scholarly journals Three-dimensional optical transfer functions in the aberration-corrected scanning transmission electron microscope

2014 ◽  
Vol 254 (2) ◽  
pp. 47-64 ◽  
Author(s):  
L. JONES ◽  
P.D. NELLIST
Keyword(s):  
Electron Microscope ◽  
Transmission Electron Microscope ◽  
Transfer Functions ◽  
Three Dimensional ◽  
Scanning Transmission Electron Microscope ◽  
Scanning Transmission Electron ◽  
Transmission Electron ◽  
Scanning Transmission ◽  
Optical Transfer ◽  
Aberration Corrected

Aberration-Corrected Scanning Transmission Electron Microscope (STEM) Through-Focus Imaging for Three-Dimensional Atomic Analysis of Bismuth Segregation on Copper [001]/33° Twist Bicrystal Grain Boundaries

2016 ◽  
Vol 22 (3) ◽  
pp. 679-689 ◽  
Author(s):  
Charles Austin Wade ◽  
Mark J. McLean ◽  
Richard P. Vinci ◽  
Masashi Watanabe
Keyword(s):  
Electron Microscope ◽  
Grain Boundaries ◽  
Transmission Electron Microscope ◽  
Three Dimensional ◽  
Depth Resolution ◽  
Scanning Transmission Electron Microscope ◽  
Scanning Transmission Electron ◽  
Transmission Electron ◽  
Scanning Transmission ◽  
Aberration Corrected

AbstractScanning transmission electron microscope (STEM) through-focus imaging (TFI) has been used to determine the three-dimensional atomic structure of Bi segregation-induced brittle Cu grain boundaries (GBs). With TFI, it is possible to observe single Bi atom distributions along Cu [001] twist GBs using an aberration-corrected STEM operating at 200 kV. The depth resolution is ~5 nm. Specimens with GBs intentionally inclined with respect to the microscope’s optic axis were used to investigate Bi segregant atom distributions along and through the Cu GB. It was found that Bi atoms exist at most once per Cu unit cell along the GB, meaning that no continuous GB film is present. Therefore, the reduced fracture toughness of this particular Bi-doped Cu boundary would not be caused by fracture of Bi–Bi bonds.

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