Fatigue Lifetimes of PBGA Solder Joints Reflowed at Different Conveyor Speeds

1999 ◽  
Vol 123 (3) ◽  
pp. 290-294 ◽  
Author(s):  
S. H. Fan ◽  
Y. C. Chan ◽  
J. K. L. Lai
Keyword(s):  
Cooling Rate ◽  
Solder Joints ◽  
Bulk Solder ◽  
Test Results ◽  
Heat Transmission ◽  
Fatigue Lifetime ◽  
Shear Fatigue ◽  
Sliding Mechanism ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

The shear cycle fatigue lifetimes of plastic ball grid array (PBGA) solder joints formed using different reflow profiles are studied in this paper. The profiles were devised to have the same “heating factor” but to have different conveyor speeds. The test results show that, by increasing the conveyor speed during reflow, the shear fatigue lifetime of solder joints can be improved substantially. On the other hand, the fatigue lifetime of the test specimens decreased with increasing the cycle displacement amplitude. Heat transmission analysis shows that increasing conveyor speed increases the cooling rate during solder solidification. SEM micrographs reveal that cracks initiated at the acute point near the PCB solder pad, then propagate along the interface of the bulk solder/IMC layer. The test results are ascribed to roughing interface of the bulk solder/IMC of the solder joints that results on increasing the cooling rate. The frictional sliding mechanism is used to explain the test results.

Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates

1992 ◽  
Vol 114 (2) ◽  
pp. 104-108 ◽  
Author(s):  
Z. Mei ◽  
J. W. Morris
Keyword(s):  
Grain Size ◽  
Fatigue Life ◽  
Cooling Rate ◽  
Solder Joints ◽  
Phase Morphology ◽  
Air Cooling ◽  
Test Results ◽  
Cooling Rates ◽  
Isothermal Fatigue ◽  
Shear Fatigue

This paper reports the results of a study on the effect of the cooling rate during solidification on the isothermal shear-fatigue life of 60Sn/40Pb solder joints. Solder joints are made with three different initial microstructures by quenching, air-cooling, and furnace-cooling. The test results show that the quench-solidified solder joints have isothermal fatigue lives of about twice long as those of the furnace cooled solder joints tested at 20°C and 65°C with the straining rates of about 10−4 per s. These results are ascribed to the refined grain size and less lamellar phase morphology that results on increasing the cooling rate.

Finite Element Analysis on the Ability of Solder Joints to Resist Thermal Fatigue

2010 ◽  
Vol 118-120 ◽  
pp. 738-742
Author(s):  
Xue Xia Yang ◽  
Yu Zhang ◽  
Xue Feng Shu
Keyword(s):  
Finite Element ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Strain Response ◽  
Shape Parameters ◽  
Element Analysis ◽  
Finite Element Software ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Fatigue Characteristics

The purpose of this paper is to study the ability of solder joints to resist thermal fatigue. 2D simplified models of Plastic Ball Grid Array package (PBGA) structures with ten different solder joints obtained from surface mount experiment are established by finite element software, then stress-strain response of solder joints subjected to the thermal cycle load are calculated. And the effects of shape parameters of solder joints on the ability to resist thermal fatigue are discussed. Results indicate that for the same material and volume solders, the solder joints which have higher height, smaller diameter and contact angle have a stronger ability against thermal fatigue, and that the thermal fatigue characteristics are also greatly influenced by the solder outlines. Comparing with SP solder joints, LF solder joints have stronger ability against thermal fatigue.

scholarly journals Experimental Study on the Reliability of PBGA Electronic Packaging under Shock Loading

Electronics ◽  
2019 ◽  
Vol 8 (3) ◽  
pp. 279 ◽  
Author(s):  
Jiang Shao ◽  
Hongjian Zhang ◽  
Bo Chen
Keyword(s):  
Fatigue Life ◽  
Electronic Packaging ◽  
Failure Modes ◽  
Solder Joints ◽  
Optical Microscope ◽  
Micro Cracks ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Aeronautical Industry ◽  
The Relationship

Plastic Ball Grid Array (PBGA) one of the most important electronic packaging methods, is widely used in aeronautical industry field. According to the JEDEC standard, shock tests of PBGA assemblies are conducted under different loading conditions. Several important parameters, such as the fatigue life of PBGA assemblies, the relationship between solder joint positions and fatigue life, the relationship between strain energy density and fatigue life, are analyzed based on experiment results. The failure modes of PBGA assemblies are studied by optical microscope (OM). The results show that during the shock tests, the strains of the solder joints near the center of the specimen are larger than other positions, and these solder joints are prone to form micro cracks. With the increase of the shock times, these micro cracks extend rapidly which will eventually cause the failure of the PBGA electronic packaging.

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

Thermal Fatigue-Life Prediction of Lead-Free Solder Joints

2004 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Dongkai Shangguan
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a plastic ball grid array (PBGA) package assembly is predicted and discussed.

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