Thermal Enhancement Using Nanofluids on High Heat Dissipation Electronic Components

2019 ◽  
Vol 8 (1) ◽  
pp. 30-40 ◽  
Author(s):  
Roger R. Riehl
Keyword(s):  
Heat Dissipation ◽  
High Heat ◽  
Electronic Components ◽  
Thermal Enhancement

Experimental Investigation of a Thermosyphon With Microstructure on the Boiling Surface

2018 ◽  
Vol 11 (1) ◽  
Author(s):  
Y. Chai ◽  
W. Tian ◽  
J. Tian ◽  
L. W. Jin ◽  
X. Z. Meng ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Dissipation ◽  
Pool Boiling ◽  
High Heat ◽  
Primary Concern ◽  
Heat Transfer Efficiency ◽  
Heater Wall ◽  
Micro Structures ◽  
Thermal Physical Properties ◽  
Graphite Foam

Abstract In recent years, a primary concern in the development of electronic technology is high heat dissipation of power devices. The advantages of unique thermal physical properties of graphite foam raise up the possibility of developing pool boiling system with better heat transfer efficiency. A compact thermosyphon was developed with graphite foam insertions to explore how different parameters affect boiling performance. Heater wall temperature, superheat, departure frequency of bubbles, and thermal resistance of the system were analyzed. The results indicated that the boiling performance is affected significantly by thermal conductivity and pore diameter of graphite foam. A proposed heat transfer empirical correlation reflecting the relations between graphite foam micro structures and pool boiling performance of Novec7100 was developed in this paper.

A Study on the Control of Residual Stress of Copper Thick-Film Using 2D Nanomaterial

2021 ◽  
Vol 21 (12) ◽  
pp. 5960-5964
Author(s):  
Kwon Jai Lee ◽  
Jee Young Oh ◽  
Kyong Nam Kim
Keyword(s):  
Residual Stress ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Rapid Development ◽  
Electronic Devices ◽  
Copper Film ◽  
Electronics Industry ◽  
Electronic Components ◽  
Graphene Layers ◽  
Electronic Parts

With the rapid development of the electronics industry, high-density electronic devices and component mounting have gained popularity. Because of the heat generated from these devices, efficiency of the electronic parts is significantly lowered and life of various electronic devices is considerably shortened. Therefore, it is essential to efficiently dissipate the heat generated from the device to extend product life and ensure high efficiency of electronic components. This study evaluated how residual stress is impacted by the thickness of the deposited copper film, which is widely used as a heat dissipation material, and the number of graphene layers. The results confirmed that the residual stress decreased with increasing thickness. Moreover, the residual stress changed based on the transfer area of graphene, which had an elastic modulus eight times that of copper, indicating that the residual stress of the deposited copper film can be controlled.

PTFE Modification to Enhance Boiling Performance of Porous Surface

2020 ◽  
Vol 142 (7) ◽  
Author(s):  
Ya-Qiao Wang ◽  
Jia-Li Luo ◽  
Yi Heng ◽  
Dong-Chuan Mo ◽  
Shu-Shen Lyu
Keyword(s):  
Boiling Heat Transfer ◽  
Heat Dissipation ◽  
Flat Surface ◽  
Hydrophobic Surface ◽  
High Heat ◽  
High Heat Flux ◽  
Pin Fin ◽  
Original Surface ◽  
Wall Superheat ◽  
Hybrid Modification

Abstract Boiling heat transfer is one of the most effective methods to meet the challenge of heat dissipation of high heat flux devices. A wetting hybrid surface has been shown to have better performance than the hydrophilic or hydrophobic surface. This kind of wetting hybrid modification is always carried out on a plain or flat surface. In this paper, polytetrafluoroethylene (PTFE) powders were coated on a superhydrophilic microcopper dendrite fin surface to build a wetting hybrid surface. The pool-boiling experimental results showed that after applying the coating, the wall superheat dramatically decreased to 8 K, which is 9 K lower than that on the original surface at 250 W·cm−2, and has a better performance than a silicon pin-fin-based wetting hybrid surface.

The Effect of Porous Material on the Improvement of the Micro-Chip Heat Dissipation

2008 ◽  
Author(s):  
Chyouhwu B. Huang ◽  
Hung-Shyong Chen ◽  
Szu-Ming Wu
Keyword(s):  
Heat Transfer ◽  
Porous Material ◽  
Porous Materials ◽  
Heat Transfer Rate ◽  
Transfer Rate ◽  
Heat Dissipation ◽  
Porous Ceramic ◽  
High Heat ◽  
Force Convection ◽  
Uninterruptible Power

Heat dissipation is a very important subject when dealing with industrial application especially in modern semiconductor related applications. Several techniques have been developed to solve the heat generated problem, such as heat dissipation device in IC packaging, high heat conductivity materials, heat tube, force convection, etc. Porous material is used in this study. Porous material is known to have large interior surface, therefore, with proper force convection; it can easily carry heat away. Micro porous ceramic (porous size: 490 μm) is attached to uninterruptible power supply (UPS) power chips. The increase of the heat dissipation rate improves UPS performance. Heat transfer properties comparisons for power chip with and without micro porous materials attached are studies. Also, heat transfer rate under different fan speeds (force convection) is studied. The results show that, heat transfer increases with the use of micro porous materials, the effectiveness ranges between 2–22%. Also, the heat transfer rate varies with air flow rate, the increase of heat transfer is about 4–6%. The dust effect was also performed; experimental results show that heat transfer rate will not be affected by the accumulated dust if a micro porous material is applied.

A flexible carbon nanotube-pyrolytic carbon sandwich paper with a stable structure and high heat-dissipation capacity

Carbon ◽  
2020 ◽  
Vol 158 ◽  
pp. 930
Author(s):  
Xue-song Liu ◽  
Qian-gang Fu ◽  
Hui Wang ◽  
Ya-long Wei ◽  
Qiang Song
Keyword(s):  
Carbon Nanotube ◽  
Heat Dissipation ◽  
Pyrolytic Carbon ◽  
High Heat ◽  
Stable Structure

scholarly journals Experimental Study on Thermal Performance of a Bent Copper-Water Heat Pipe

2020 ◽  
Vol 2020 ◽  
pp. 1-10
Author(s):  
Shuangshuang Miao ◽  
Jiajia Sui ◽  
Yulong Zhang ◽  
Feng Yao ◽  
Xiangdong Liu
Keyword(s):  
Heat Flux ◽  
Heat Pipe ◽  
Critical Heat Flux ◽  
Working Conditions ◽  
Thermal Performance ◽  
Heat Input ◽  
High Heat ◽  
High Heat Flux ◽  
Electronic Components ◽  
Copper Water

Vapor-liquid phase change is regarded as an efficient cooling method for high-heat-flux electronic components. The copper-water bent heat pipes are particularly suited to the circumstances of confined space or misplaced heat and cold sources for high-heat-flux electronic components. In this paper, the steady and transient thermal performance of a bent copper-water heat pipe is studied based on a performance test system. The effects of cooling temperature, working conditions on the critical heat flux, and equivalent thermal conductivity have been examined and analyzed. Moreover, the influences of heat input and working conditions on the thermal response of a bent heat pipe have also been discussed. The results indicate that the critical heat flux is enhanced due to the increases in cooling temperature and the lengths of the evaporator and condenser. In addition, the critical heat flux is improved by extending the cooling length only when the operating temperature is higher than 50°C. The improvement on the equivalent thermal by increasing the heating length is more evident than that by increasing cooling length. It is also demonstrated by the experiment that the bent copper-water heat pipe can respond quickly to the variation of heat input and possesses superior transient heat transfer performance.

Performance of a-SiGe:H Thin-Film Solar Cells on High-Heat Dissipation Flexible Ceramic Printable Circuit Board

2014 ◽  
Vol 61 (9) ◽  
pp. 3125-3130 ◽  
Author(s):  
Chao-Chun Wang ◽  
Zong-Syun Wu ◽  
Chia-Hsun Hsu ◽  
Shui-Yang Lien ◽  
Dong-Sing Wuu ◽  
...  
Keyword(s):  
Thin Film ◽  
Solar Cells ◽  
Heat Dissipation ◽  
High Heat ◽  
Thin Film Solar Cells ◽  
Circuit Board
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