Statistical Model for the Inherent Tilt of Flip-Chips
Keyword(s):
The tilt of flip-chips is becoming increasingly important in optical and high-power electronic applications. This paper outlines the principal sources of tilt, and presents a mathematical algorithm for the statistical variation in inherent tilt, the component related to variability of solder pad dimensions. With the assistance of a Monte Carlo simulation, closed form equations are developed for several common families of symmetric pad footprints. Possible extension of the analytical tools to other important cases is discussed.
1997 ◽
Vol 49
(2)
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pp. 207-219
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Keyword(s):
2004 ◽
Vol 108
(9)
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pp. 1475-1481
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Keyword(s):
2013 ◽
Vol 50
(01)
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pp. 256-271
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Keyword(s):
1997 ◽
Vol 49
(3)
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pp. 307-317
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