Long-Term Reliability of Solder Joints in 3D ICs Under Near-Application Conditions

2019 ◽  
Author(s):  
Omar Ahmed ◽  
Golareh Jalilvand ◽  
Hector Fernandez ◽  
Peng Su ◽  
Tae-Kyu Lee ◽  
...  
Keyword(s):  
Solder Joints ◽  
3D Ics ◽  
Reliability Of Solder Joints

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

2005 ◽  
Vol 127 (4) ◽  
pp. 466-473 ◽  
Author(s):  
B. L. Chen ◽  
X. Q. Shi ◽  
G. Y. Li ◽  
K. H. Ang ◽  
Jason P. Pickering
Keyword(s):  
Solder Joints ◽  
Reliability Assessment ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Rapid Temperature ◽  
Reliability Of Solder Joints ◽  
Solder Joint Fatigue ◽  
Time Required ◽  
Failure Location

In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.

Long-Term Reliability of Solder Joints on Wafer-Level Packaged Accelerometer for Medical Applications

2007 ◽  
Author(s):  
Tom Kwa ◽  
Thorsten Teutsch
Keyword(s):  
High Performance ◽  
Solder Joints ◽  
Minimum Size ◽  
Medical Applications ◽  
Test Results ◽  
Wafer Level ◽  
Embedded Sensing ◽  
Small Footprint ◽  
Reliability Of Solder Joints

Miniaturization of devices is driving replacement of electronic components with surface mount technology (SMT) equivalent parts, including any embedded sensing devices. In many cases the size of the sensor is restricted by the minimum size of the package rather than by the die. Other solutions to preserve real-estate involve manual mounting of the die onto substrates that have gone through an SMT assembly process. The +/-2g accelerometer presented here is, to our knowledge, the first wafer-level packaged device with solderable terminals that allows the silicon die to be mounted directly onto a substrate in a standard SMT process and without the need for stressisolating interposers. With its small footprint and ceiling requirements (2.1 × 2.9 × 0.8 mm3), and robustness and high performance it is the smallest commercially-available packaged accelerometer suitable for medical applications where these characteristics are critical. The device features terminals that are electrically and mechanically separated but robust enough to withstand large shear forces that may occur during use and board assembly. The device was solder mounted on a variety of substrates without affecting its performance. Most significantly, both device and solder joints were able to withstand extended thermal cycling over a wide temperature range (-55 to 125°C). In this paper, we present the device design, the performance and the long-term reliability test results of this novel and high-performance device on a variety of substrates and solder materials.

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

scholarly journals Microstructure and long-term stability of solder joints on nickel-plated aluminium formed during short soldering times

RSC Advances ◽  
2020 ◽  
Vol 10 (66) ◽  
pp. 40215-40224
Author(s):  
Angela De Rose ◽  
Gabriele Mikolasch ◽  
Mathias Kamp ◽  
Achim Kraft ◽  
Mathias Nowottnick
Keyword(s):  
Solder Joints ◽  
Ambient Air ◽  
Mechanical Reliability ◽  
Term Stability ◽  
Long Term Stability

High mechanical reliability of tin-based solder joints processed by joining copper and nickel-coated aluminium with short soldering times in ambient air.

Reinforced Solder Technology for Increased Reliability

2017 ◽  
Vol 2017 (1) ◽  
pp. 000641-000645
Author(s):  
Tim Jensen ◽  
Sunny Neoh ◽  
Adam Murling
Keyword(s):  
Melting Point ◽  
Solder Joint ◽  
Solder Joints ◽  
Reliability Of Solder Joints ◽  
Impact Reliability ◽  
Selection Of

Abstract The reliability of solder joints have been studied for many years. The selection of a solder for a particular application is often limited based on melting point requirements. This limits the number of options that are available for use. When alloy selection options are limited, people look to process changes to try and improve the reliability. Two such areas that have been identified that can impact reliability are bondline control and void reduction. This paper analyzes a new reinforced solder technology to maintain a consistent solder joint bondline. Experiments were also conducted to determine how best to design these preforms to minimize voiding.

scholarly journals Impact of Conformal Coating Material on the Long-Term Reliability of Ball Grid Array Solder Joints

2019 ◽  
Vol 38 ◽  
pp. 1138-1142
Author(s):  
Abid-Alrahman Fawzi Abbas ◽  
Christopher M. Greene ◽  
Krishnaswami Srihari ◽  
Daryl Santos ◽  
Ganesh Pandiarajan
Keyword(s):  
Solder Joints ◽  
Ball Grid Array ◽  
Coating Material ◽  
Conformal Coating
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