scholarly journals Erratum: “Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model” [Journal of Electronic Packaging, 2005, 127(3), pp. 290–298]

2006 ◽  
Vol 128 (1) ◽  
pp. 98-98
Author(s):  
Mudasir Ahmad ◽  
Ken Hubbard ◽  
Mason Hu
Keyword(s):  
Solder Joint ◽  
Electronic Packaging ◽  
Viscoplastic Model ◽  
Shape Prediction ◽  
Joint Shape

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

1998 ◽  
Vol 120 (2) ◽  
pp. 175-178 ◽  
Author(s):  
K.-N. Chiang ◽  
W.-L. Chen
Keyword(s):  
Solder Joint ◽  
Electronic Packaging ◽  
Engineering Application ◽  
Contact Angles ◽  
Joint Models ◽  
Surface Evolver ◽  
Minimization Principle ◽  
Shape Prediction ◽  
Fine Pitch ◽  
Practical Engineering

The increasing need to create high density and fine pitch electronic interconnections presents a number of challenges. The fatigue-induced solder joint failure of surface mounted electronic devices has become one of the most critical reliability issues in electronic packaging industry. Prediction of the shape of solder joint has drawn special attention in the development of electronic packaging for its practical engineering application. Many solder joint models have been developed based on energy minimization principle (Patra et al., 1995) or analytical method (Heinrich et al., 1993; Liedtke 1993). These methods are extensively utilized to the shape design of solder joint. However, it is important to find a suitable method in real application. In this study, an efficient numerical method used to predict the shapes of solder joint is investigated, and the results are compared with Surface Evolver program (Brakke, 1994). The changes of geometric shape with respect to different parameters of solder joint are also discussed in this paper. The influences of the geometric parameters, such as volumes of solder joint, package weight, contact angles, pads sizes, solder surface tension, and gravity forces to the shape of solder joint, are investigated. Results presented in this study can be used to determined the optimally balanced stand-off height of single ball module (SBM) or multiple ball module (MBM) solder joint models.

A Two-Body Formulation for Solder Joint Shape Prediction

1998 ◽  
Vol 120 (3) ◽  
pp. 302-308 ◽  
Author(s):  
F. P. Renken ◽  
G. Subbarayan
Keyword(s):  
Solder Joint ◽  
Surface Area ◽  
Flip Chip ◽  
Contact Angles ◽  
Sessile Droplet ◽  
Solution Approach ◽  
Shape Prediction ◽  
Body Formulation ◽  
Wetted Surface Area ◽  
Joint Shape

Solder shape prediction is essential for accurate fatigue life determination and joint design optimization. In the present paper, a new solution approach using the surface tension theory is developed to simultaneously predict standoff height, wetted surface area, contact angles, and solder shape by including energy effects between a molten solder body and an arbitrarily shaped solid body. Existing models for solder shape prediction do not appear to determine all characteristics including joint standoff height, wetted surface area, and contact angles simultaneously. A general two-body axisymmetric finite element code is developed and coupled with a constrained optimizer to solve four illustrative examples. These examples include the shape of a sessile droplet on a fixed pad, a flip-chip joint, a sessile droplet on a free surface, and a typical ceramic ball grid array solder joint. In all four examples, the results predicted by the present approach compare favorably with available experimental and numerical results.

Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model

2004 ◽  
Vol 127 (3) ◽  
pp. 290-298 ◽  
Author(s):  
Mudasir Ahmad ◽  
Ken Hubbard ◽  
Mason Hu
Keyword(s):  
Surface Tension ◽  
Numerical Model ◽  
Solder Joint ◽  
Solder Joints ◽  
Element Analysis ◽  
Closed Form Solutions ◽  
Joint Construction ◽  
Shape Prediction ◽  
Applied Forces ◽  
Joint Shape

Ball grid array solder joint reliability is known to be dependent on the shape of solder joints after reflow. To ensure good solder joint formation and prevent solder bridging, it is critical to understand the amount of paste volume needed during assembly and reflow. The final shape of the solder joint is a function of surface tension, wetting area, gravity, and applied forces. In this paper, a new methodology to simulate solder joint shape is presented. Large deformation viscoplastic finite element analysis is used to simulate incompressible fluid flow. A numerical model for surface tension is outlined and validated with closed-form solutions. The results of the numerical model are compared to other known solder joint shape prediction methods. The effects of package weight, coplanarity, warpage, paste volume, pad misregistration, and joint construction on solder joint shape are then analyzed. Recommendations are provided on ways to maximize standoff height and avoid bridging. Finally, the formation of leadless solder joints is studied and compared to experimental data.

Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP's

2004 ◽  
Vol 1 (2) ◽  
pp. 53-63 ◽  
Author(s):  
Co van Veen ◽  
Bart Vandevelde ◽  
Eric Beyne
Keyword(s):  
Solder Joint ◽  
Force Constant ◽  
Local Stress ◽  
Simulation Software ◽  
Temperature Cycling ◽  
Circuit Board ◽  
Surface Evolver ◽  
Joint Shape ◽  
Profile Estimation ◽  
Analytical Expressions

Not only the stand-off height but also the shape of a solder joint has a strong influence on the joint reliability under temperature cycling. The shape determines the size of the local stress and strain concentrations. It is therefore very important to know well the joint shape after reflow. In a previous paper closed analytical expressions were derived for liquid bump shapes, as a function of pad size and bump height [1]. The bump deformation as a function of the chip weight could be derived from the force constant. In the present paper closed analytical expressions are derived for the force constant for liquid bumps having unequal spherical pad sizes. It turns out that the force constant for compression can be optimized as a function of the ratio of those pad sizes. The shape of the bump and especially the contact angle is of interest for modeling activities where geometrical effects do play a role. Furthermore from the variation in bumps heights on a chip an estimate can be made of the tilt of the chip after assembly. The solder profile estimation by the analytical expressions is validated by experimental results. Also a comparison with the solder profile estimation by the simulation software Surface Evolver is done. Both comparisons showed that the analytical estimation of the standoff height is very good as long as the gravitation energy contributed by the chip weight is less than 10% of the total energy. Finally, an example is shown where the analytical model and Surface Evolver are the geometrical input for a finite element model. The example considers a CSP assembled at both sides of the printed circuit board.

Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component

2009 ◽  
Author(s):  
Kanji Takagi ◽  
Qiang Yu ◽  
Tadahiro Shibutani ◽  
Hiroki Miyauchi
Keyword(s):  
Surface Tension ◽  
Solder Joint ◽  
High Reliability ◽  
Electronic Components ◽  
Reflow Process ◽  
Solder Joint Reliability ◽  
Automotive Electronic ◽  
Joint Reliability ◽  
On Chip ◽  
Joint Shape

The miniaturization and high reliability for automotive electronic components has been strongly requested. Generally, electronic component and printed wiring board are connected using solder joint. The reliability of solder joint has widely dispersion. For the dispersion reduction of solder joint reliability, not only design factors but manufacturing factors should be optimized. The evaluation of manufacturing factors for solder joint reliability was very difficult by experimental evaluation alone. Therefore, the reflow process simulation was established. The simulation was reenacted soldering process on chip component, which was the most severe reliability in automotive electronic components. The novelty of simulation was the coupled analysis of flow and rigid for simulating self-alignment of chip component. In this simulation, contact angle and surface tension was very important factor. So, these characteristics were measured based on Spread test and Wetting balance tests using the specimens. In the result, the solder joint shape of analysis was agree with the one of specimens using the measured contact angle and surface tension. Next, the effect of manufacturing process dispersion for solder joint shape was evaluated. The factors were mount offset and length unbalance of electrodes on chip component. As a result, the mount offset was not affected solder joint shape of chip component until a certain level. Also, the unbalance of electrode of chip component was not almost affected for solder joint shape of chip component because a part was moved to the center of part by surface tension of solder joint. Finally, the relation between the estimated solder joint shape and fatigue life of solder joints is evaluated using crack propagation analysis based on Manson-Coffin’s law and Miner’s rule. When the value of mount offset was large, the crack propagation mode was changed and the fatigue life of solder joint was decreased. As mentioned above, it was able to evaluate the relation between manufacturing factors and solder joint reliability. Accordingly, this simulation was very useful for consideration on the miniaturization, high reliability and appropriate margin for design of electronic components.

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