Thermal Enhancement Coatings for Microelectronic Systems
1998 ◽
Vol 120
(3)
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pp. 229-237
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Keyword(s):
The power densities and heat generation in microelectronic systems have increased dramatically as individual electronic components have been miniaturized. As a result of the growing number of thermally-induced failures in these systems, their thermal performance has become the focus of increasing concern. The use of thermally conducting interstitial coatings within and between electronic components has proven to be one technique suitable for thermal enhancement. This review will address both metallic and nonmetallic coatings suitable for thermal enhancement and discuss some of the major areas of application.
Keyword(s):
2020 ◽
Vol 28
(01)
◽
pp. 2050008
Keyword(s):
2018 ◽
Vol 126
◽
pp. 324-335
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Keyword(s):
2019 ◽
Vol 233
(4)
◽
pp. 871-898
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2011 ◽
Vol 179-180
◽
pp. 298-303
2017 ◽
Vol 9
(4)
◽
Keyword(s):