Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

1998 ◽  
Vol 120 (2) ◽  
pp. 175-178 ◽  
Author(s):  
K.-N. Chiang ◽  
W.-L. Chen
Keyword(s):  
Solder Joint ◽  
Electronic Packaging ◽  
Engineering Application ◽  
Contact Angles ◽  
Joint Models ◽  
Surface Evolver ◽  
Minimization Principle ◽  
Shape Prediction ◽  
Fine Pitch ◽  
Practical Engineering

The increasing need to create high density and fine pitch electronic interconnections presents a number of challenges. The fatigue-induced solder joint failure of surface mounted electronic devices has become one of the most critical reliability issues in electronic packaging industry. Prediction of the shape of solder joint has drawn special attention in the development of electronic packaging for its practical engineering application. Many solder joint models have been developed based on energy minimization principle (Patra et al., 1995) or analytical method (Heinrich et al., 1993; Liedtke 1993). These methods are extensively utilized to the shape design of solder joint. However, it is important to find a suitable method in real application. In this study, an efficient numerical method used to predict the shapes of solder joint is investigated, and the results are compared with Surface Evolver program (Brakke, 1994). The changes of geometric shape with respect to different parameters of solder joint are also discussed in this paper. The influences of the geometric parameters, such as volumes of solder joint, package weight, contact angles, pads sizes, solder surface tension, and gravity forces to the shape of solder joint, are investigated. Results presented in this study can be used to determined the optimally balanced stand-off height of single ball module (SBM) or multiple ball module (MBM) solder joint models.

A Two-Body Formulation for Solder Joint Shape Prediction

1998 ◽  
Vol 120 (3) ◽  
pp. 302-308 ◽  
Author(s):  
F. P. Renken ◽  
G. Subbarayan
Keyword(s):  
Solder Joint ◽  
Surface Area ◽  
Flip Chip ◽  
Contact Angles ◽  
Sessile Droplet ◽  
Solution Approach ◽  
Shape Prediction ◽  
Body Formulation ◽  
Wetted Surface Area ◽  
Joint Shape

Solder shape prediction is essential for accurate fatigue life determination and joint design optimization. In the present paper, a new solution approach using the surface tension theory is developed to simultaneously predict standoff height, wetted surface area, contact angles, and solder shape by including energy effects between a molten solder body and an arbitrarily shaped solid body. Existing models for solder shape prediction do not appear to determine all characteristics including joint standoff height, wetted surface area, and contact angles simultaneously. A general two-body axisymmetric finite element code is developed and coupled with a constrained optimizer to solve four illustrative examples. These examples include the shape of a sessile droplet on a fixed pad, a flip-chip joint, a sessile droplet on a free surface, and a typical ceramic ball grid array solder joint. In all four examples, the results predicted by the present approach compare favorably with available experimental and numerical results.

Interconnect Design and Thermal Stress/Strain Analysis of Flip Chip Packaging

2006 ◽  
Vol 326-328 ◽  
pp. 521-524
Author(s):  
Chang Ming Liu ◽  
Chang Chun Lee ◽  
Hsiao Tung Ku ◽  
Chien Chia Chiu ◽  
Kuo Ning Chiang
Keyword(s):  
Solder Joint ◽  
Electronic Packaging ◽  
Flip Chip ◽  
Thermal Loading ◽  
Equivalent Plastic Strain ◽  
Engineering Application ◽  
Stress Strain ◽  
Element Analysis ◽  
Design Guideline ◽  
Solder Balls

As the interconnection density of electronic packaging continues to increase, the fatigueinduced solder joint failure of surface mounted electronic devices become one of the most critical reliability issues in electronic packaging industry. Especially, prediction of the shape of solder joint is a major event in the development of electronic packaging for its practical engineering application. In conventional electronic packages, the geometrical dimensions of solder balls and solder pads of the package are the same. In this research, a hybrid method combined with analytical and energybased methods is utilized to predict force-balanced heights and geometry profiles of solder balls under various solder volume and pad dimensions as well as their relative location during the reflow process. Next, a non-linear finite element analysis is adopted to investigate the stress/strain behavior of solder balls in flip chip package. The results reveal that as the flip chip package contains larger solder balls located at the corner area underneath the chip, the maximum equivalent plastic strain/stress is evidently reduced and the reliability cycles under thermal loading are enhanced. Furthermore, the results presented in this research can be used as a design guideline for area array interconnections.

Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices

2004 ◽  
Vol 126 (1) ◽  
pp. 22-25 ◽  
Author(s):  
Li Ming Yu ◽  
Bang Han Sur ◽  
Kim Young Pyo ◽  
Wang Chun Qing ◽  
Zhang Lei
Keyword(s):  
Surface Tension ◽  
Solder Joint ◽  
3D Model ◽  
Solder Joints ◽  
Wetting Angle ◽  
Forming Process ◽  
Surface Evolver ◽  
Effective Factors ◽  
Factors Influencing ◽  
Fine Pitch

Solder bridging is one of the most serious defects of solder joint in fine pitch device assemblies. It is known that the generation of solder bridging is closely related to the forming process of solder joints. To simulate the process, a 3D model is formed. Then it is numerically simulated using Surface Evolver program. Based on the results, the solder bridging mechanism and the effective factors including wetting angle and surface tension are investigated.

Reballing/Rebumping Ultra-Fine Pitch Packages Less Than 0.5 mm Pitch for FA

2014 ◽  
Author(s):  
Bob Wettermann
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Joint Strength ◽  
Semiconductor Devices ◽  
X Ray ◽  
Fine Pitch ◽  
Manual Methods

Abstract As the pitch and package sizes of semiconductor devices have shrunk and their complexity has increased, the manual methods by which the packages can be re-bumped or reballed for failure analysis have not kept up with this miniaturization. There are some changes in the types of reballing preforms used in these manual methods along with solder excavation techniques required for packages with pitches as fine as 0.3mm. This paper will describe the shortcomings of the previous methods, explain the newer methods and materials and demonstrate their robustness through yield, mechanical solder joint strength and x-ray analysis.

Dynamic Characteristics and Stability Analysis of Two-Dimensional (2D) Electro-Hydraulic Proportional Directional Valve

2015 ◽  
Author(s):  
S. Li ◽  
J. Ruan ◽  
B. Meng ◽  
W. A. Jia ◽  
H. Y. Xie
Keyword(s):  
Dynamic Characteristics ◽  
Magnetic Force ◽  
Engineering Application ◽  
Proportional Valve ◽  
Acceptable Range ◽  
Hydrostatic Force ◽  
Practical Engineering ◽  
Direct Operation ◽  
Electrohydraulic Valve ◽  
Proportional Directional Valve

A 2D electrohydraulic proportional directional valve is proposed, which integrates both direct and pilot operation of the valve. In this valve, the output magnetic force of the proportional solenoid is converted to rotate the spool through a thrust-torsion coupling and thus the pressure in the valve sensitive chamber is varied. The varied pressure exerted on the areas of the spool end produces a hydrostatic force to move the spool linearly, which will rotate the spool reversely. Theoretical analysis is carried to the proposed valve and the effects of the key geometric parameters on the dynamic characteristics of the 2D valve and stability are investigated. Experiments are also designed to access to the characteristics of the valve working under direct and pilot operation. The 2D electrohydraulic valve can work properly for both direct operation and pilot operation. The hysteresis and frequency response are measured and the results are within the acceptable range in practical engineering application required of the directional proportional valve.

Study on the Conversion Method of Three-Dimensional Shape Prediction Model of BGA Solder Joints

2013 ◽  
Vol 706-708 ◽  
pp. 1693-1696
Author(s):  
Hua Bin Zhao ◽  
De Jian Zhou
Keyword(s):  
Solder Joints ◽  
Three Dimensional ◽  
Ball Grid Array ◽  
Analysis Software ◽  
Surface Evolver ◽  
Element Analysis ◽  
Shape Prediction ◽  
Dimensional Shape ◽  
Point Line ◽  
Three Dimensional Shape

In the study of three-dimensional shape prediction of SMT solder joints, the software Surface Evolver has been widely applied as a quick and accurate effective tool for the prediction of solder joints shape. But the model it builds is not able to be directly imported into any finite element analysis software like ANSYS, and even after the import it still needs a lot of time to mend the import model. For this issue, to predict of the solder joints shape of ball grid array (BGA), the implement programs of three conversion methods of point-line-area method, axisymmetric method and infinitesimal method are given. By comparison, axisymmetric method and infinitesimal method are more suitable for the shape conversion of BGA solder joints.

scholarly journals Experimental Study on Influence of Temperature to Control Performance for Viscoelastic Materials Pounding Tuned Mass Damper

2021 ◽  
Vol 8 ◽  
Author(s):  
Dehui Ye ◽  
Jie Tan ◽  
Yabin Liang ◽  
Qian Feng
Keyword(s):  
Engineering Application ◽  
Tuned Mass Damper ◽  
Frame Structure ◽  
Force Model ◽  
Viscoelastic Materials ◽  
Mass System ◽  
Mass Damper ◽  
Different Temperatures ◽  
Practical Engineering ◽  
Portal Frame Structure

The pounding tuned mass damper (PTMD) is a novel passive damper that absorbs and dissipates energy by an auxiliary tuned spring-mass system. Viscoelastic materials are attached to the interface of the limitation collar in the PTMD so that the energy dissipation capacity can be enhanced. Previous studies have successfully demonstrated the effectiveness of PTMD at room temperature. However, in practice, the PTMD may face a broad temperature range, which can affect the mechanical properties of the viscoelastic materials. Thus, the study of vibration control effectiveness of PTMD at different temperatures is of great significance for its practical engineering application. In this paper, a series of experiments were conducted to investigate the performance of a PTMD in a temperature-controlled environment. A PTMD device was designed to suppress the vibration of a portal frame structure and tested across environmental temperatures ranging from –20°C to 45°C. The displacement reduction ratios demonstrated the temperature robustness of the PTMD. Additionally, the numerical results validated the accuracy of the pounding force model and the performance of PTMD.

Study on Flexural Behavior of Pre-Stressed Concrete Hollow Slabs Strengthen with CFRP

2013 ◽  
Vol 446-447 ◽  
pp. 1413-1416
Author(s):  
Bo Wang ◽  
Juan Han
Keyword(s):  
Experimental Method ◽  
Engineering Application ◽  
Flexural Behavior ◽  
Experimental Basis ◽  
Concentrated Force ◽  
Disaster Area ◽  
Practical Engineering ◽  
Symmetrical Load

The purpose of this paper is to focus on studying its flexural behavior after different damages pre-stressed concrete hollow slab is strengthened with CFRP. By the experimental method, twelve residential pre-stressed concrete hollow slabs are tested under concentrated force at the two points of the symmetrical load in order to analyze both flexural behavior and effects factored by different bonding modes. The conclusion can be drawn that the flexural behavior of pre-stressed concrete hollow slabs strengthened with CFRP is well-tried. It provides design suggestions and reference for pre-stressed concrete hollow slabs strengthened with CFRP, and also provides an experimental basis for the repairing and reinforcing practical engineering application in Wenchuan disaster area.

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