Liquid

The effect of medium-density current on the morphological stability of S/L interface of Pb-80wt%Sn alloy during directional solidification was investigated. The results indicated that both the DC of positive and negative 200 Acm-2 could decrease the critical growth rate of cellular/dendrite transition and minish the range of growth rate of cellular crystal. DC accelerated the microstructure transition from cellular crystal to dendrite crystal at the same pulling rate. Furthermore, the dendrite crystal was refined by positive and negative DC at high pulling rate. The effect of direction of DC to the microstructure transition could be neglected. In conclusion, the positive and negative 200 Acm-2 decreased the stability of solid/liquid interface of Pb-80%Sn alloy, and the lower the pulling rate was applied, the more obviously DC affected the microstructure.

scholarly journals Solid-liquid interface morphology of white carbide eutectic during directional solidification

2017 ◽  
Vol 62 (1) ◽  
pp. 365-368 ◽  
Author(s):  
M. Trepczyńska-Łent
Keyword(s):  
Longitudinal Section ◽  
Argon Atmosphere ◽  
Liquid Interface ◽  
Interface Morphology ◽  
Directionally Solidified ◽  
Constant Temperature Gradient ◽  
Solid Liquid Interface ◽  
Solid Liquid ◽  
Scanning Electron ◽  
Made In

AbstractIn this paper the analysis of solid-liquid interface morphology in white carbide eutectic was made. In a vacuum Bridgman-type furnace, under an argon atmosphere, directionally solidified sample of Fe - C alloy was produced. The pulling rate was v = 125 μm/s (450 mm/h) and constant temperature gradient G = 33.5 K/mm. The microstructure of the sample was frozen. The microstructure of the sample was examined on the longitudinal section using an light microscope and scanning electron microscope.

scholarly journals Shining light on the solid–liquid interface: in situ/operando monitoring of surface catalysis

2020 ◽  
Vol 10 (16) ◽  
pp. 5362-5385
Author(s):  
Leila Negahdar ◽  
Christopher M. A. Parlett ◽  
Mark A. Isaacs ◽  
Andrew M. Beale ◽  
Karen Wilson ◽  
...  
Keyword(s):  
Liquid Interface ◽  
Solid Catalyst ◽  
Chemical Transformations ◽  
Liquid Interfaces ◽  
Surface Catalysis ◽  
Catalytically Active ◽  
Solid Liquid Interface ◽  
Solid Liquid ◽  
Insight Into

Many industrially important chemical transformations occur at the interface between a solid catalyst and liquid reactants. In situ and operando spectroscopies offer unique insight into the reactivity of such catalytically active solid–liquid interfaces.

Microstructure and Solid/Liquid Interface Evolutions of Directionally Solidified Fe-Al-Ta Eutectic Alloy

2019 ◽  
Vol 34 (3) ◽  
pp. 656-661 ◽  
Author(s):  
Chunjuan Cui ◽  
Songyuan Wang ◽  
Meng Yang ◽  
Haijun Su ◽  
Yagang Wen ◽  
...  
Keyword(s):  
Eutectic Alloy ◽  
Liquid Interface ◽  
Directionally Solidified ◽  
Solid Liquid Interface ◽  
Solid Liquid

Morphological stability of the planar solid‐liquid interface

1981 ◽  
Vol 52 (4) ◽  
pp. 2971-2982 ◽  
Author(s):  
Douglas E. Holmes ◽  
Harry C. Gatos
Keyword(s):  
Liquid Interface ◽  
Morphological Stability ◽  
Solid Liquid Interface ◽  
Solid Liquid

Effect of Heating Temperature on Microstructure of Directionally Solidified Ni-43Ti-7Al Alloy

2017 ◽  
Vol 898 ◽  
pp. 552-560 ◽  
Author(s):  
Lei Zhou ◽  
Li Jing Zheng ◽  
Hu Zhang
Keyword(s):  
Volume Fraction ◽  
Heating Temperature ◽  
Thermal Gradients ◽  
Directionally Solidified ◽  
Melt Structure ◽  
Cast Sample ◽  
The Stability ◽  
Solid Liquid Interface ◽  
Solid Liquid ◽  
Liquid Metal Cooling

By liquid metal cooling (LMC) process, the Ni-43Ti-7Al (at.%) alloy has been directionally solidified (DS) at different heating temperatures (1450°C, 1550°C, 1650°C) and a constant withdrawal rate of 100μm/s. The results showed that anomalous eutectic structures which consisted of Ti2Ni and TiNi phases were formed at the grain boundaries of as-cast sample and similar structures were also observed in the intercellular regions of DS samples. However, the microstructure changed from the equiaxial structure to the cellular structure due to the axial thermal gradients imposed. After DS, the NiTi and Ti2Ni phases preferentially grew along certain orientation, but the preferred crystallographic orientations of them changed as the heating temperature increased to 1650°C, which might be related to the change of melt structure. As expected, the volume fraction of Ti2Ni increased from 3.3% to 5.2% and the cellular spacing decreased from 47.8μm to 27.0μm as heating temperature increased. In addition, the stability of solid/liquid interface decreased, resulting from the coupling effects of G and ΔT- with the heating temperature increasing.

Stability of Thermoelectromagnetic Convection

2006 ◽  
Author(s):  
Brent C. Houchens
Keyword(s):  
Numerical Solutions ◽  
Liquid Interface ◽  
Analytical And Numerical Solutions ◽  
The Stability ◽  
Solid Liquid Interface ◽  
Solid Liquid ◽  
Initial Results

The role of thermoelectromagnetic convection (TEMC) on the stability of a range of flows is investigated. Here we discuss the general features of TEMC, and describe experiments in which this effect is thought to have significance. The general formulation for TEMC at a solid-liquid interface is presented. Initial results are benchmarked with existing analytical and numerical solutions.

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