Through-Thickness Thermal Conductivity of Chemical Vapor Deposited Bismuth Telluride Thin Films

2021 ◽  
Author(s):  
Xiaowei Lu ◽  
Sien Wang ◽  
Ankit Negi ◽  
Peng Jiang ◽  
Jun Liu ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Conductivity ◽  
Bismuth Telluride ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited

Thermal conductivity and sound velocity measurements of plasma enhanced chemical vapor deposited a-SiC:H thin films

2011 ◽  
Vol 519 (22) ◽  
pp. 7895-7898 ◽  
Author(s):  
D.B. Hondongwa ◽  
L.R. Olasov ◽  
B.C. Daly ◽  
S.W. King ◽  
J. Bielefeld
Keyword(s):  
Thin Films ◽  
Thermal Conductivity ◽  
Sound Velocity ◽  
Chemical Vapor ◽  
Velocity Measurements ◽  
Chemical Vapor Deposited

scholarly journals Thermal conductivity of poly(3,4-ethylenedioxythiophene) films engineered by oxidative chemical vapor deposition (oCVD)

RSC Advances ◽  
2018 ◽  
Vol 8 (35) ◽  
pp. 19348-19352 ◽  
Author(s):  
Phil M. Smith ◽  
Laisuo Su ◽  
Wei Gong ◽  
Nathan Nakamura ◽  
B. Reeja-Jayan ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Conductivity ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited

Measuring the thermal conductivity of oxidative chemical vapor deposited poly(3,4-ethylenedioxythiophene) thin films.

Studies of the Coefficient of Thermal Expansion of Low-k ILD Materials by X-Ray Reflectivity

2006 ◽  
Vol 914 ◽  
Author(s):  
George Andrew Antonelli ◽  
Tran M. Phung ◽  
Clay D. Mortensen ◽  
David Johnson ◽  
Michael D. Goodner ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Chemical Vapor ◽  
Dielectric Materials ◽  
Free Standing ◽  
Dielectric Thin Films ◽  
X Ray ◽  
Chemical Vapor Deposited ◽  
Low K

AbstractThe electrical and mechanical properties of low-k dielectric materials have received a great deal of attention in recent years; however, measurements of thermal properties such as the coefficient of thermal expansion remain minimal. This absence of data is due in part to the limited number of experimental techniques capable of measuring this parameter. Even when data does exist, it has generally not been collected on samples of a thickness relevant to current and future integrated processes. We present a procedure for using x-ray reflectivity to measure the coefficient of thermal expansion of sub-micron dielectric thin films. In particular, we elucidate the thin film mechanics required to extract this parameter for a supported film as opposed to a free-standing film. Results of measurements for a series of plasma-enhanced chemical vapor deposited and spin-on low-k dielectric thin films will be provided and compared.

Growth, Structural and Mechanical Characterization and Reliability of Chemical Vapor Deposited Co and Co3O4 Thin Films as Candidate Materials for Sensing Applications

2011 ◽  
Vol 495 ◽  
pp. 108-111 ◽  
Author(s):  
Vasiliki P. Tsikourkitoudi ◽  
Elias P. Koumoulos ◽  
Nikolaos Papadopoulos ◽  
Costas A. Charitidis
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Elastic Modulus ◽  
Data Storage ◽  
Mechanical Stability ◽  
Chemical Vapor ◽  
Magnetic Sensors ◽  
Functional Coatings ◽  
Sensing Applications ◽  
Chemical Vapor Deposited

The adhesion and mechanical stability of thin film coatings on substrates is increasingly becoming a key issue in device reliability as magnetic and storage technology driven products demand smaller, thinner and more complex functional coatings. In the present study, chemical vapor deposited Co and Co3O4thin films on SiO2and Si substrates are produced, respectively. Chemical vapor deposition is the most widely used deposition technique which produces thin films well adherent to the substrate. Co and Co3O4thin films can be used in innovative applications such as magnetic sensors, data storage devices and protective layers. The produced thin films are characterized using nanoindentation technique and their nanomechanical properties (hardness and elastic modulus) are obtained. Finally, an evaluation of the reliability of each thin film (wear analysis) is performed using the hardness to elastic modulus ratio in correlation to the ratio of irreversible work to total work for a complete loading-unloading procedure.

Chemical-Vapor-Deposited Materials for High Thermal Conductivity Applications

MRS Bulletin ◽  
2001 ◽  
Vol 26 (6) ◽  
pp. 458-463 ◽  
Author(s):  
Jitendra S. Goela ◽  
Nathaniel E. Brese ◽  
Michael A. Pickering ◽  
John E. Graebner
Keyword(s):  
Thin Film ◽  
Thermal Conductivity ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
High Thermal Conductivity ◽  
Solid Materials ◽  
Chemical Vapor Deposited

Chemical vapor deposition (CVD) is an attractive method for producing bulk and thin-film materials for a variety of applications. In this method, gaseous reagents condense onto a substrate and then react to produce solid materials. The materials produced by CVD are theoretically dense, highly pure, and have other superior properties.

Thickness-Dependent Ultralow In-Plane Thermal Conductivity of Chemical Vapor-Deposited SnSe2 Nanofilms: Implications for Thermoelectrics

2020 ◽  
Vol 3 (10) ◽  
pp. 10543-10550 ◽  
Author(s):  
Bo Zou ◽  
Yan Zhou ◽  
Xu Zhang ◽  
Meng Zhang ◽  
Kang Liu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Chemical Vapor ◽  
Chemical Vapor Deposited

Organometallic chemical vapor deposited (OMCVD) thin films of YBa2Cu3O7−x (YBCO) on MgO and on YSZ buffer layers deposited on sapphire

1991 ◽  
Vol 185-189 ◽  
pp. 2093-2094 ◽  
Author(s):  
S. Chocron ◽  
T. Tsach ◽  
M. Parizh ◽  
M. Schieber ◽  
G. Deutscher ◽  
...  
Keyword(s):  
Thin Films ◽  
Chemical Vapor ◽  
Buffer Layers ◽  
Chemical Vapor Deposited
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