ELECTROLESS QUATERNARY NI-CU-CO-P ALLOY DEPOSITION MECHANISM IN ACIDIC BATH USING CYCLIC VOLTAMMETRY MEASUREMENT

2017 ◽  
Vol 79 (5-2) ◽  
Author(s):  
Mohd Nor Azran ◽  
Muhamad Khaizaki ◽  
Muhammad Alif ◽  
Muhammad Zaimi ◽  
Mohd Asyadi ‘Azam ◽  
...  
Keyword(s):  
Cyclic Voltammetry ◽  
Nickel Alloy ◽  
Oxidation Potential ◽  
Plating Bath ◽  
Alloy Deposition ◽  
Cyclic Voltammetry Measurement ◽  
P Content ◽  
Ni Alloy ◽  
Electroless Ni ◽  
Acidic Bath

Quaternary nickel alloy of Ni-Co-Cu-P has been successfully deposit on Fe substrate for corrosion resistant material. However, the reaction mechanism of quaternary nickel alloy deposition is less known and requires investigation. In this study, using similar bath component is used to produce electroless Ni-Cu-Co-P alloy. Cyclic voltammetry (CV) study is done in various plating bath component at bath pH 4.50, 4.75 and 5.00. A coating of Ni-Cu-Co-P alloy was deposited on a Fe substrate to evaluate surface morphology and composition. From CV results, higher bath pH, increases the [H2PO2-] oxidation peak and shifted the oxidation potential towards less noble potential. The reduction potential of the Ni alloy moved to noble potential, hence, elevate deposition rate from 3.95 to 5.95 mm/hr. The Ni-Cu-Co-P alloy composition on Fe substrate in descending manner is Ni (68.55 – 82.09 wt%), Cu (14.11 – 27.80 wt%) and Co (1.32 - 1.52wt%). The P content remained lower than 3.00 wt%. Hence, Co act as reaction inhibitor, while Cu act as both reaction accelerator and stabilizer.

Improvement on Hardness of 6061 Al Alloy Using an Electroless Ni-P Coating

2010 ◽  
Vol 26-28 ◽  
pp. 293-296 ◽  
Author(s):  
Wen Feng Qin ◽  
Jiang Long ◽  
Feng Liu
Keyword(s):  
Surface Morphology ◽  
Sodium Hypophosphite ◽  
Al Alloy ◽  
Plating Bath ◽  
Nodular Structure ◽  
P Content ◽  
Scanning Electron Microcopy ◽  
Alloy Plating ◽  
6061 Al Alloy ◽  
Electroless Ni

The surface morphology and hardness of electroless Ni–P alloy plating on 6061 aluminum alloys substrate in an alkaline plating bath with sodium hypophosphite as reducing agent were investigated. The effects of bath pH on the plating rate, compositions and surface morphology of theelectroless Ni-P deposits were studied. The results showed the deposition rate of the electroless Ni–P deposits increased with the rise of the bath pH, while the P content decreased. Scanning electron microcopy (SEM) of the deposits showed nodular structure for the deposits. Hardness data of the Ni-P coatings indicated that electroless Ni–P plating could obviously improve the hardness of 6061aluminum alloy.

Electrochemical Impedance Behavior of Various Composition Quaternary Ni Alloy in 3.5 Wt% NaCl

2015 ◽  
Vol 761 ◽  
pp. 407-411 ◽  
Author(s):  
Muhammad Zaimi ◽  
Mohd Asyadi Azam ◽  
Azizul Helmi Sofian ◽  
Kazuhiko Noda
Keyword(s):  
Corrosion Resistance ◽  
Corrosion Behavior ◽  
Electrochemical Impedance ◽  
Open Circuit ◽  
Nyquist Plot ◽  
Alloy Matrix ◽  
Plating Bath ◽  
Transfer Resistance ◽  
Ni Alloy ◽  
Electroless Ni

Zinc and copper addition into electroless Ni-P alloy matrix produces quaternary Ni alloy that exhibits lower corrosion resistance behavior compared to Ni-P and Ni-Cu-P alloy in 3.5 wt% NaCl solution. The corrosion behavior of the alloy is previously studied using the anodic polarization curve measurement. The results show that the corrosion potential of different alloy composition is almost similar to each other for electroless Ni-Zn-Cu-P alloy. However, the surface resistance of the alloy needs to be confirmed by using electrochemical impedance spectroscopy. The alloy was first deposited on an iron substrate using electroless Ni alloy deposition method approximately similar thickness at different plating bath pH of 8.50 and 9.50. The Ni alloy coated substrate was used as working electrode immersed into a solution of 3.5 wt% NaCl. The electrochemical cell consists of Pt and Ag/AgCl/KCl (saturated) as counter and reference electrode respectively. Electrochemical impedance measurement was done at open circuit potential. The measurement started from 100 kHz to 10 mHz with 10 mV of sinusoidal perturbation applied to the cell. Other types of alloy including Ni-P, Ni-Cu-P and Ni-Zn-P, were compared with Ni-Zn-Cu-P alloy. From the results, the Ni-Zn-Cu-P exhibits the lowest corrosion behavior compared to other Ni alloy due to low charge transfer resistance (Rct) observed small inductive loop at low frequency region of the Nyquist plot. Furthermore, the Nyquist plot for Ni-Zn-Cu-P for pH 8.50 and 9.50 showed comparable result; hence, the effect of pH has less effect on corrosion resistance of the electroless Ni-Zn-Cu-P alloy.

TEMPERATURE DEPENDENCE OF ELECTROLESS Ni–P DEPOSITION ON POLYESTER FABRIC

2008 ◽  
Vol 15 (05) ◽  
pp. 587-593 ◽  
Author(s):  
R. H. GUO ◽  
S. Q. JIANG ◽  
C. W. M. YUEN ◽  
M. C. F. NG
Keyword(s):  
Electromagnetic Interference ◽  
Surface Resistance ◽  
Polyester Fabric ◽  
Amorphous Structure ◽  
Shielding Effectiveness ◽  
Plating Bath ◽  
P Content ◽  
Electromagnetic Interference Shielding Effectiveness ◽  
Electroless Ni ◽  
Emi Se

The effects of plating temperature on the plating rate, P content, surface morphology, and electrical resistance of the electroless Ni–P deposits were studied. The results showed that the deposition rate of the Ni–P deposit and P content of the Ni–P layer increased with the rise of temperature of the plating bath. Scanning electron microscopy of the Ni–P deposits showed a nodule structure. The Ni–P plating layers had an amorphous structure and surface resistance of the layer decreased with the rise of temperature. In addition, the electromagnetic interference shielding effectiveness (EMI SE) of electroless Ni–P plated polyester fabric was also investigated. The result indicated that EMI SE of Ni–P plated polyester fabric was close to 45–50 dB when the surface resistance was 0.63 Ω/□.

scholarly journals Cyclic Voltammetry Measurement for Cu2O Based Homostructure Thin Film

2017 ◽  
Vol 226 ◽  
pp. 012184
Author(s):  
Nurliyana Binti Mohamad Arifin ◽  
Fariza Binti Mohamad ◽  
Nur Fathiah Binti Sikh Anuar ◽  
Nabihah Binti Ahmad ◽  
Nik Hisyamudin Muhd Nor ◽  
...  
Keyword(s):  
Thin Film ◽  
Cyclic Voltammetry ◽  
Cyclic Voltammetry Measurement

scholarly journals Influences of Bath Chemistry and Plating Variables on Characteristics of Electroless Ni–P Films on Si Wafers from Alkaline Citrate Solutions

2018 ◽  
Vol 2018 ◽  
pp. 1-11 ◽  
Author(s):  
Naiming Miao ◽  
Jinjin Jiang ◽  
Wangping Wu
Keyword(s):  
Thermal Stability ◽  
Chemical Composition ◽  
Deposition Rate ◽  
Electroless Nickel ◽  
Monocrystalline Silicon ◽  
P Content ◽  
Almost All ◽  
P Type ◽  
Electroless Ni ◽  
Thermal Stability Of

Electroless nickel–phosphorus (Ni–P) films were produced on the surface of p-type monocrystalline silicon in the alkaline citrate solutions. The influences of bath chemistry and plating variables on the chemical composition, deposition rate, morphology, and thermal stability of electroless Ni–P films on silicon wafers were studied. The as-deposited Ni–P films were almost all medium- and high-P deposits. The concentrations of Ni2+ and citric ions influenced the deposition rate of the films but did not affect P content in the deposits. With increasing H2PO2− content, the P content and deposition rate were steadily increased. The pH and plating temperature had a significant effect on the chemical composition and the deposition rate of the films. The thermal stability of the medium-P film was better than that of the high-P deposit. At the same time, the proposed mechanism of Ni–P films on monocrystalline silicon substrates in the alkaline bath solution was discussed and addressed.

scholarly journals Development of Electroless Ni Plating Bath Using Ti (III) Ion Reductant.

2002 ◽  
Vol 53 (10) ◽  
pp. 694-697 ◽  
Author(s):  
Shinji INAZAWA ◽  
Masatoshi MAJIMA ◽  
Keiji KOYAMA ◽  
Yoshie TANI ◽  
Shigeyoshi NAKAYAMA ◽  
...  
Keyword(s):  
Plating Bath ◽  
Electroless Ni

scholarly journals Friction and Wear of Electroless Ni Alloy Plated Gear under Non-Lubricating Condition in High Vacuum

2003 ◽  
Vol 69 (681) ◽  
pp. 1417-1424
Author(s):  
Masahiro FUJII ◽  
Akira YOSHIDA ◽  
Tomoki HARANO ◽  
Katsuyoshi OHMAE
Keyword(s):  
Friction And Wear ◽  
High Vacuum ◽  
Ni Alloy ◽  
Electroless Ni

A New Pre-Treatment with Phosphoric Acid and Hydrofluoric Acid of Electroless Ni-P Plating on Mg Alloy

2015 ◽  
Vol 729 ◽  
pp. 21-26
Author(s):  
Zhi Hui Xie ◽  
Jun Li Zhou ◽  
Shu Rong Xiang ◽  
Fang Chen
Keyword(s):  
Corrosion Current ◽  
Treatment Method ◽  
Mg Alloy ◽  
Cross Sectional ◽  
Plating Bath ◽  
Pickling Solution ◽  
Before And After ◽  
The Matrix ◽  
Pre Treatment ◽  
Electroless Ni

In order to develop a chromium-free pre-treatment method for electroless Ni-P (ENP) plating on magnesium alloy from an acidic plating bath, several various pickling and activation processes were studied in the present work. The surface morphologies of the matrix before and after etching or activation as well as the surface and cross sectional appearance of the Ni-P coatings were observed by scanning electronic microscope (SEM), while the elemental compositions were detected by energy dispersive X-ray spectroscopy (EDS). Those surface characterizations along with the scribe and grid testing results showed that the coatings obtained from etching only in H3PO4 solution display poor adhesion due to the existance of an interlayer between the matrix and the coatings. When fluoride was added into the pickling solution, the adhesion of the Ni-P coatings was also unsatisfactory because of the bad mechanical interlocking. By comparison, the Ni-P coatings obtained from pickling in 400 cm3·dm−3 H3PO4 solution followed by 10 cm3·dm−3 HF activation exhibit good characteristics in both adhesion and anti corrosion. The polarization test in 3.5wt.% NaCl aqueous solution showed that the corrosion potential (Ecorr) and corrosion current density (Icorr) of the new achieved coatings increases positively from −1.65 V to −0.87 V and decreases remarkably from 2.09 mA⋅cm−2 to 3.58 μA⋅cm−2, respectively (both compared with the bare Mg alloy).

Formation and Structural Characterization of Electroless Ni-B-P Ternary Alloy Coatings

2014 ◽  
Vol 592-594 ◽  
pp. 385-390 ◽  
Author(s):  
P.G. Venkatakrishnan ◽  
S.S. Mohamed Nazirudeen ◽  
T.S.N. Sankara Narayanan
Keyword(s):  
Electroless Plating ◽  
Morphological Characteristics ◽  
Reducing Agents ◽  
Sodium Hypophosphite ◽  
Electron Microscopic ◽  
Plating Bath ◽  
Peak Broadening ◽  
Chloride Hexahydrate ◽  
Electroless Ni

The aim of the present investigation is to study the formation of electroless Ni-B-P alloy coatings and structural and morphological characterization of various coatings with different boron and phosphorous content. An alkaline plating bath with nickel chloride hexahydrate as the source of nickel ions and sodium borohydride and sodium hypophosphite as reducing agents were used for the formation of electroless Ni-B-P alloy coatings. The influence of changes in the concentrations of the reducing agents in the electroless plating bath on the chemical composition, structural and morphological characteristics of the coatings were studied. Scanning electron microscopic studies revealed that the surface morphology of Ni-B-P alloy coatings changed from corn cob-like structure to cauliflower-like structure with increasing borohydride concentration in electroless plating bath, whereas increase in hypophosphite concentration favoured sideway growth, thereby decreased the surface roughness of the Ni-B-P alloy coatings. The peak broadening in the X-Ray Diffraction profiles indicates the large reduction in the crystallite size of the electroless Ni-B-P alloy coatings with increasing boron content in the coating (i.e. for higher borohydride concentration in the plating bath).

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