Thermal Design and Optimization Methodology for Integrated Power Electronics Modules

2005 ◽  
Vol 127 (1) ◽  
pp. 59-66 ◽  
Author(s):  
Ying Feng Pang ◽  
Elaine P. Scott ◽  
Jonah Zhou Chen ◽  
Karen A. Thole
Keyword(s):  
Temperature Rise ◽  
Design Methodology ◽  
Three Dimensional ◽  
Thermal Design ◽  
Maximum Temperature ◽  
Percent Reduction ◽  
Design And Optimization ◽  
Overall Performance ◽  
The Common ◽  
Optimization Methodology

A methodology was developed and implemented to optimize the design layout for i_ntegrated p_ower e_lectronics m_odules (IPEMs) by considering both the electrical and thermal performances. This paper is primarily focused on the thermal aspects, which were analyzed using three-dimensional (3D) computational software tools. Implementation of the design methodology resulted in a 70 percent reduction in the common mode current, a 4 percent reduction in the size of the geometric footprint, and a 7°C reduction in the maximum temperature rise for the case studied, thus, providing an increase in the IPEM’s overall performance.

Electrical and Thermal Layout Design and Optimization Considerations for DPS Active IPEM

2002 ◽  
Author(s):  
Ying Feng Pang ◽  
Jonah Zhou Chen ◽  
Elaine P. Scott ◽  
Karen A. Thole
Keyword(s):  
Thermal Performance ◽  
Fluid Dynamic ◽  
Layout Design ◽  
Maximum Temperature ◽  
3D Finite Element ◽  
Design And Optimization ◽  
Final Design ◽  
Overall Performance ◽  
The Common ◽  
Cfd Analyses

A methodology was developed to optimize the 3D geometrical design layout of an active integrated power electronics module (IPEM) by considering both electrical and thermal performance. This paper is focused on the thermal analysis, which was performed using 3D finite element and computational fluid dynamic (CFD) analyses. A parametric study was conducted to determine the thermal performance of several different design layouts. A sensitivity analysis was performed to determine the overall uncertainty of the predicted simulations. The final design, Gen-II.C, provided a 70% reduction in the common mode current, a 4% reduction in the size of the geometric footprint, and a 3°C reduction in the maximum temperature over Gen-II.A, thus providing an increase in the overall performance.

Multidisciplinary Placement Optimization of Heat Generating Semiconductor Logic Blocks

2008 ◽  
Author(s):  
Tohru Suwa ◽  
Hamid Hadim
Keyword(s):  
Temperature Distribution ◽  
Integrated Circuit ◽  
Element Model ◽  
Multidisciplinary Optimization ◽  
Maximum Temperature ◽  
Superposition Method ◽  
Design And Optimization ◽  
Placement Optimization ◽  
Optimization Methodology ◽  
Logic Blocks

A multidisciplinary optimization methodology for placement of heat generating semiconductor logic blocks on integrated circuit chips is presented. The methodology includes thermal and wiring length criteria, which are optimized simultaneously using the genetic algorithm. An effective thermal performance prediction methodology based on a superposition method is used to determine the temperature distribution on a silicon chip due to multiple heat generating logic blocks. Using the superposition method, the predicted temperature distribution in the silicon chip is obtained in much shorter time than with a detailed finite element model and with comparable accuracy. The main advantage of the present multidisciplinary design and optimization methodology is its ability to handle multiple design objectives simultaneously for optimized placement of heat generating logic blocks. Capabilities of the present methodology are demonstrated by applying it to several standard benchmarks. The multidisciplinary logic block placement optimization results indicate that the maximum temperature on a silicon chip can be reduced by up to 7.5°C, compared with the case in which only the wiring length is minimized.

Thermal Design Methodology for an Embedded Power Electronic Module Using Double-Sided Microchannel Cooling

2008 ◽  
Vol 130 (3) ◽  
Author(s):  
Manu Mital ◽  
Elaine P. Scott
Keyword(s):  
Heat Transfer ◽  
Design Methodology ◽  
Three Dimensional ◽  
Element Model ◽  
Thermal Design ◽  
Transfer Model ◽  
Power Electronic ◽  
Transfer Coefficients ◽  
Trade Offs ◽  
Parallel Channels

This paper presents a thermal design methodology for an integrated power electronic module (IPEM) using embedded, single-phase, and laminar-flow rectangular microchannels. Three-dimensional packaging of electronic components in a small and compact volume makes thermal management more challenging, but IPEMs also offer the opportunity to extract heat from both the top and the bottom side of the module, enabling double-sided cooling. Although double-sided cooling of IPEMs can be implemented using traditional aluminum heat sinks, microchannels offer much higher heat transfer coefficients and a compact cooling approach that is compatible with the shrinking footprint of electronic packages. The overall goal of this work was to find the optimal microchannel configuration for the IPEM using double-sided cooling by evaluating the effect of channel placement, channel dimensions, and coolant flow rate. It was found that the high thermal conductivity copper of the direct bonded copper (DBC) layer is the most feasible location for the channels. Based on a new analytical heat transfer model developed for microchannels in IPEM structures, several design configurations were proposed in this study that employ the microchannels in the copper layers of the top and bottom DBCs. The designs included multiple parallel channels in copper as well as a single wide microchannel. The analytical model was verified using a finite element model, and the competing design configurations were compared against a commercial cooler. For a typical IPEM structure dissipating on the order of 100W of heat, it was concluded that a single microchannel DBC heat sink is preferable to multiple parallel channels under a double-sided cooling configuration, considering thermal performance, pressure drop and fabrication trade-offs.

Thermal Design and Optimization of an IGBT Power Electronic Module

2005 ◽  
Author(s):  
Manu Mital ◽  
Elaine P. Scott
Keyword(s):  
Design Optimization ◽  
Thermal Design ◽  
Maximum Temperature ◽  
Power Electronic ◽  
Design And Optimization ◽  
Insulated Gate Bipolar Transistor ◽  
Igbt Module ◽  
Finite Element Package ◽  
Forced Air ◽  
Geometric Layout

This paper presents thermal design optimization of an insulated gate bipolar transistor (IGBT) integrated power electronic module (IPEM). A commercially available finite element package was used to create a 3D geometric layout of the IGBT module. Thermal simulations were performed under different forced air convection conditions, and for both single and double-sided cooling, to study the effects on the hot-spots and maximum temperature rise of the module. The design optimization for the module was performed by varying parameters (choice of materials and layer thicknesses) and studying their effect on the thermal performance of the module. The results of these studies were several improved designs for the module.

Effect of Suction Elbow and Inlet Guide Vanes on Flow Field in a Centrifugal Compressor Stage

2002 ◽  
Author(s):  
Michael M. Cui
Keyword(s):  
Flow Field ◽  
Centrifugal Compressor ◽  
Three Dimensional ◽  
Power Laws ◽  
Working Fluid ◽  
Guide Vanes ◽  
Design And Optimization ◽  
Inlet Guide Vanes ◽  
Compressor Design ◽  
Overall Performance

Suction elbows and inlet guide vanes (IGVs) are typical upstream components in front of first-stage impellers in centrifugal compressors. The three-dimensional distortion induced by elbows and IGVs affects the flow field behind the IGV housing. Since the flow field in front of the impeller is subsonic, the flow motion induced by the rotating impeller will interact with the elbow and IGVs as well. The flow field resulting from these interactions is three-dimensional. The nature of this flow field defines design requirements of upstream components and impact overall performance of the compressor. To understand the mechanism controlling the interactions of up-steam components and optimize the compressor design for better efficiency and reliability, a numerical simulation of the flow field inside the entire first stage of the compressor was conducted. The stage studied includes suction elbow, IGV housing with vanes, and first-stage impeller. HFC 134a was used as the working fluid. The thermodynamic and transport properties of the refrigerant gas were modeled by the Martin-Hou equation of state and power laws respectively. The three-dimensional flow field was simulated with a Navier-Stokes solver using the k-ε turbulence model. The overall performance parameters are obtained by integrating the field quantities. The force, torque, and arm of moment acting on the IGVs were then calculated. The results can be used to improve centrifugal compressor design to achieve higher efficiency and improve reliability. The methodology developed in the current study can be applied to centrifugal compressor design and optimization.

Simulation and Analysis of Thermal Distribution in Compact Multi-Chip Module

2014 ◽  
Vol 513-517 ◽  
pp. 3111-3114
Author(s):  
Hao Yang Cui ◽  
Yong Peng Xu ◽  
Can Liu ◽  
Nai Yun Tang ◽  
Feng Hong Chu ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Semiconductor Device ◽  
Dimensional Space ◽  
Three Dimensional ◽  
Simulation Method ◽  
Circuit Board ◽  
Maximum Temperature ◽  
Thermal Breakdown ◽  
Design And Optimization ◽  
Breakdown Probability

One of the main failure mechanisms in semiconductor device is the thermal breakdown of compact multi-chip (CMC) module. In order to avoid the compact layout or location of the heating chips, the distribution of the chips on printed circuit board (PCB) should be optimized to decrease the thermal breakdown probability of device. Based on the finite element theory, we simulated the three-dimensional space thermal field distribution of two kinds of PCB that the same chips were layout in difference ways in this paper. By analyzing the simulation results, we can find that the maximum temperature of the optimized CMC layout will be decreased about one degree. The simulation method and the conclusion of this paper will have significance effect for CMC design and optimization.

Comparative Study of Vaneless and Vaned Diffusers in a Transonic Centrifugal Compressor With Real Gas

2000 ◽  
Author(s):  
Michael M. Cui
Keyword(s):  
Flow Field ◽  
Centrifugal Compressor ◽  
Three Dimensional ◽  
Power Laws ◽  
Navier Stokes ◽  
Local Flow ◽  
Design And Optimization ◽  
Transonic Centrifugal Compressor ◽  
Overall Performance ◽  
The Impact

Vaneless and vaned diffusers in a transonic centrifugal compressor with the refrigerant HFC-134a were studied experimentally and numerically. The compressor was tested on a closed-loop stand instrumented to obtain both overall performance data and local flow field quantities. In numerical studies, the thermodynamic and transport properties of the refrigerant gas were modeled by the Martin-Hou equation of state and power laws, respectively. To include the interaction of the compressor components in these analyses, a unified three-dimensional numerical model was built for the complete compressor stage. The flow field was calculated with a Navier-Stokes solver using the k-ε turbulent model. The impact of the different diffusers on both local flow field and overall performance is analyzed comparatively for each component. The experimental and numerical results agree well. The correlation between the overall compressor performance and local flow field quantities is defined. The methodology developed and data obtained in these studies can be applied to centrifugal compressor design and optimization.

scholarly journals Thermal and hydraulic performance analysis of a heat sink with corrugated channels and nanofluids

2020 ◽  
Author(s):  
Benyamin Naranjani ◽  
Ehsan Roohi ◽  
Amin Ebrahimi
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Three Dimensional ◽  
Hydraulic Performance ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Thermally Induced ◽  
Numerical Predictions ◽  
Overall Performance ◽  
Finite Volume Approach

Abstract Cooling of electronic devices is one of the critical challenges that the electronics industry is facing towards sustainable development. Aiming at lowering the surface temperature of the heat sink to limit thermally induced deformations, corrugated channels and nanofluids are employed to improve the thermal and hydraulic performances of a heat sink. Three-dimensional simulations based on the finite-volume approach are carried out to study conjugated heat transfer in the heat sink. Water-based nanofluids containing $$\hbox {Al}_{2}\hbox {O}_{3}$$ Al 2 O 3 nanoparticles with two different particle sizes (29 nm and 40 nm) and volume fractions less than 4% are employed as the coolant, and their influence on the thermal and hydraulic performance of the heat sink is compared with the base fluid (i.e. water). An empirical model is utilised to approximate the effective transport properties of the nanofluids. Employing corrugated channels instead of straight channels in the heat sink results in an enhancement of 24–36% in the heat transfer performance at the cost of 20–31% increase in the required pumping power leading to an enhancement of 16–24% in the overall performance of the heat sink. Additionally, the numerical predictions indicate that the overall performance of the proposed heat sink design with corrugated channels and water–$$\hbox {Al}_{2}\hbox {O}_{3}$$ Al 2 O 3 nanofluids is 22–40% higher than that of the water-cooled heat sink with straight channels. It is demonstrated that the overall performance of the heat sink cooled with water–$$\hbox {Al}_{2}\hbox {O}_{3}$$ Al 2 O 3 nanofluids increases with reducing the average nanoparticle size. Additionally, the maximum temperature rise in the heat sinks is determined for different thermal loads.

An efficient method for exploded view generation through assembly coherence data and precedence relations

2018 ◽  
Vol 15 (2) ◽  
pp. 248-253 ◽  
Author(s):  
M.V.A. Raju Bahubalendruni
Keyword(s):  
Collision Detection ◽  
Design Methodology ◽  
Three Dimensional ◽  
Instructional Materials ◽  
Content Type ◽  
Contact Information ◽  
Mating Surface ◽  
The Common ◽  
Exploded View ◽  
Geometric Feasibility

Purpose Three-dimensional exploded view is a schematic representation of a product anticipated for performing assembly or disassembly operations. Exploded view is found in many applications, such as product instructional materials, repair and maintenance handbooks. This paper aims to propose an efficient exploded view generation technique based on assembly coherence data and disassembly feasibility testing, and illustrate it on various configurations of assemblies. Design/methodology/approach The proposed methodology extracts the assembly contact information between the constituent parts and geometric feasibility relation matrix based on the common mating surface of part pairs in liaison and assembly collision detection. These data are further used for exploded view generation. Findings The proposed exploded view generation method determines the possible disassembly sequences and simplifies the procedure in determining the number of disassembly levels. Research limitations/implications The procedure consumes more time for the products with large number of part counts having numerous non-ruled surfaces. Originality/value The proposed method is effectively used to solve assemblies, where parts are assembled through oblique orientations. The method is found successful in generating exploded view for products with large number of parts through collision-free paths.

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