Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis

2000 ◽  
Vol 122 (4) ◽  
pp. 311-316 ◽  
Author(s):  
John H. Lau ◽  
S.-W. Ricky Lee ◽  
Chris Chang
Keyword(s):  
Shear Stress ◽  
Energy Density ◽  
Solder Joint ◽  
Creep Strain ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Rate Theory ◽  
Wafer Level ◽  
Temperature Dependent ◽  
Shear Creep

A novel and reliable wafer level chip scale package (WLCSP) is investigated in this paper. It consists of a copper conductor layer and two low cost dielectric layers. The bump geometry consists of the eutectic solder, the copper core, and the under bump metallurgy. Nonlinear time-temperature-dependent finite element analyses are performed to determine the shear stress, shear creep strain, shear stress and shear creep strain hysteresis loops, and creep strain energy density of the corner solder joint. The thermal-fatigue life of the corner solder joint is then predicted by the averaged creep strain energy density range per cycle and a linear fatigue crack growth rate theory. The WLCSP solder bumps are also subjected to shear test. Finally, the WLCSP solder joints are subjected to both mechanical shear and thermal cycling tests. [S1043-7398(00)01004-5]

scholarly journals Solder joint reliability based on creep strain energy density for SAC305 and doped SAC solders

2021 ◽  
Vol 343 ◽  
pp. 02005
Author(s):  
Ramiro Sebastian Vargas Cruz ◽  
Viktor Gonda
Keyword(s):  
Energy Density ◽  
Solder Joint ◽  
Creep Strain ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Wafer Level ◽  
Solder Joint Reliability ◽  
Reliability Models ◽  
Joint Reliability ◽  
Lead Free Solders

Parallel to the development of new lead-free solders, electronic packaging has gone through a considerable evolution. A redistribution of layers allows the increase of functionality by increasing the number of inputs/outputsin the packagewhile reducing the size. The reliability of the package is strongly influenced by the reliability of the interconnects. During production and service life, there are thermal processes involved that may lead to thermal fatigue. In this work, a two-dimensional finite elementmodel of a Fan-Out Wafer Level Packaging (FO-WLP) was built, and simulations of thermal test cycles were carried out varying the solder interconnect material: SAC305, SACQ, SACR, orInnoLot. A thermal oscillating load from –40°C to 125°C was applied to the packaging for three hours.State of the art concerning solder joint reliability models based on creep behavior reveals the benefit of using energy-based parameters, as cycles to failure are inversely proportional to the average creep strain energy density.Based on theaverage creep strain energy density simulation results, the reliability of the package withdifferent solderswas compared.The qualitative results suggestthat SACQ has a significant advantage in the operational lifetime compared toSACR, InnoLot, and SAC305.

Thermal Fatigue Prediction for Leadless Solder Joint of TFBGA

2006 ◽  
Author(s):  
Chia-Lung Chang ◽  
Tzu-Jen Lin ◽  
Chih-Hao Lai
Keyword(s):  
Energy Density ◽  
Solder Joint ◽  
Creep Strain ◽  
Thermal Fatigue ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Creep Property ◽  
Inelastic Strain ◽  
Temperature Cycling ◽  
Element Analysis

Nonlinear finite element analysis was performed to predict the thermal fatigue for leadless solder joint of TFBGA Package under accelerated TCT (Temperature Cycling Test). The solder joint was subjected to the inelastic strain that was generated during TCT due to the thermal expansion mismatch between the package and PCB. The solder was modeled with elastic-plastic-creep property to simulate the inelastic deformation under TCT. The creep strain rate of solder was described by double power law. The furthest solder away from the package center induced the highest strain during TCT was considered as the critical solder ball to be most likely damaged. The effects of solder meshing on the damage parameters of inelastic strain range, accumulated creep strain and creep strain energy density were compared to assure the accuracy of the simulation. The life prediction equation based on the accumulated creep strain and creep strain energy density proposed by Syed was used to predict the thermal fatigue life in this study. The agreement between the prediction life and experimental mean life is within 25 per cent. The effect of die thickness and material properties of substrate on the life of solder was also discussed.

Critical Accumulated Strain Energy (Case) Failure Criterion for Thermal Cycling Fatigue of Solder Joints

1994 ◽  
Vol 116 (3) ◽  
pp. 163-170 ◽  
Author(s):  
Tsung-Yu Pan
Keyword(s):  
Fatigue Life ◽  
Energy Density ◽  
Thermal Cycling ◽  
Creep Strain ◽  
Failure Criterion ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Solder Joints ◽  
Field Service ◽  
Accumulated Strain

In the automotive and computer industries, a perennial challenge has been to design an adequate and efficient accelerated thermal cycling test which would correspond to field service conditions. Failures, induced in both thermal cycle testing and field service, are characterized by thermal fatigue behavior. Several fatigue models have been proposed, none of these models take into account all of the many parameters of the test or service environment. In thermal cycling, for example, the temperature range, ramp rate, hold time, and stepped heating and cooling are known to influence the number of cycles to failure. In this study, a critical accumulated strain energy (CASE) failure criterion is proposed to correlate the fatigue life to both the plastic and creep strain energies, which accumulate in solder joints during the thermal cycling. This criterion suggests that solder joints fail as the strain energy accumulates and reaches a critical value. By using finite element analysis with a “ladder” procedure, both time-independent plastic strain energy and time-dependent creep strain energy are quantified. These are related to fatigue life by the equation: C = N*f (Ep + 0.13Ec), where C is the critical strain energy density, Nf is the fatigue life, Ep and Ec are plastic and creep strain energy density accumulation per cycle, respectively, for the eutectic Sn-Pb solders. By analyzing Hall and Sherry’s thermal cycling data (Hall and Sherry, 1986), it is found that creep is the predominant factor in deciding fatigue life. Creep accounts for 51 to 97 percent of the total accumulated strain energy, depending on the cycling profiles. This criterion is used to simulate crack propagation in a solder joint by analyzing the strain energy in small “domains” within the joint.

scholarly journals Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements

2019 ◽  
Vol 141 (2) ◽  
Author(s):  
J.-B. Libot ◽  
J. Alexis ◽  
O. Dalverny ◽  
L. Arnaud ◽  
P. Milesi ◽  
...  
Keyword(s):  
Shear Stress ◽  
Energy Density ◽  
Hysteresis Loop ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Solder Joints ◽  
Strain Gages ◽  
Sac305 Solder ◽  
Stress Strain ◽  
Temperature Cycles

Temperature-induced solder joint fatigue is a main reliability concern for aerospace and military industries whose electronic equipment used in the field is required to remain functional under harsh loadings. Due to the RoHS directive, which eventually will prevent lead from being utilized in electronic systems, there is a need for a better understanding of lead-free thermomechanical behavior when subjected to temperature variations. Characterizing solder joints properties remains a challenge as viscoplastic behavior during thermal cycling is complex, and their small dimensions prevent direct measurements from being performed. This paper reports the experimentation based on strain gage measurements, allowing the construction of the shear stress–strain hysteresis loop corresponding to Sn3.0Ag0.5Cu (SAC305) solder joints behavior during thermomechanical loading. This methodology, initially developed in 1984 by Hall for Sn60Pb40 interconnects, allows the measurement of the strain energy density dissipated during temperature cycles. Custom daisy-chained 76 I/O ceramic ball grid array (CBGA76) components were designed and assembled on flame retardant (FR-4) multilayered printed circuit boards (PCB). Four strain gages were specifically placed at the center of the assembly on top and bottom faces of both PCB and CBGA76 component. The assembly was subjected to temperature cycles and the SAC305 solder joints shear stress–strain hysteresis loop was plotted. The correlation between the measured strain energy density and measured lifetime corresponds to one point of the energy based fatigue curve for SAC305 solder joints. The hysteresis loop also provides the necessary data to derive SAC305 solder joints constitutive laws.

scholarly journals Volume free strain energy density method for applications to blunt V-notches

2020 ◽  
Vol 28 ◽  
pp. 734-742
Author(s):  
Pietro Foti ◽  
Seyed Mohammad Javad Razavi ◽  
Liviu Marsavina ◽  
Filippo Berto
Keyword(s):  
Energy Density ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Density Method ◽  
Free Strain

scholarly journals On the application of the volume free strain energy density method to blunt V-notches under mixed mode condition

2021 ◽  
Vol 230 ◽  
pp. 111716
Author(s):  
Pietro Foti ◽  
Seyed Mohammad Javad Razavi ◽  
Majid Reza Ayatollahi ◽  
Liviu Marsavina ◽  
Filippo Berto
Keyword(s):  
Energy Density ◽  
Strain Energy Density ◽  
Mixed Mode ◽  
Strain Energy ◽  
Density Method ◽  
Free Strain
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