Morphological stability of the planar solid‐liquid interface

1981 ◽  
Vol 52 (4) ◽  
pp. 2971-2982 ◽  
Author(s):  
Douglas E. Holmes ◽  
Harry C. Gatos
2013 ◽  
Vol 313-314 ◽  
pp. 245-248
Author(s):  
Ning Li ◽  
Rong Zhang ◽  
Li Min Zhang ◽  
Li Fei Du ◽  
Qian Liu

The effect of medium-density current on the morphological stability of S/L interface of Pb-80wt%Sn alloy during directional solidification was investigated. The results indicated that both the DC of positive and negative 200 Acm-2 could decrease the critical growth rate of cellular/dendrite transition and minish the range of growth rate of cellular crystal. DC accelerated the microstructure transition from cellular crystal to dendrite crystal at the same pulling rate. Furthermore, the dendrite crystal was refined by positive and negative DC at high pulling rate. The effect of direction of DC to the microstructure transition could be neglected. In conclusion, the positive and negative 200 Acm-2 decreased the stability of solid/liquid interface of Pb-80%Sn alloy, and the lower the pulling rate was applied, the more obviously DC affected the microstructure.


1990 ◽  
Vol 43 (5S) ◽  
pp. S54-S55
Author(s):  
B. J. Spencer ◽  
S. H. Davis ◽  
G. B. McFadden ◽  
P. W. Voorhees

The effects of elastic stress on the stability of solid-liquid interfaces under a variety of conditions are discussed. In the cases discussed, the nonuniform composition field in the solid, which accompanies either the melting process or the development of a perturbation on the solid-liquid interface during solidification, generates nonhydrostatic stresses in the solid. Such compositionally generated elastic stresses have been shown experimentally to induce a solidifying solid-liquid interface to become unstable. We are in the process of analyzing the effects of these stresses on the conditions for morphological stability of a directionally solidified binary alloy.


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