Effect of process conditions on the properties of surface-modified organic pigments encapsulated by UV-curable resins

2017 ◽  
Vol 134 (1) ◽  
pp. 44-58 ◽  
Author(s):  
O. A. Hakeim ◽  
A. A. Arafa ◽  
M. K. Zahran ◽  
L. A. W. Abdou
Keyword(s):  
Process Conditions ◽  
Uv Curable ◽  
Organic Pigments ◽  
Surface Modified

scholarly journals UV-Curable Nanocomposite Based on Methacrylic-Siloxane Resin and Surface-Modified TiO2 Nanocrystals

2015 ◽  
Vol 7 (28) ◽  
pp. 15494-15505 ◽  
Author(s):  
Chiara Ingrosso ◽  
Carola Esposito Corcione ◽  
Raffaella Striani ◽  
Roberto Comparelli ◽  
Marinella Striccoli ◽  
...  
Keyword(s):  
Tio2 Nanocrystals ◽  
Uv Curable ◽  
Surface Modified

Flexible Micro-Structured Mold for UV Micro-Casting of Polymeric Microdevices

2009 ◽  
Vol 74 ◽  
pp. 7-10
Author(s):  
L.P. Yeo ◽  
L. Wang ◽  
Zhi Ping Wang ◽  
Yee Cheong Lam
Keyword(s):  
Silicone Rubber ◽  
First Generation ◽  
Potential Method ◽  
Production Method ◽  
Process Conditions ◽  
Uv Curable ◽  
Crosslinked Polymer ◽  
Photosensitive Resin ◽  
Uv Curable Resin ◽  
Silicone Rubber Mold

UV micro-casting is a promising mass production method for replication of polymeric microdevices due to the non-stringent process conditions and fast curing time. This paper describes a potential method to mass produce polymeric microdevices. The first generation mold for UV micro-casting was fabricated by using chemically micro-etched copper clad laminate (CCL) base substrate. Subsequently a two part silicone rubber was cast over the CCL micro-feature mold. Photosensitive resin was dispensed onto the silicone rubber mold and a transparent Mylar thin film was placed on top of the UV curable prepolymer. After the silicone rubber mold-resin-Mylar assembly was UV irradiated for tens of seconds, the crosslinked polymer, together with the Mylar film was peeled off from the mold. The cross-linked polymer was placed on top of a second layer of Mylar film dispensed with the similar UV curable resin. In this way, a complete polymeric micro device could be efficiently produced.

scholarly journals Interfacial Interactions during Demolding in Nanoimprint Lithography

Micromachines ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 349
Author(s):  
Mingjie Li ◽  
Yulong Chen ◽  
Wenxin Luo ◽  
Xing Cheng
Keyword(s):  
Nanoimprint Lithography ◽  
Process Conditions ◽  
Mold Surface ◽  
Interfacial Interactions ◽  
Friction Forces ◽  
Uv Curable ◽  
Structured Materials ◽  
Thermal Expansion Coefficients ◽  
Defect Control ◽  
Commercial Applications

Nanoimprint lithography (NIL) is a useful technique for the fabrication of nano/micro-structured materials. This article reviews NIL in the field of demolding processes and is divided into four parts. The first part introduces the NIL technologies for pattern replication with polymer resists (e.g., thermal and UV-NIL). The second part reviews the process simulation during resist filling and demolding. The third and fourth parts discuss in detail the difficulties in demolding, particularly interfacial forces between mold (template) and resist, during NIL which limit its capability for practical commercial applications. The origins of large demolding forces (adhesion and friction forces), such as differences in the thermal expansion coefficients (CTEs) between the template and the imprinted resist, or volumetric shrinkage of the UV-curable polymer during curing, are also illustrated accordingly. The plausible solutions for easing interfacial interactions and optimizing demolding procedures, including exploring new resist materials, employing imprint mold surface modifications (e.g., ALD-assisted conformal layer covering imprint mold), and finetuning NIL process conditions, are presented. These approaches effectively reduce the interfacial demolding forces and thus lead to a lower defect rate of pattern transfer. The objective of this review is to provide insights to alleviate difficulties in demolding and to meet the stringent requirements regarding defect control for industrial manufacturing while at the same time maximizing the throughput of the nanoimprint technique.

Characterisation and application of pigmented UV-curable inkjet inks

2018 ◽  
Vol 47 (2) ◽  
pp. 164-172 ◽  
Author(s):  
Osama Abdel Hakeim ◽  
Asmaa Ahmed Arafa ◽  
Magdy Kandil Zahran ◽  
Laila Abdel Wahab Abdou
Keyword(s):  
Environmental Protection Agency ◽  
Low Cost ◽  
Rheological Behaviour ◽  
Ultra Violet ◽  
Green Technology ◽  
Component Ratio ◽  
Nozzle Clogging ◽  
Uv Curable ◽  
Content Type ◽  
Organic Pigments

Purpose The purpose of this paper is to prepare ultra-violet (UV)-curable inkjet inks for textile printing application. The influence of both type and component ratio of monomer/oligomer on the quality of the desired viscosity range is studied. Moreover, the effect of pigment/resin ratio on the rheological behaviour of the ink has been studied. Design/methodology/approach Aqueous dispersions of nanoscale organic pigments were prepared through ball milling and ultrasonication. The dispersed pigments were encapsulated into UV-curable resin via miniemulsion technique, using different types and component ratios of monomers and oligomers. Findings It was found that the monomer/oligomer ratio of 2:3 and the pigment/resin ratio of 2:1 gave the most stable miniemulsion dispersions and provided the most suitable rheological range for inkjet printing inks. Research limitations/implications As the rheology of the ink is optimised, most of the problems associated with the jetting process could be avoided. Practical implications This method of using UV-curable encapsulated inks eliminates the usage of binders, which are the principal factor for nozzle clogging of the print head. In addition, binders are responsible for the coarse handle of the printed textiles. Social implications The UV-curable inks were viewed as a green technology by the US Environmental Protection Agency. Originality/value This method is simple and fast and requires low cost. In addition, it could find numerous applications in surface coating.

Study on the UV Curing Reactivity of Micro-Injection UV-Curing Molding

2018 ◽  
Vol 777 ◽  
pp. 65-69
Author(s):  
Jia Wei Li ◽  
Jian Yun He ◽  
Xi Dan Luo ◽  
Chang Song Zhao ◽  
Peng Cheng Xie ◽  
...  
Keyword(s):  
Uv Light ◽  
Uv Curing ◽  
Process Conditions ◽  
Uv Curable ◽  
Functional Monomers ◽  
Molding Method ◽  
Curing Reaction ◽  
Double Bond Conversion ◽  
Light Curing ◽  
Kinetics Of

In this paper, UV irradiation curing technology is used in the processing and manufacturing of micro structure parts and a micro-injection molding method of UV-curable molding was proposed to process microstructures. The special material for UV light curing injection of microstructural products was developed. The light curing reactivity of the micro injection light curing special material and its effect on the processing molding are studied. The kinetics of light curing reaction of UV curing injecting material were studied by online infrared spectroscopy (RT-IR). The contribution of mono functional monomers to the double bond conversion rate of microstructures is higher than that of high functional monomers. Under the same condition, the mono functional monomer can make the UV curing reaction more complete. Under the same process conditions, the rate of UV curing reaction of high functional monomers is higher than that of mono functional monomers.

Dispersibility and Charge Property of Different Surface Modified Titanium Dioxide as Electrophoretic Particles

2006 ◽  
Vol 11-12 ◽  
pp. 563-566
Author(s):  
Xu Hui Peng ◽  
Yuan Le ◽  
Shu Guang Bian ◽  
Wo Yuan Li ◽  
Kuang Yang ◽  
...  
Keyword(s):  
Titanium Dioxide ◽  
Photoelectron Spectroscopy ◽  
Inorganic Material ◽  
Particle Surface ◽  
Process Conditions ◽  
X Ray ◽  
Charge Property ◽  
Ft Ir ◽  
Materials Used ◽  
Surface Modified

To prepare stable electrophoretic ink (E Ink) contains titanium dioxide particles, oil soluble red, dispersant and tetrachloroethylene (TCE), the modification of organic and inorganic material onto the particle surface was investigated. Modified particles were characterized by measurement of X-ray photoelectron spectroscopy (XPS) and Fourier transform infrared spectroscopy (FT-IR) to confirm the composites and structures. The electrophoretic properties of sample in TCE were investigated by static sedimentation experiment and electrophoresis instrument. The type of inorganic and organic materials used for the surface modification influence dispersibility and charge property of particles. On the whole, organic modified particles especially modified by anionic surfactant show better properties. The process conditions were investigated in detail using SDBS as the modifier. The dispersibility and charge property have significantly improved in optimized modifying condition that the proportion of surfactant is 15%, pH is 6 and reaction time is 1 hour which means SDBS modified TiO2 is suitable for electrophoretic particles.

Electron microscopy study of reactively sputter-deposited Ti/N films on silicon

1992 ◽  
Vol 50 (2) ◽  
pp. 1362-1363
Author(s):  
V. C. Kannan ◽  
A. K. Singh ◽  
R. B. Irwin ◽  
S. Chittipeddi ◽  
F. D. Nkansah ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Large Scale ◽  
Hexagonal Phase ◽  
Microscopy Study ◽  
Electron Microscopy Study ◽  
Process Conditions ◽  
Tin Films ◽  
Wide Range ◽  
Fcc Phase ◽  
Circuits Vlsi

Titanium nitride (TiN) films have historically been used as diffusion barrier between silicon and aluminum, as an adhesion layer for tungsten deposition and as an interconnect material etc. Recently, the role of TiN films as contact barriers in very large scale silicon integrated circuits (VLSI) has been extensively studied. TiN films have resistivities on the order of 20μ Ω-cm which is much lower than that of titanium (nearly 66μ Ω-cm). Deposited TiN films show resistivities which vary from 20 to 100μ Ω-cm depending upon the type of deposition and process conditions. TiNx is known to have a NaCl type crystal structure for a wide range of compositions. Change in color from metallic luster to gold reflects the stabilization of the TiNx (FCC) phase over the close packed Ti(N) hexagonal phase. It was found that TiN (1:1) ideal composition with the FCC (NaCl-type) structure gives the best electrical property.

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