Hot Wire/Film Behavior in Low-Temperature Gases

1992 ◽  
Vol 114 (4) ◽  
pp. 859-865 ◽  
Author(s):  
E. Y. Kwack ◽  
P. Shakkottai ◽  
T. S. Luchik ◽  
K. M. Aaron ◽  
G. Fabris ◽  
...  
Keyword(s):  
Low Temperatures ◽  
Room Temperature ◽  
Thermal Loading ◽  
Large Range ◽  
Harsh Environment ◽  
Cryogenic Temperatures ◽  
Hot Wire ◽  
Aspect Ratios ◽  
Helium Gas ◽  
Hot Wires

Commercially available hot wires/films were used to measure the velocities of evaporated hydrogen or helium gas during cryogenic mixing experiments. Hot wires were found to be too delicate to use in this harsh environment. Hot films were rugged enough to use at cryogenic temperatures even though they failed after a number of thermal cycles. Since the hot films have small aspect ratios, 13.4 and 20, they are quite sensitive to the thermal loading, Tw/Tg, even with a correction for the conduction end loss. In general, although the increase of the Nusselt number with Reynolds number at low temperatures was similar to that at room temperature, there was also a pronounced variation with Tw/Tg over the large range of 1.2 to 12 investigated.

A NEW FORM OF GAS THERMOMETER FOR USE AT VERY LOW TEMPERATURES

1938 ◽  
Vol 16a (7) ◽  
pp. 133-137 ◽  
Author(s):  
A. H. Woodcock
Keyword(s):  
Low Temperature ◽  
Liquid Helium ◽  
Experimental Test ◽  
Low Temperatures ◽  
Room Temperature ◽  
Initial Pressure ◽  
Liquid Hydrogen ◽  
Helium Gas ◽  
New Form ◽  
Mercury Manometer

A new form of helium gas thermometer is described, which is designed for permanent installation in low temperature equipment in order to cover the difficult region between the temperatures of liquid hydrogen and of liquid helium. The device departs radically from the usual gas thermometer practice by having the volume of gas which remains at room temperature considerably larger than that of the thermometer bulb proper. It is shown theoretically that by this means the sensitivity, as compared with that of an ordinary gas thermometer with the same initial pressure and temperature, is greatly increased at the lowest temperatures. Thus it is possible to construct a thermometer which is sufficiently sensitive in the region below 20° K. to read temperatures to within 0.1° with the aid of an ordinary mercury manometer, and yet have a pressure only of the order of one atmosphere at room temperature. An experimental test has shown that the device is entirely practicable.

Cryogenic atomic force microscopy

1991 ◽  
Vol 49 ◽  
pp. 54-55
Author(s):  
K. A. Fisher ◽  
M. G. L. Gustafsson ◽  
M. B. Shattuck ◽  
J. Clarke
Keyword(s):  
Room Temperature ◽  
Rapid Freezing ◽  
Cryogenic Temperatures ◽  
Soft Or ◽  
Electrically Conductive ◽  
Force Microscopy ◽  
Flexible Molecules ◽  
Advantages And Disadvantages ◽  
Atomic Force ◽  
Chemical Perturbation

The atomic force microscope (AFM) is capable of imaging electrically conductive and non-conductive surfaces at atomic resolution. When used to image biological samples, however, lateral resolution is often limited to nanometer levels, due primarily to AFM tip/sample interactions. Several approaches to immobilize and stabilize soft or flexible molecules for AFM have been examined, notably, tethering coating, and freezing. Although each approach has its advantages and disadvantages, rapid freezing techniques have the special advantage of avoiding chemical perturbation, and minimizing physical disruption of the sample. Scanning with an AFM at cryogenic temperatures has the potential to image frozen biomolecules at high resolution. We have constructed a force microscope capable of operating immersed in liquid n-pentane and have tested its performance at room temperature with carbon and metal-coated samples, and at 143° K with uncoated ferritin and purple membrane (PM).

Spherulite Structures in a Melt Spun Fe-Ni Austenitic Steel

1985 ◽  
Vol 43 ◽  
pp. 52-53
Author(s):  
G. M. Michal ◽  
T. K. Glasgow ◽  
T. J. Moore
Keyword(s):  
Austenitic Steel ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Large Range ◽  
Amorphous Structure ◽  
Nucleation And Growth ◽  
Ni Alloys ◽  
Melt Spun ◽  
Crystal Fibers ◽  
Rapidly Solidified

Large additions of B to Fe-Ni alloys can lead to the formation of an amorphous structure, if the alloy is rapidly cooled from the liquid state to room temperature. Isothermal aging of such structures at elevated temperatures causes crystallization to occur. Commonly such crystallization pro ceeds by the nucleation and growth of spherulites which are spherical crystalline bodies of radiating crystal fibers. Spherulite features were found in the present study in a rapidly solidified alloy that was fully crysstalline as-cast. This alloy was part of a program to develop an austenitic steel for elevated temperature applications by strengthening it with TiB2. The alloy contained a relatively large percentage of B, not to induce an amorphous structure, but only as a consequence of trying to obtain a large volume fracture of TiB2 in the completely processed alloy. The observation of spherulitic features in this alloy is described herein. Utilization of the large range of useful magnifications obtainable in a modern TEM, when a suitably thinned foil is available, was a key element in this analysis.

scholarly journals Review of Multi-Physics Modeling on the Active Magnetic Regenerative Refrigeration

2021 ◽  
Vol 26 (2) ◽  
pp. 47
Author(s):  
Julien Eustache ◽  
Antony Plait ◽  
Frédéric Dubas ◽  
Raynal Glises
Keyword(s):  
Magnetic Field ◽  
Low Temperatures ◽  
Room Temperature ◽  
State Of The Art ◽  
Vapor Compression ◽  
Crucial Step ◽  
Potential Alternative ◽  
Vapor Compression Refrigeration ◽  
Preliminary Study ◽  
Physics Modeling

Compared to conventional vapor-compression refrigeration systems, magnetic refrigeration is a promising and potential alternative technology. The magnetocaloric effect (MCE) is used to produce heat and cold sources through a magnetocaloric material (MCM). The material is submitted to a magnetic field with active magnetic regenerative refrigeration (AMRR) cycles. Initially, this effect was widely used for cryogenic applications to achieve very low temperatures. However, this technology must be improved to replace vapor-compression devices operating around room temperature. Therefore, over the last 30 years, a lot of studies have been done to obtain more efficient devices. Thus, the modeling is a crucial step to perform a preliminary study and optimization. In this paper, after a large introduction on MCE research, a state-of-the-art of multi-physics modeling on the AMRR cycle modeling is made. To end this paper, a suggestion of innovative and advanced modeling solutions to study magnetocaloric regenerator is described.

scholarly journals On the measurement of the ratio of the specific heats using small volumes of gas.—The ratios of the specific heat of air and of hydrogen at atmospheric pressure and a temperatures between 20°C. and —183°C

1925 ◽  
Vol 107 (743) ◽  
pp. 510-543 ◽  
Keyword(s):  
Systematic Error ◽  
Low Temperatures ◽  
Room Temperature ◽  
Expansion Chamber ◽  
Small Vessels ◽  
Specific Heats ◽  
Large Expansion ◽  
Before And After ◽  
The One ◽  
Chamber Capacity

Introduction .—In nearly all the previous determinations of the ratio of the specific heats of gases, from measurements of the pressures and temperature before and after an adiabatic expansion, large expansion chambers of fror 50 to 130 litres capacity have been used. Professor Callendar first suggests the use of smaller vessels, and in 1914, Mercer (‘Proc. Phys. Soc.,’ vol. 26 p. 155) made some measurements with several gases, but at room temperature only, using volumes of about 300 and 2000 c. c. respectively. He obtained values which indicated that small vessels could be used, and that, with proper corrections, a considerable degree of accuracy might be obtained. The one other experimenter who has used a small expansion chamber, capacity about 1 litre, is M. C. Shields (‘Phys. Rev.,’ 1917), who measured this ratio for air and for hydrogen at room temperature, about 18° C., and its value for hydroger at — 190° C. The chief advantage gained by the use of large expansion chambers is that no correction, or at the most, a very small one, has to be made for any systematic error due to the size of the containing vessels, but it is clear that, in the determinations of the ratio of the specific heats of gases at low temperatures, the use of small vessels becomes a practical necessity in order that uniform and steady temperature conditions may be obtained. Owing, however, to the presence of a systematic error depending upon the dimensions of the expansion chamber, the magnitude of which had not been definitely settled by experiment, the following work was undertaken with the object of investigating the method more fully, especially with regard to it? applicability to the determination of this ratio at low temperatures.

Low-temperature powder X-ray diffraction measurements in vacuum: analysis of the thermal displacement of copper

2016 ◽  
Vol 49 (1) ◽  
pp. 110-119 ◽  
Author(s):  
Nanna Wahlberg ◽  
Niels Bindzus ◽  
Sebastian Christensen ◽  
Jacob Becker ◽  
Ann-Christin Dippel ◽  
...  
Keyword(s):  
Distribution Function ◽  
Probability Distribution Function ◽  
Cell Parameter ◽  
Atomic Displacement ◽  
Cryogenic Temperatures ◽  
X Ray Diffraction ◽  
Atomic Displacement Parameter ◽  
Thermal Displacement ◽  
X Ray ◽  
Helium Gas

A serious limitation of the all-in-vacuum diffractometer reported by Straasø, Dippel, Becker & Als-Nielsen [J. Synchrotron Rad.(2014),21, 119–126] has so far been the inability to cool samples to near-cryogenic temperatures during measurement. The problem is solved by placing the sample in a jet of helium gas cooled by liquid nitrogen. The resulting temperature change is quantified by determining the change in unit-cell parameter and atomic displacement parameter of copper. The cooling proved successful, with a resulting temperature of ∼95 (3) K. The measured powder X-ray diffraction data are of superb quality and high resolution [up to sinθ/λ = 2.2 Å−1], permitting an extensive modelling of the thermal displacement. The anharmonic displacement of copper was modelled by a Gram–Charlier expansion of the temperature factor. As expected, the corresponding probability distribution function shows an increased probability away from neighbouring atoms and a decreased probability towards them.

scholarly journals The behaviour of visual purple at low temperature

1941 ◽  
Vol 179 (977) ◽  
pp. 151-159 ◽  
Keyword(s):  
Aqueous Solution ◽  
Low Temperature ◽  
Low Temperatures ◽  
Room Temperature ◽  
Absorption Curve ◽  
Quantum Yields

Visual purple is soluble and stable in a mixture of glycerol and water (3:1). At room temperature the spectrum of such a solution is identical with that of the aqueous solution. At — 73° C the peak of the absorption curve is higher and narrower than at room temperature, and it is shifted towards longer waves. The product of photodecomposition at — 73° C has a spectrum in ­ dependent of pH and is at low temperatures thermostable and photostable, but at room temperature it decomposes therm ally to indicator yellow. The primary product appears to be identical with transient orange. The quantum yields of the photoreaction at low and at room temperature are of the same order.

Magnetic Properties of Sputtered Fe-O and Co-O Thin Films

1995 ◽  
Vol 403 ◽  
Author(s):  
D. V. Dimitrov ◽  
A. S. Murthy ◽  
G. C. Hadjipanayis ◽  
C. P. SWANN
Keyword(s):  
Grain Size ◽  
Low Temperatures ◽  
Room Temperature ◽  
Oxide Films ◽  
X Ray Diffraction ◽  
Dc Magnetron Sputtering ◽  
Large Shift ◽  
X Ray ◽  
Grain Size And Shape ◽  
Spherical Grains

AbstractFe-O and Co-O films were prepared by DC magnetron sputtering in a mixture of Ar and O2 gases. By varying the oxygen to argon ratio, oxide films with stoichiometry FeO, Fe3O4, α-Fe2O3, CoO and Co3O4 were produced. TEM studies showed that the Fe – oxide films were polycrystalline consisting of small almost spherical grains, about 10 nm in size. Co-O films had different microstructure with grain size and shape dependent on the amount of oxygen. X-ray diffraction studies showed that the grains in Fe-O films were randomly oriented in contrast to Co-O films in which a <111> texture was observed. Pure FeO and α-Fe2O3 films were found to be superparamagnetic at room temperature but strongly ferromagnetic at low temperatures in contrast to the antiferromagnetic nature of bulk samples. A very large shift in the hysteresis loop, about 3800 Oe, was observed in field cooled Co-CoO films indicating the presence of a large unidirectional exchange anisotropy.

The Effect of Thermal Prestress on the Deformation of Micromirror Chip Embedded with Through-Silicon Vias

2011 ◽  
Vol 462-463 ◽  
pp. 563-568 ◽  
Author(s):  
Meng Kao Yeh ◽  
Chun Lin Lu
Keyword(s):  
Stress Distribution ◽  
Room Temperature ◽  
Thermal Loading ◽  
Heat Transfer Analysis ◽  
Processing Temperature ◽  
Temperature Decrease ◽  
Analysis Method ◽  
The Finite Element Method ◽  
Through Silicon Vias ◽  
Silicon Vias

The thermal expansion mismatch problem for a chip due to temperature decrease from processing temperature to room temperature may cause residual stress inside the chip structure. The thermal prestress accumulated and may affect the chip reliability when the chip was subjected to the thermal loading again. In this paper, the effect of thermal prestress on the micromirror chip embedded with copper through-silicon vias (TSVs) was investigated by the finite element method. In analysis, the micromirror chip embedded with TSVs was analyzed first under thermal loading which resulted from temperature decrease between the stress free processing temperature and room temperature. This process produced a thermal prestress in the micromirror chip. The chip was then subjected to a heat source at the bottom while in operation and the heat transfer analysis was used to simulate this situation. Finally, the thermal stress analysis was carried out to obtain the deformation and the stress distribution in the chip. The results show that the thermal prestress had strong effect on the chip reliability and should be reduced as much as possible. This paper proposed a three steps analysis method to obtain the deformation and the stress distribution in the chip, in which the effect of thermal prestress on the chip reliability was evaluated effectively.

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