Die-Level Thermal Modeling of a Silicon Germanium (Sige) Bicmos Radio Frequency Integrated Circuit (Rfic) for Wireless Communications
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2003 ◽
Vol 13
(01)
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pp. 221-237
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2006 ◽
Vol 22
(1)
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pp. S236-S243
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2011 ◽
Vol 43
(10)
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pp. 2900-2907
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2020 ◽
Vol 2020
(1)
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