Fatigue Life Analysis of Solder Joints in Flip Chip Bonding

1999 ◽  
Vol 122 (3) ◽  
pp. 207-213 ◽  
Author(s):  
Yutaka Tsukada ◽  
Hideo Nishimura ◽  
Masao Sakane ◽  
Masateru Ohnami
Keyword(s):  
Fatigue Life ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Electrical Potential ◽  
Potential Drop ◽  
Life Assessment ◽  
Circuit Board ◽  
Ratchet Effect ◽  
The Difference ◽  
Fatigue Life Analysis

This paper describes the life assessment of flip chip joints. Flip chip joints of 63Sn-37Pb and 5Sn-95Pb solders on a printed circuit board were stressed thermally for fatigue. Fatigue lives of the joints were determined by an electrical potential drop method and the effect of encapsulation on fatigue life was discussed. The encapsulation had a significant effect of prolonging the fatigue life of the joints. Thermo-mechanical finite element analyses proved that the encapsulation lowered the strain amplitude of the joints by distributing the strain over a whole package and bending effect. Cracking location was also discussed in relation with the strain concentration in the joints. Fatigue lives of the flip chip joints were compared with those of bulk round bar specimens and the difference in fatigue life between two types of specimens was discussed from the specimen dimensions and ratchet effect. [S1043-7398(00)00203-6]

scholarly journals Toward a fully integrated automotive radar system-on-chip in 22 nm FD-SOI CMOS

2021 ◽  
pp. 1-9
Author(s):  
Philipp Ritter
Keyword(s):  
Millimeter Wave ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Digital Signal ◽  
Cmos Technology ◽  
Radar System ◽  
Circuit Board ◽  
Processing Unit ◽  
Automotive Radar ◽  
On Chip

Abstract Next-generation automotive radar sensors are increasingly becoming sensitive to cost and size, which will leverage monolithically integrated radar system-on-Chips (SoC). This article discusses the challenges and the opportunities of the integration of the millimeter-wave frontend along with the digital backend. A 76–81 GHz radar SoC is presented as an evaluation vehicle for an automotive, fully depleted silicon-over-insulator 22 nm CMOS technology. It features a digitally controlled oscillator, 2-millimeter-wave transmit channels and receive channels, an analog base-band with analog-to-digital conversion as well as a digital signal processing unit with on-chip memory. The radar SoC evaluation chip is packaged and flip-chip mounted to a high frequency printed circuit board for functional demonstration and performance evaluation.

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

2021 ◽  
Author(s):  
Tae-Yong Park ◽  
Hyun-Ung Oh
Keyword(s):  
Fatigue Life ◽  
Random Vibration ◽  
Critical Strain ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Mechanical Design ◽  
Ball Grid Array ◽  
Primary Objective ◽  
Circuit Board ◽  
Analytical Approaches

Abstract To overcome the theoretical limitations of Steinberg's theory for evaluating the mechanical safety of the solder joints of spaceborne electronics in a launch random vibration environment, a critical strain-based methodology was proposed and validated in a previous study. However, for the critical strain-based methodology to be used reliably in the mechanical design of spaceborne electronics, its effectiveness must be validated under various conditions of the package mounting locations and the first eigenfrequencies of a printed circuit board (PCB); achieving this validation is the primary objective of this study. For the experimental validation, PCB specimens with ball grid array packages mounted on various board locations were fabricated and exposed to a random vibration environment to assess the fatigue life of the solder joint. The effectiveness of the critical strain-based methodology was validated through a comparison of the fatigue life of the tested packages and their margin of safety, which was estimated using various analytical approaches.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

A MEMS Magnetometer Utilizing a NdFeB Magnet

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 001671-001700
Author(s):  
John J. Tatarchuk ◽  
Colin B. Stevens ◽  
Robert N. Dean
Keyword(s):  
Magnetic Fields ◽  
Printed Circuit Board ◽  
Relaxation Oscillator ◽  
Circuit Board ◽  
Ndfeb Magnet ◽  
Assembly Method ◽  
Variable Capacitance ◽  
The Difference ◽  
Silicon Frame ◽  
Gap Width

A silicon MEMS magnetometer has been developed that utilizes a miniature NdFeB rare earth magnet attached to a silicon platform that is suspended by a dual torsional suspension system. An externally applied out-of-plane magnetic field will cause a magnetic torque to be produced between the external field and the NdFeB magnet, causing a deflection of the suspended silicon platform which can be sensed capacitively. The device measures 5.6 mm X 5.6 mm, with the silicon components being manufactured using bulk micromachining processes. The variable capacitive structure is realized by metalizing the bottom side of the suspended silicon platform to allow the silicon platform to serve as the top electrode. The bottom electrode is provided by a bare pad on a printed circuit board (PCB) to which the frame of the silicon device is attached. This results in a variable capacitance with a nominal value of approximately 3–6 pF, depending on the exact width of the gap. The variable capacitance is large enough to be converted into a variable frequency square wave using a CMOS relaxation oscillator circuit. To realize a practical device, multiple silicon components were manufactured. First, a silicon component had to be manufactured that included the anchor/frame, torsional springs, and suspended platform. To provide protection against destructive over-ranging of the mechanical components during very high accelerations or external magnetic fields, another silicon component was manufactured that provided mechanical stops at the limits of the useful displacement range. Two other components were also manufactured on the same wafer to provide for a cap over the device. Epoxy was used to bond the NdFeB magnet and the various silicon components together. The fabricated devices behaved similarly to their predicted theoretical performance, with a nominal oscillation frequency around 30 kHz, a sensitivity around 100 nT/Hz, and a noise floor around 50 nT. Several fabrication and assembly issues had to be solved in order to realize the device. The gap width of the capacitive structure is dependent on the thickness of the agent used to electrically connect the silicon anchor to a pad on a PCB. As it is desirable to minimize this gap width, some experimentation was required to find a suitable agent and assembly method. Additionally, the bonding agent used to attach the silicon anchor to the PCB must be applied at a temperature near the expected operating temperature of the device to prevent large stresses from being applied to the silicon frame due to the difference in the coefficients of thermal expansion between silicon and FR4. Also, during fabrication it was found that large flat areas, where a very uniform etch is critical, required wet KOH etching, while deep reactive ion etching could be used for areas where depth and a high aspect ratio were important. Significance This MEMS sensor represents a novel configuration for sensing magnetic fields. Without much optimization, the sensor already exceeds the sensitivity of many commercially available Hall-effect based MEMS magnetometers. As MEMS magnetometers are less developed than alternative magnetometer technologies, they may have more opportunities for improvement.

Flip Chip Thermal Test Vehicle Design: Requirements, Evaluations, and Validations

2003 ◽  
Author(s):  
Teck Joo Goh ◽  
Chia-Pin Chiu ◽  
K. N. Seetharamu ◽  
G. A. Quadir ◽  
Z. A. Zainal
Keyword(s):  
Flip Chip ◽  
Printed Circuit Board ◽  
Thermal Characterization ◽  
Circuit Board ◽  
Vehicle Design ◽  
Test Chip ◽  
Test Vehicle ◽  
Design Processes ◽  
Thermal Test ◽  
Design Requirements

This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. The design processes of different thermal test chip structures including the temperature sensor and passive heaters are described in detail. In addition, the design of fireball heater, a novel test chip structure used for evaluating the effectiveness of heat spreading of advanced thermal solutions, is also illustrated. The design considerations and processes of the package substrate and printed circuit board with special emphasis on the physical routing of the thermal test chip structures are described. These design processes are supported with thermal data from various finite-element analyses (FEA) carried out to evaluate the capability and limitations of thermal test vehicle design. Design optimization as the outcome of these analyses is also elaborated. Lastly, the validation and calibration procedures of the thermal test vehicle are presented in this paper.

Evaluation of a Conductive Adhesive Based Approach to Lead Free Flip Chip Assembly

2002 ◽  
Author(s):  
Muthiah Venkateswaran ◽  
Peter Borgesen ◽  
K. Srihari
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Critical Evaluation ◽  
Conductive Adhesive ◽  
Circuit Board ◽  
Lead Free ◽  
Conductive Adhesives ◽  
Flip Chip Assembly ◽  
Placement Machine

Electrically conductive adhesives are emerging as a lead free, flux less, low temperature alternative to soldering in a variety of electronics and optoelectronics applications. Some of the potential benefits are obvious, but so far the adhesives have some limitations as well. The present work offers a critical evaluation of one approach to flip chip assembly, which lends itself particularly well to use with a high speed placement machine. Wafers were bumped by stencil printing of a thermoset conductive adhesive, which was then fully cured. In assembly, the conductive adhesive paste was stencil printed onto the pads of a printed circuit board and cured after die placement. The printing process was optimized to ensure robust assembly and the resulting reliability assessed.

Fatigue Life Analysis of an Automotive Tensioner Through Strain-Life Approach

2015 ◽  
Author(s):  
Maryam Talimi ◽  
Jean W. Zu
Keyword(s):  
Fatigue Life ◽  
Stress Analysis ◽  
Drive System ◽  
Life Assessment ◽  
Fatigue Properties ◽  
Fatigue Life Assessment ◽  
Front End ◽  
Life Analysis ◽  
Fatigue Life Analysis ◽  
Prediction Approach

In this paper, fatigue life assessment of a tensioner is studied through dynamic load analysis, stress analysis, and stress-life fatigue analysis approach. Tensioner is a critical part of an automotive front end accessory drive system, providing pre-tension to the belt. The front end accessory drive systems are responsible for transmitting power from the crankshaft to the accessory components. Due to the engine pulsation, components of the accessory drive including the tensioner are subjected to dynamic loads leading to fatigue failure. The fatigue life assessment of a mechanical component highly depends on loading, geometry, and material properties. In addition, the dynamic behavior of the front end accessory drive is complicated due to coupling between several modes of vibrations in belt, pulleys, and the tensioner arm. Duo to the complexity of the parameters involved and complicated dynamics, the fatigue life analysis of FEAD components is a challenging task. This paper includes three main parts, namely stress analysis, fatigue properties prediction, and life estimation. The dynamic analysis of a generic front end accessory drive system is performed in order to obtain effective loads on the tensioner. Stress state for the tensioner in case of different applied loading conditions is performed via a series of Finite Element (FE) analyses, and the critical region of the part is determined. Finally, fatigue life is estimated through strain-life approach. Modest work has been found in this area providing a comprehensive solution to the fatigue life investigation of power train components. The present study offers a comprehensive modeling approach which predicts the automative tensioner lifetime. The lifetime of any FEAD system components can be determined using the developed fatigue life prediction approach.

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

2006 ◽  
Vol 128 (4) ◽  
pp. 441-448 ◽  
Author(s):  
S. Chaparala ◽  
J. M. Pitarresi ◽  
S. Parupalli ◽  
S. Mandepudi ◽  
M. Meilunas
Keyword(s):  
Thermal Cycling ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Mirror Image ◽  
Circuit Board ◽  
Thermal Dissipation ◽  
Electrical Performance ◽  
Area Array ◽  
Plastic Ball

One of the primary advantages of surface mount technology (SMT) over through-hole technology is that SMT allows the assembly of components on both sides of the printed circuit board (PCB). Currently, area array components such as ball grid array (BGA) and chip-scale package (CSP) assemblies are being used in double-sided configurations for network and memory device applications as they reduce the routing space and improve electrical performance (Shiah, A. C., and Zhou, X., 2002, “A Low Cost Reliability Assessment for Double-Sided Mirror-Imaged Flip Chip BGA Assemblies,” Proceedings of the Seventh Annual Pan Pacific Microelectronics Symposium, Maui, Hawaii, pp. 7–15, and Xie, D., and Yi, S., 2001, “Reliability Design and Experimental work for Mirror Image CSP Assembly”, Proceedings of the International Symposium on Microelectronics, Baltimore, October, pp. 417–422). These assemblies typically use a “mirror image” configuration wherein the components are placed on either side of the PCB directly over each other; however, other configurations are possible. Double-sided assemblies pose challenges for thermal dissipation, inspection, rework, and thermal cycling reliability. The scope of this paper is the study of the reliability of double-sided assemblies both experimentally and through numerical simulation. The assemblies studied include single-sided, mirror-imaged, 50% offset CSP assemblies, CSPs with capacitors on the backside, single-sided, mirror-imaged plastic ball grid arrays (PBGAs), quad flat pack (QFP)/BGA mixed assemblies. The effect of assembly stiffness on thermal cycling reliability was investigated. To assess the assembly flexural stiffness and its effect on the thermal cycling reliability, a three-point bending measurement was performed. Accelerated thermal cycling cycles to failure were documented for all assemblies and the data were used to calculate the characteristic life. In general, a 2X to 3X decrease in reliability was observed for mirror-image assemblies when compared to single-sided assemblies for both BGAs and CSPs on 62mil test boards. The reliability of mirror-image assemblies when one component was an area array device and the other was a QFP was comparable to the reliability of the single-sided area array assemblies alone, that is, the QFP had almost no influence on the double-sided reliability when used with an area array component. Moiré interferometry was used to study the displacement distribution in the solder joints at specific locations in the packages. Data from the reliability and moiré measurements were correlated with predictions generated from three-dimensional finite element models of the assemblies. The models incorporated nonlinear and time-temperature dependent solder material properties and they were used to estimate the fatigue life of the solder joints and to obtain an estimate of the overall package reliability using Darveaux’s crack propagation method.

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